JP7309552B2 - バッキング部材、超音波探触子 - Google Patents
バッキング部材、超音波探触子 Download PDFInfo
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- JP7309552B2 JP7309552B2 JP2019170747A JP2019170747A JP7309552B2 JP 7309552 B2 JP7309552 B2 JP 7309552B2 JP 2019170747 A JP2019170747 A JP 2019170747A JP 2019170747 A JP2019170747 A JP 2019170747A JP 7309552 B2 JP7309552 B2 JP 7309552B2
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- 239000000463 material Substances 0.000 title claims description 13
- 239000000523 sample Substances 0.000 title description 20
- 229920005989 resin Polymers 0.000 claims description 67
- 239000011347 resin Substances 0.000 claims description 67
- 239000004020 conductor Substances 0.000 claims description 21
- 239000007769 metal material Substances 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 15
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 14
- 229910052721 tungsten Inorganic materials 0.000 claims description 14
- 239000010937 tungsten Substances 0.000 claims description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 35
- 239000002184 metal Substances 0.000 description 35
- 239000000945 filler Substances 0.000 description 31
- 125000006850 spacer group Chemical group 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 16
- 239000011295 pitch Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 239000007921 spray Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000003745 diagnosis Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000001902 propagating effect Effects 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- WABPQHHGFIMREM-FTXFMUIASA-N lead-202 Chemical compound [202Pb] WABPQHHGFIMREM-FTXFMUIASA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- OWUGOENUEKACGV-UHFFFAOYSA-N [Fe].[Ni].[W] Chemical compound [Fe].[Ni].[W] OWUGOENUEKACGV-UHFFFAOYSA-N 0.000 description 1
- DHVVWBRBHPFKTM-UHFFFAOYSA-N [W+4].[Si]([O-])([O-])([O-])[O-].[K+].[Al+3].[Si]([O-])([O-])([O-])[O-] Chemical compound [W+4].[Si]([O-])([O-])([O-])[O-].[K+].[Al+3].[Si]([O-])([O-])([O-])[O-] DHVVWBRBHPFKTM-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- IGLTYURFTAWDMX-UHFFFAOYSA-N boranylidynetungsten nickel Chemical compound [Ni].B#[W] IGLTYURFTAWDMX-UHFFFAOYSA-N 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- JHOPGIQVBWUSNH-UHFFFAOYSA-N iron tungsten Chemical compound [Fe].[Fe].[W] JHOPGIQVBWUSNH-UHFFFAOYSA-N 0.000 description 1
- FAYUQEZUGGXARF-UHFFFAOYSA-N lanthanum tungsten Chemical compound [La].[W] FAYUQEZUGGXARF-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- CGGMOWIEIMVEMW-UHFFFAOYSA-N potassium tungsten Chemical compound [K].[W] CGGMOWIEIMVEMW-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- DECCZIUVGMLHKQ-UHFFFAOYSA-N rhenium tungsten Chemical compound [W].[Re] DECCZIUVGMLHKQ-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/002—Devices for damping, suppressing, obstructing or conducting sound in acoustic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/0681—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/0681—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure
- B06B1/0685—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure on the back only of piezoelectric elements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Multimedia (AREA)
- Acoustics & Sound (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Description
[超音波探触子]
まず、第1実施形態に係るバッキング部材1を有する超音波探触子について説明する。
次に、第1実施形態に係るバッキング部材について説明する。
図7~図16は、第1実施形態に係るバッキング部材の製造工程を例示する図である。
第1実施形態の変形例では、リードの端部を拡幅する例を示す。なお、第1実施形態の変形例において、既に説明した実施形態と同一構成部品についての説明は省略する場合がある。
1a 積層部材
2 超音波探触子
5 リードフレーム
5x、30x、32x、40x ガイド穴
6 積層体
7 貫通穴
10 金属板
12a 第1レジスト層
12b 第2レジスト層
14 外枠
20、20A リード
22 端子部
24 配線部
30 下側支持板
32 上側支持板
32a、40a 開口部
34 高さ調整ストッパ
40 スペーサ
50 樹脂層
52 フィラー
60 圧電素子
62 音響整合層
70 配線基板
72 接続電極
Claims (9)
- 樹脂層と、
前記樹脂層に埋設され、前記樹脂層の一方の面から前記一方の面の反対面である他方の面に貫通する複数の線状導体と、を有し、
各々の前記線状導体は、超音波を遮音する性質を有する金属材料を含有し、
各々の線状導体は、互いに非接触であり、
各々の前記線状導体は、複数の屈曲部又は湾曲部を有し、
隣接する前記線状導体の一方が有する前記屈曲部又は湾曲部の凸領域は、隣接する前記線状導体の他方が有する前記屈曲部又は湾曲部の凹領域に入り込んでいるバッキング部材。 - 各々の隣接する前記線状導体の間の距離は、略一定である請求項1に記載のバッキング部材。
- 各々の前記線状導体は、同一形状である請求項1又は2に記載のバッキング部材。
- 各々の前記線状導体は、ジグザグ状又は波状に形成されている請求項1乃至3の何れか一項に記載のバッキング部材。
- 前記金属材料は、タングステン、金、白金、パラジウム、ルテニウムの何れか1つ以上を含む請求項1乃至4の何れか一項に記載のバッキング部材。
- 各々の前記線状導体の表面は、タングステンを含むめっき膜により被覆されている請求項5に記載のバッキング部材。
- 前記めっき膜は、ニッケルタングステンめっき膜である請求項6に記載のバッキング部材。
- 各々の前記線状導体は、タングステンを含む材料により形成されている請求項5に記載のバッキング部材。
- 請求項1乃至8の何れか一項に記載のバッキング部材と、
前記バッキング部材の上に配置され、各々の前記線状導体に接続された圧電素子と、
前記圧電素子の上に配置された音響整合層と、を有する超音波探触子。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019170747A JP7309552B2 (ja) | 2019-09-19 | 2019-09-19 | バッキング部材、超音波探触子 |
US17/019,545 US11415560B2 (en) | 2019-09-19 | 2020-09-14 | Backing member and ultrasonic probe |
EP20196522.5A EP3796307B1 (en) | 2019-09-19 | 2020-09-16 | Backing member and ultrasonic probe |
Applications Claiming Priority (1)
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---|---|---|---|
JP2019170747A JP7309552B2 (ja) | 2019-09-19 | 2019-09-19 | バッキング部材、超音波探触子 |
Publications (3)
Publication Number | Publication Date |
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JP2021048529A JP2021048529A (ja) | 2021-03-25 |
JP2021048529A5 JP2021048529A5 (ja) | 2022-03-03 |
JP7309552B2 true JP7309552B2 (ja) | 2023-07-18 |
Family
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JP2019170747A Active JP7309552B2 (ja) | 2019-09-19 | 2019-09-19 | バッキング部材、超音波探触子 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11415560B2 (ja) |
EP (1) | EP3796307B1 (ja) |
JP (1) | JP7309552B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115138547A (zh) * | 2022-06-30 | 2022-10-04 | 中国工程物理研究院电子工程研究所 | 压电微机械超声换能器背衬材料、制备方法及填充方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003324798A (ja) | 2002-05-02 | 2003-11-14 | Aloka Co Ltd | 超音波探触子及び背面部材の製造方法 |
JP2017208772A (ja) | 2016-05-20 | 2017-11-24 | 新光電気工業株式会社 | バッキング部材及びその製造方法と超音波探触子 |
Family Cites Families (5)
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---|---|---|---|---|
US2881336A (en) * | 1956-05-04 | 1959-04-07 | Sperry Prod Inc | Damping means for piezo-electric crystals |
US5267221A (en) | 1992-02-13 | 1993-11-30 | Hewlett-Packard Company | Backing for acoustic transducer array |
US5592730A (en) * | 1994-07-29 | 1997-01-14 | Hewlett-Packard Company | Method for fabricating a Z-axis conductive backing layer for acoustic transducers using etched leadframes |
JP2002257896A (ja) * | 2001-02-28 | 2002-09-11 | Mitsubishi Materials Corp | コンタクトプローブ及びプローブ装置 |
US11471911B2 (en) * | 2016-05-16 | 2022-10-18 | Baker Hughes, A Ge Company, Llc | Phased array ultrasonic transducer and method of manufacture |
-
2019
- 2019-09-19 JP JP2019170747A patent/JP7309552B2/ja active Active
-
2020
- 2020-09-14 US US17/019,545 patent/US11415560B2/en active Active
- 2020-09-16 EP EP20196522.5A patent/EP3796307B1/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003324798A (ja) | 2002-05-02 | 2003-11-14 | Aloka Co Ltd | 超音波探触子及び背面部材の製造方法 |
JP2017208772A (ja) | 2016-05-20 | 2017-11-24 | 新光電気工業株式会社 | バッキング部材及びその製造方法と超音波探触子 |
Also Published As
Publication number | Publication date |
---|---|
US11415560B2 (en) | 2022-08-16 |
EP3796307A1 (en) | 2021-03-24 |
JP2021048529A (ja) | 2021-03-25 |
US20210088479A1 (en) | 2021-03-25 |
EP3796307B1 (en) | 2023-10-18 |
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