TWI810357B - 基板處理方法 - Google Patents

基板處理方法 Download PDF

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Publication number
TWI810357B
TWI810357B TW108131862A TW108131862A TWI810357B TW I810357 B TWI810357 B TW I810357B TW 108131862 A TW108131862 A TW 108131862A TW 108131862 A TW108131862 A TW 108131862A TW I810357 B TWI810357 B TW I810357B
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TW
Taiwan
Prior art keywords
substrate
front surface
processing
edge
substrate according
Prior art date
Application number
TW108131862A
Other languages
English (en)
Chinese (zh)
Other versions
TW202025242A (zh
Inventor
姜浩莫
安東 Ｊ 德維利耶
科里 萊姆利
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202025242A publication Critical patent/TW202025242A/zh
Application granted granted Critical
Publication of TWI810357B publication Critical patent/TWI810357B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/165—Monolayers, e.g. Langmuir-Blodgett
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • B05D1/322—Removable films used as masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B05D5/083—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B17/00—Methods preventing fouling
    • B08B17/02—Preventing deposition of fouling or of dust
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/167—Coating processes; Apparatus therefor from the gas phase, by plasma deposition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Saccharide Compounds (AREA)
  • Laminated Bodies (AREA)
TW108131862A 2018-09-04 2019-09-04 基板處理方法 TWI810357B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862726605P 2018-09-04 2018-09-04
US62/726,605 2018-09-04

Publications (2)

Publication Number Publication Date
TW202025242A TW202025242A (zh) 2020-07-01
TWI810357B true TWI810357B (zh) 2023-08-01

Family

ID=69641094

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108131862A TWI810357B (zh) 2018-09-04 2019-09-04 基板處理方法

Country Status (6)

Country Link
US (1) US11460775B2 (cg-RX-API-DMAC7.html)
JP (1) JP7317320B2 (cg-RX-API-DMAC7.html)
KR (1) KR102798427B1 (cg-RX-API-DMAC7.html)
CN (1) CN112638547A (cg-RX-API-DMAC7.html)
TW (1) TWI810357B (cg-RX-API-DMAC7.html)
WO (1) WO2020086164A2 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12087580B2 (en) * 2021-08-30 2024-09-10 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing semiconductor devices
US12094716B2 (en) 2021-09-13 2024-09-17 Applied Materials, Inc. Chambers and coatings for reducing backside damage
US12288698B2 (en) * 2023-02-21 2025-04-29 Tokyo Electron Limited Methods for retaining a processing liquid on a surface of a semiconductor substrate
US12506019B2 (en) 2024-03-11 2025-12-23 Tokyo Electron Limited Wafer chuck designs and methods for retaining a processing liquid on a surface of a semiconductor wafer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180046086A1 (en) * 2016-08-12 2018-02-15 Inpria Corporation Methods of reducing metal residue in edge bead region from metal-containing resists
TW201824348A (zh) * 2016-09-23 2018-07-01 日商東京威力科創股份有限公司 塗布顯影方法及塗布顯影裝置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6461983B1 (en) 1999-08-11 2002-10-08 Micron Technology, Inc. Method for pretreating a substrate prior to application of a polymeric coat
US7601386B2 (en) * 2003-07-11 2009-10-13 Seiko Epson Corporation Process for forming a film, process for manufacturing a device, electro-optical device and electronic equipment
JP4179288B2 (ja) 2005-02-01 2008-11-12 セイコーエプソン株式会社 膜パターン形成方法
US7854873B2 (en) * 2005-06-10 2010-12-21 Obducat Ab Imprint stamp comprising cyclic olefin copolymer
KR100994920B1 (ko) 2008-06-05 2010-11-17 주식회사 소로나 기상 자기조립 단분자막 코팅장치
US8691331B2 (en) 2009-02-09 2014-04-08 Prashant D. Santan Surface modification of hydrophobic and/or oleophobic coatings
US8293658B2 (en) 2010-02-17 2012-10-23 Asm America, Inc. Reactive site deactivation against vapor deposition
US9078956B2 (en) * 2010-06-10 2015-07-14 Econous Systems Inc. Modification of biomedical polymers for prevention of fouling and clotting
JP2014157941A (ja) 2013-02-15 2014-08-28 Fujikura Ltd 有機薄膜トランジスタ及びその製造方法
JP6552009B2 (ja) 2013-12-17 2019-07-31 東京エレクトロン株式会社 基板への周期的オルガノシリケートまたは自己組織化モノレイヤのスピンオンコーティングのためのシステムおよび方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180046086A1 (en) * 2016-08-12 2018-02-15 Inpria Corporation Methods of reducing metal residue in edge bead region from metal-containing resists
TW201824348A (zh) * 2016-09-23 2018-07-01 日商東京威力科創股份有限公司 塗布顯影方法及塗布顯影裝置

Also Published As

Publication number Publication date
KR20210041094A (ko) 2021-04-14
TW202025242A (zh) 2020-07-01
CN112638547A (zh) 2021-04-09
JP2021535616A (ja) 2021-12-16
US20200073244A1 (en) 2020-03-05
US11460775B2 (en) 2022-10-04
JP7317320B2 (ja) 2023-07-31
WO2020086164A3 (en) 2020-06-18
KR102798427B1 (ko) 2025-04-23
WO2020086164A2 (en) 2020-04-30

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