JP2021535616A5 - - Google Patents
Info
- Publication number
- JP2021535616A5 JP2021535616A5 JP2021512227A JP2021512227A JP2021535616A5 JP 2021535616 A5 JP2021535616 A5 JP 2021535616A5 JP 2021512227 A JP2021512227 A JP 2021512227A JP 2021512227 A JP2021512227 A JP 2021512227A JP 2021535616 A5 JP2021535616 A5 JP 2021535616A5
- Authority
- JP
- Japan
- Prior art keywords
- front surface
- substrate
- depositing
- region
- onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862726605P | 2018-09-04 | 2018-09-04 | |
| US62/726,605 | 2018-09-04 | ||
| PCT/US2019/049508 WO2020086164A2 (en) | 2018-09-04 | 2019-09-04 | Method and system for prevention of metal contamination by using a self-assembled monolayer coating |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021535616A JP2021535616A (ja) | 2021-12-16 |
| JP2021535616A5 true JP2021535616A5 (cg-RX-API-DMAC7.html) | 2022-09-06 |
| JP7317320B2 JP7317320B2 (ja) | 2023-07-31 |
Family
ID=69641094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021512227A Active JP7317320B2 (ja) | 2018-09-04 | 2019-09-04 | 自己組織化単分子膜コーティングを使用することによる金属汚染の防止のための方法及びシステム |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11460775B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7317320B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102798427B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN112638547A (cg-RX-API-DMAC7.html) |
| TW (1) | TWI810357B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2020086164A2 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12087580B2 (en) * | 2021-08-30 | 2024-09-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of manufacturing semiconductor devices |
| US12094716B2 (en) | 2021-09-13 | 2024-09-17 | Applied Materials, Inc. | Chambers and coatings for reducing backside damage |
| US12288698B2 (en) * | 2023-02-21 | 2025-04-29 | Tokyo Electron Limited | Methods for retaining a processing liquid on a surface of a semiconductor substrate |
| US12506019B2 (en) | 2024-03-11 | 2025-12-23 | Tokyo Electron Limited | Wafer chuck designs and methods for retaining a processing liquid on a surface of a semiconductor wafer |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6461983B1 (en) | 1999-08-11 | 2002-10-08 | Micron Technology, Inc. | Method for pretreating a substrate prior to application of a polymeric coat |
| US7601386B2 (en) * | 2003-07-11 | 2009-10-13 | Seiko Epson Corporation | Process for forming a film, process for manufacturing a device, electro-optical device and electronic equipment |
| JP4179288B2 (ja) | 2005-02-01 | 2008-11-12 | セイコーエプソン株式会社 | 膜パターン形成方法 |
| US7854873B2 (en) * | 2005-06-10 | 2010-12-21 | Obducat Ab | Imprint stamp comprising cyclic olefin copolymer |
| KR100994920B1 (ko) | 2008-06-05 | 2010-11-17 | 주식회사 소로나 | 기상 자기조립 단분자막 코팅장치 |
| US8691331B2 (en) | 2009-02-09 | 2014-04-08 | Prashant D. Santan | Surface modification of hydrophobic and/or oleophobic coatings |
| US8293658B2 (en) | 2010-02-17 | 2012-10-23 | Asm America, Inc. | Reactive site deactivation against vapor deposition |
| US9078956B2 (en) * | 2010-06-10 | 2015-07-14 | Econous Systems Inc. | Modification of biomedical polymers for prevention of fouling and clotting |
| JP2014157941A (ja) | 2013-02-15 | 2014-08-28 | Fujikura Ltd | 有機薄膜トランジスタ及びその製造方法 |
| JP6552009B2 (ja) | 2013-12-17 | 2019-07-31 | 東京エレクトロン株式会社 | 基板への周期的オルガノシリケートまたは自己組織化モノレイヤのスピンオンコーティングのためのシステムおよび方法 |
| WO2018031896A1 (en) * | 2016-08-12 | 2018-02-15 | Inpria Corporation | Methods of reducing metal residue in edge bead region from metal-containing resists |
| JP6439766B2 (ja) * | 2016-09-23 | 2018-12-19 | 東京エレクトロン株式会社 | 塗布、現像方法及び塗布、現像装置 |
-
2019
- 2019-09-04 US US16/560,776 patent/US11460775B2/en active Active
- 2019-09-04 TW TW108131862A patent/TWI810357B/zh active
- 2019-09-04 KR KR1020217009302A patent/KR102798427B1/ko active Active
- 2019-09-04 JP JP2021512227A patent/JP7317320B2/ja active Active
- 2019-09-04 WO PCT/US2019/049508 patent/WO2020086164A2/en not_active Ceased
- 2019-09-04 CN CN201980056372.7A patent/CN112638547A/zh active Pending
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