JP7309284B2 - processing equipment - Google Patents

Description

The present invention relates to a processing apparatus provided with a cleaning unit for cleaning a cooling water channel formed in a spindle housing.

A cutting device, for example, is used to cut a workpiece such as a semiconductor wafer and divide it into semiconductor chips. A cutting device includes a chuck table for holding a workpiece by suction, and a cutting unit for cutting the workpiece held by the chuck table.

The cutting unit has a cylindrical spindle. A cutting blade having an annular cutting edge is attached to one end of the spindle, and a rotational drive source such as a motor is connected to the other end of the spindle. When the rotary drive source is operated, the cutting blade rotates at high speed around the spindle.

A portion of the spindle is housed in a spindle housing in a rotatable manner. A cooling water passage is formed in the spindle housing to cool heat generated by the rotation of the spindle, and cooling water is supplied to the cooling water passage during rotation of the spindle (see, for example, Patent Document 1).

As cooling water, tap water, underground water, etc. may be used. When tap water, underground water, or the like is used as cooling water, fine foreign matter, bacteria, and the like accumulate in the cooling water passages, so it is desirable to clean the cooling water passages periodically. However, cleaning the cooling channels usually requires manual work by an operator.

For example, the operator separates the flow path connected to the cooling water supply from the cooling water path, connects the flow path connected to the cleaning water supply source to the cooling water path, and transfers the cleaning water from the cleaning water supply source to the cooling water path. to clean the cooling water passages. Thereafter, the operator separates the flow path connected to the cleaning water supply source from the cooling water flow path, and connects the cooling water flow path to the flow path connected to the cooling water supply source.

As described above, it takes a lot of time and effort to clean the cooling water passages, so in practice, the cooling water passages are often not cleaned. However, if foreign matter or the like accumulates in the cooling water passage, the cooling efficiency of the spindle housing is lowered, and there is a risk that the machining accuracy of the cutting unit will be deteriorated.

JP-A-2001-259961

SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and an object of the present invention is to reduce the labor of an operator when cleaning a cooling water channel.

According to one aspect of the present invention, the chuck has a chuck table on which a workpiece is held, a spindle on which a tool is mounted on one end, and a spindle housing that accommodates the spindle in a rotatable manner. A processing unit for processing the workpiece held by the table, a cleaning unit for cleaning a cooling water passage provided in the spindle housing and supplied with cooling water having a purity lower than that of pure water, and the cleaning. a control section for controlling the operation of the unit, the cleaning unit comprising: a cleaning water supply source that supplies cleaning water of higher purity than the cooling water; and a cleaning device that connects the cleaning water supply source and the cooling water passage. A processing apparatus is provided that includes a water bypass channel and a rinse water valve that controls the supply of the rinse water from the rinse water supply to the cooling channel.

Preferably, the control unit supplies the cleaning water to the cooling water channel by opening the cleaning water valve after the supply of the cooling water to the cooling water channel is stopped.

Preferably, the cleaning unit includes an air supply source for supplying air, an air bypass passage connecting the air supply source and the cooling water passage, and an air supply from the air supply source to the cooling water passage. and an air valve for controlling the

Moreover, preferably, the control unit supplies the air to the cooling water passage after the supply of the cleaning water to the cooling water passage is stopped.

A processing apparatus according to an aspect of the present invention includes a cleaning unit for cleaning a cooling water channel, and a control section for controlling the operation of the cleaning unit. The cleaning unit includes a cleaning water supply source that supplies cleaning water of higher purity than cooling water, a cleaning water bypass channel that connects the cleaning water supply source and the cooling water channel, and a cleaning water flow from the cleaning water supply source to the cooling channel. and a wash water valve that controls the supply of

The controller controls the opening and closing of the cleaning water valve, so that cleaning water having a purity higher than that of the cooling water is supplied from the cleaning water supply source to the cooling water path through the cleaning water bypass channel. As a result, the cleaning of the cooling water passage can be automatically performed, so that the labor required for the work by the operator can be reduced. In addition, it is possible to suppress deterioration in the machining accuracy of the cutting unit due to deterioration in cooling efficiency caused by accumulation of foreign matter in the cooling water passage.

It is a perspective view of a cutting device. It is a side view of a spindle housing etc. in a manufacturing process. FIG. 10 is a side view of the spindle housing and the like during a cleaning process; It is a side view of a spindle housing etc. in a drying process. FIG. 10 is a side view of the spindle housing and the like in a two-fluid cleaning process in the second embodiment;

An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. First, the grinding device (processing device) 2 used in the first embodiment will be described. FIG. 1 is a perspective view of the cutting device 2. FIG.

In FIG. 1, for convenience of explanation, the housing 2a of the cutting device 2 is indicated by broken lines, and some of the constituent elements are indicated by functional blocks. The X-axis direction (processing feed direction) and the Y-axis direction (indexing feed direction) shown in FIG.

The cutting device 2 includes a base 4 that supports each component. The cutting device 2 includes a base 4 that supports each component. An opening 4 a is provided at the front (one side in the Y-axis direction) corner of the base 4 . A cassette elevator 6a that ascends and descends along the height direction (Z-axis direction) of the cutting device 2 is provided in the opening 4a.

A cassette 6b containing a plurality of workpieces 11 is placed on the upper surface of the cassette elevator 6a. In addition, in FIG. 1, the contour of the cassette 6b is indicated by a dashed line. The workpiece 11 is, for example, a disk-shaped wafer made of a semiconductor material such as silicon.

The surface side of the workpiece 11 is partitioned into a plurality of regions by a plurality of division lines (street) that cross each other. Devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are formed in each region.

The material, shape, structure, size, etc. of the workpiece 11 are not limited. For example, a substrate or the like made of other materials such as semiconductors, ceramics, resins, and metals can also be used as the workpiece 11 . Similarly, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the device. Devices may not be formed on the workpiece 11 .

A dicing tape 13 having a diameter larger than that of the workpiece 11 is attached to the back side of the workpiece 11 . The work piece 11 is attached to the center portion of the dicing tape 13 in the radial direction.

The dicing tape 13 has a laminated structure of, for example, a base layer made of a resin such as polyolefin and an adhesive layer made of an ultraviolet curable resin or the like. The adhesive layer exerts a strong adhesive force to the workpiece 11 and the like, but when irradiated with ultraviolet rays, it hardens and loses the adhesive force.

The dicing tape 13 does not necessarily have a laminated structure of a base material layer and an adhesive layer. The dicing tape 13 may have only the base layer. In this case, the dicing tape 13 is attached to the back side of the workpiece 11 by, for example, thermocompression bonding.

One surface of an annular frame 15 made of metal is fixed to the outer peripheral portion of the dicing tape 13 , and the workpiece 11 , the dicing tape 13 and the frame 15 constitute a workpiece unit 17 . In this manner, the workpiece 11 is accommodated in the cassette 6b in the state of the workpiece unit 17 supported by the frame 15 via the dicing tape 13. As shown in FIG.

An opening 4b elongated in the X-axis direction is formed behind the cassette elevator 6a (the other in the Y-axis direction). A table cover and a bellows-shaped cover are arranged in the opening 4b. A ball screw type X-axis movement mechanism (processing feed unit) (not shown) is arranged below the table cover and the bellows-shaped cover.

A chuck table 10 is provided above the table cover. The chuck table 10 is movable along the X-axis direction together with the table cover by the X-axis movement mechanism. The chuck table 10 is connected to a rotation drive source (not shown) such as a motor, and is rotatable around a rotation axis substantially parallel to the Z-axis direction (vertical direction).

The chuck table 10 has a disk-shaped frame made of metal. Four clamps for mechanically fixing the frame 15 of the workpiece unit 17 from four sides are provided on the outer periphery of the frame of the chuck table 10 .

A concave portion, which is a disk-shaped space, is formed in the central portion of the frame. A disk-shaped porous plate made of porous ceramics or the like having pores is fixed to the concave portion. The pores of the porous plate are connected to suction means (not shown) such as an ejector through channels (not shown) formed inside the chuck table 10 .

When negative pressure is generated by the suction means, negative pressure is generated on the upper surface of the porous plate. After placing the workpiece unit 17 on the upper surface (holding surface) of the chuck table 10 so that the workpiece 11 is exposed upward, the workpiece unit 17 (that is, , the workpiece 11) is sucked and held by the chuck table 10. As shown in FIG.

A pair of guide rails 12 that are substantially parallel to the Y-axis direction are provided on a portion of the opening 4b behind the cassette elevator 6a (the other in the Y-axis direction). A pair of guide rails 12 align the workpiece unit 17 taken out from the cassette 6b to a predetermined position in the X-axis direction.

A gate-shaped support 4 c is provided on the left side (one side in the X-axis direction) of the pair of guide rails 12 . The support 4c is provided on the base 4 so as to straddle the opening 4b in the X-axis direction. A transport unit 14 for transporting a workpiece unit 17 is provided on one surface (side surface on the other side in the X-axis direction) of the support 4c.

The transport unit 14 has an air cylinder 14a arranged along the Z-axis direction. The air cylinder 14a is moved along the Y-axis direction by the moving mechanism 16. As shown in FIG. The moving mechanism 16 includes a rail provided substantially parallel to the Y-axis direction on one side of the support 4c.

A rod 14b protrudes from the lower end of the air cylinder 14a. The rod 14b is moved along the Z-axis direction by controlling the intake and exhaust of the air cylinder 14a. A holding mechanism 14c is provided at the lower end of the rod 14b.

A plurality of suction pads 14d capable of sucking the frame 15 of the workpiece unit 17 are provided on the bottom side of the holding mechanism 14c. A gripping mechanism 14e for gripping the frame 15 is provided at the front end (one side in the Y-axis direction) of the holding mechanism 14c.

On the side opposite to the transport unit 14 with respect to the support 4c, a gate-shaped support 4d is provided across the opening 4b. A pair of processing unit moving mechanisms (index feed unit, cut feed unit) 18 are provided on the upper part of the support 4d.

Each processing unit moving mechanism 18 has a pair of Y-axis guide rails (not shown) provided substantially parallel to the Y-axis direction on one surface of the support 4d on the side of the support 4c (side surface on the other side in the X-axis direction). Prepare. A Y-axis moving plate 18a constituting each processing unit moving mechanism 18 is attached to the pair of Y-axis guide rails so as to be slidable in the Y-axis direction.

A nut portion (not shown) is provided on the Y-axis moving plate 18a on the side of the support 4d (that is, one side in the X-axis direction). A shaft ball screw (not shown) is rotatably connected.

A Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw. When the Y-axis pulse motor rotates the Y-axis ball screw, the Y-axis moving plate 18a moves in the Y-axis direction along the Y-axis guide rail.

A pair of Z-axis guide rails (not shown) substantially parallel to the Z-axis direction are provided on the Y-axis moving plate 18a on the side of the support 4c (that is, on the other side in the X-axis direction). A Z-axis moving plate (not shown) is slidably attached to the pair of Z-axis guide rails.

A nut portion (not shown) is provided on the side of the support 4d of the Z-axis moving plate (that is, one side in the X-axis direction), and this nut portion has a Z-axis ball screw parallel to the Z-axis guide rail. (not shown) are connected in a rotatable manner.

A Z-axis pulse motor 18b is connected to the upper end of the Z-axis ball screw. When the Z-axis ball screw is rotated by the Z-axis pulse motor 18b, the Z-axis movement plate moves in the Z-axis direction along the Z-axis guide rail.

A cutting unit (processing unit) 20 for cutting the workpiece 11 is provided below each Z-axis moving plate. In this embodiment, a pair of cutting units 20 are provided so as to face each other in the Y-axis direction.

As shown in FIG. 2, the cutting unit 20 has a cylindrical spindle housing 20a. The longitudinal portion of the spindle housing 20a is arranged along the Y-axis direction. A portion of a cylindrical spindle 20b is rotatably accommodated inside the spindle housing 20a.

One end of the spindle 20b is exposed from the spindle housing 20a, and an annular cutting blade (tool) 20c is attached to the one end of the spindle 20b. A rotational drive source (not shown) such as a motor is connected to the other end of the spindle 20b.

When the rotary drive source is operated, the cutting blade 20c rotates around the spindle 20b. At this time, heat is generated in the spindle housing 20a as the spindle 20b rotates.

A cooling water passage 20d is formed in the spindle housing 20a, and cooling water 32a is supplied to the cooling water passage 20d during rotation of the spindle 20b in order to cool the heat generated by the rotation of the spindle 20b.

Returning to FIG. 1, an imaging unit for imaging the workpiece 11 is provided at a position adjacent to the cutting unit 20 on the other side in the X-axis direction. The imaging unit includes a camera and the like, and the image of the workpiece 11 captured by the imaging unit is used for alignment between the workpiece 11 and the cutting unit 20, and the like.

An opening 4e is provided on the opposite side of the cassette elevator 6a from the opening 4b of the base 4. As shown in FIG. A spinner cleaning device 22 is provided in the opening 4e. The spinner cleaning device 22 has a spinner table that holds the workpiece 11 . Above the spinner table, a cleaning nozzle is provided for spraying a liquid such as pure water onto the workpiece 11 held by the spinner table.

The workpiece unit 17 positioned on the chuck table 10 is transported to the spinner table of the spinner cleaning device 22 by the transport unit 24 . The transport unit 24 has an arm extending along the X-axis direction from one surface (side surface on the other side in the X-axis direction) of the support 4c.

The arm of the transport unit 24 is moved along the Y-axis direction by a moving mechanism 26 including rails provided substantially parallel to the Y-axis direction on one side of the support 4c. An air cylinder 24a is provided along the Z-axis direction on the right side of the bottom of the arm.

A rod 24b protrudes from the lower end of the air cylinder 24a. The rod 24b is moved along the Z-axis direction by controlling the intake and exhaust of the air cylinder 24a. A holding mechanism 24c is provided at the lower end of the rod 24b. A plurality of suction pads 24d capable of sucking the frame 15 of the workpiece unit 17 are provided at the bottom of the holding mechanism 24c.

Next, the cooling water passage 20d and the like of the spindle housing 20a will be described in more detail with reference to FIGS. 1 and 2. FIG. In addition, in FIG. 2, for convenience of explanation, some of the components are shown in a functional block diagram, and water channels, flow paths, etc. are shown by lines.

A cooling water supply source 30 for supplying cooling water 32a to the spindle housing 20a is connected to the housing 2a. Cooling water supply source 30 includes a reservoir (not shown) in which water used as cooling water 32a is reserved, and a pump (not shown) for supplying cooling water 32a from the reservoir.

The cooling water 32a is water with a lower purity than pure water. The cooling water 32a is, for example, city water (ie, public tap water) or pumped water (ie, groundwater pumped up from underground). The cooling water 32a may be defined by electrical resistivity. The electrical resistivity of the cooling water 32a is, for example, 0.002 MΩ·cm or more and 0.02 MΩ·cm or less.

The cooling water supply source 30 is connected to the cooling water passage 20 d via the cooling water valve 34 . The cooling water valve 34 is, for example, an electromagnetic valve, and is controlled to open and close by a controller 60, which will be described later.

When the cooling water valve 34 is opened, the cooling water 32a is supplied from the cooling water supply source 30 to the cooling water passage 20d. The supply of the cooling water 32a to the water passage 20d is stopped.

The cooling water channel 20d includes a first channel _20d1 extending from the other end of the spindle 20b toward the one end, and a second channel _20d2 extending back to the other end after folding back at the one end of the spindle 20b. include. The first flow path _20d1 and the second flow path _20d2 are connected at one end of the spindle 20b.

The cooling water channel 20d of this embodiment is composed of a plurality of pairs of _the first channel 20d- ₁ and the second channel 20d- ₂ . Road _20d2 is shown. The cooling water 32a supplied from the cooling water supply source 30 to the cooling water path 20d passes through the first flow path _20d1 and the second flow path _20d2 , and is then reused as the cooling water 32a through a filter or the like. Or discarded.

A cleaning water supply source 40 is connected to the housing 2a. The cleaning water supply source 40 supplies a storage tank (not shown) in which water (pure water in this embodiment) used as cleaning water 42a (see FIG. 3) is stored, and the cleaning water 42a from the storage tank. a pump (not shown) for

Pure water is water of higher purity than the cooling water 32a described above, and contains fewer impurities than the cooling water 32a. Pure water is obtained, for example, by filtering city water, pumped water, or the like with a filter to obtain clear water, and then treating the clear water with an ion-exchange resin.

Pure water is sometimes called distilled water, demineralized water, purified water, RO water, or deionized water. If defined in terms of electrical resistivity, the electrical resistivity of pure water is, for example, 0.1 MΩ·cm or more and 15 MΩ·cm or less.

The cleansing water supply source 40 is connected to the cleansing water bypass channel 42 via a cleansing water valve 44 . The wash water bypass channel 42 of the present embodiment is connected to the cooling water channel 20d at a first connecting portion 36 positioned downstream from the cooling water supply source 30 and upstream from the first channel _20d1 .

The wash water valve 44 is, for example, an electromagnetic valve, and is controlled to open and close by a controller 60, which will be described later. When the cleaning water valve 44 is opened, cleaning water 42a is supplied from the cleaning water supply source 40 to the cooling water passage 20d, and when the cleaning water valve 44 is closed, cooling is supplied from the cleaning water supply source 40. The supply of washing water 42a to water channel 20d is stopped.

In the present embodiment, the cooling water passage 20d is washed by supplying the cooling water passage 20d with cleaning water 42a having a purity higher than that of the cooling water 32a. Therefore, it is possible to prevent the deterioration of the machining accuracy of the cutting unit 20 due to the deterioration of the cooling efficiency due to the accumulation of foreign matter in the cooling water passage 20d.

Further, as described above, the cleaning water supply source 40 is connected to the cooling water channel 20d via the cleaning water bypass channel 42. As shown in FIG. Therefore, it is necessary for the operator to separate the flow path connected to the cooling water supply source 30 from the cooling water path 20d and connect the flow path connected to the cleaning water supply source 40 to the cooling water path 20d. do not have.

In the present embodiment, the control unit 60 closes the cooling water valve 34 and then opens the cleaning water valve 44, thereby automatically cleaning the cooling water passage 20d. Therefore, it is possible to reduce the labor of the operator when cleaning the cooling water channel 20d.

An air supply source 50 is connected to the housing 2a. The air supply source 50 is, for example, a dry air supply device, which removes foreign matter from the air taken in from the atmosphere with a filter and further removes moisture from the air with a dryer to obtain dried air 52a (see FIG. 4). ).

An air supply source 50 is connected to an air bypass flow path 52 via an air valve 54 . The air bypass channel 52 of the present embodiment is connected to the cooling water channel 20d at the second connecting portion 38 positioned downstream from the cleaning water supply source 40 and upstream from the first channel _20d1 .

That is, the air bypass channel 52 is connected to the washing water bypass channel 42 via the cooling water channel 20d. The air bypass channel 52 may be connected to the upstream side of the cooling water channel 20 d rather than the cleaning water bypass channel 42 .

The air valve 54 is, for example, an electromagnetic valve, and its opening and closing is controlled by a control section 60, which will be described later. When the air valve 54 is opened, air 52a is supplied from the air supply source 50 to the cooling water passage 20d, and when the air valve 54 is closed, air is supplied from the air supply source 50 to the cooling water passage 20d. 52a supply is stopped. The air 52a is used, for example, to dry the cooling water passage 20d washed with the washing water 42a.

In this embodiment, the air supply source 50 is connected to the cooling water channel 20d through the air bypass channel 52. As shown in FIG. Therefore, in order to dry the cooling water passage 20d, the flow passage connected to the cooling water supply source 30 is separated from the cooling water passage 20d, and the flow passage connected to the air supply source 50 is connected to the cooling water passage 20d. There is no need for a worker to do the work.

In the present embodiment, the control unit 60 closes the cooling water valve 34 and the cleaning water valve 44, and then opens the air valve 54, thereby automatically drying the cooling water passage 20d. can be done. Therefore, it is possible to reduce the labor of the operator when cleaning the cooling water channel 20d.

The cleaning water supply source 40, the cleaning water bypass channel 42, the cleaning water valve 44, the air supply source 50, the air bypass channel 52, and the air valve 54 described above are each a cleaning unit 56 for cleaning the cooling water channel 20d. configure.

The operation of each component such as the cassette elevator 6a, the transfer units 14 and 24, the processing unit moving mechanism 18, the spinner cleaning device 22, the cooling water valve 34, the cleaning water valve 44, the air valve 54, etc. is controlled by the control unit 60. controlled.

The control unit 60 is configured by a computer including, for example, a processing device such as a CPU (Central Processing Unit), a main storage device such as a DRAM (Dynamic Random Access Memory), and an auxiliary storage device such as a flash memory. . The functions of the control unit 60 are realized by operating the processing device (hardware resource) and the like according to the software stored in the auxiliary storage device.

Here, a procedure for cutting (machining) the workpiece 11 using the cutting device 2 will be briefly described. First, the gripping mechanism 14 e of the transport unit 14 carries out the workpiece unit 17 from the cassette 6 b onto the pair of guide rails 12 .

After adjusting the position of the workpiece unit 17 in the X-axis direction with the pair of guide rails 12 , the frame 15 is attracted by the holding mechanism 14 c of the transport unit 14 , and the workpiece unit 17 is moved from the pair of guide rails 12 . Transfer to chuck table 10 .

Next, the chuck table 10 holds the workpiece unit 17 (the workpiece 11 ) and positions the chuck table 10 directly below the cutting unit 20 . Then, after imaging the surface side of the workpiece 11 by the imaging unit and performing alignment, the workpiece 11 is cut (processed) by the cutting unit 20 (processing step).

FIG. 2 is a side view of the spindle housing 20a and the like during the machining process. In the machining process, cooling water 32a is supplied from the cooling water supply source 30 to the cooling water passage 20d to cool the spindle housing 20a. After the machining process, the workpiece unit 17 is transferred from the chuck table 10 to the spinner cleaning device 22 by the transfer unit 24 .

The workpiece unit 17 cleaned and dried by the spinner cleaning device 22 is carried into the cassette 6b. After the predetermined number of workpieces 11 have been machined, the spindle 20b and the like are stopped, and the supply of the cooling water 32a to the cooling water passage 20d is also stopped.

Next, a method for cleaning the cooling water passage 20d will be described. The cleaning of the cooling water channel 20d is performed, for example, before cutting (machining) the first workpiece 11 housed in the cassette 6b. The cooling water passage 20d may be cleaned periodically (for example, once a month) or at a predetermined timing (for example, when the cutting device 2 is turned on).

The timing for cleaning the cooling water channel 20d may be stored in advance in the control unit 60, and when an instruction is sent from the operator to the control unit 60 via an input/output device such as a touch panel, the control unit 60 is activated by the cleaning unit. 56 may be caused to clean the cooling water passage 20d. In any case, the cleaning of the cooling water passage 20d is performed after the supply of the cooling water 32a to the cooling water passage 20d is stopped.

The cleaning method of the cooling water channel 20d in this embodiment includes a cleaning process of cleaning the cooling water channel 20d with cleaning water 42a and a drying process of drying the cooling water channel 20d after the cleaning process with air 52a. FIG. 3 is a side view of the spindle housing 20a etc. in the cleaning process. Note that, in FIG. 3 as well, some of the constituent elements are indicated by functional blocks, and water channels, flow paths, etc. are indicated by lines.

In the cleaning process, the cooling water valve 34 and the air valve 54 are closed, and the cleaning water valve 44 is opened (open state). As a result, for example, at a pressure of 0.2 MPa and a predetermined flow rate of 0.2 l/min to 0.4 l/min, the washing water 42a at 24° C. is cooled from the washing water supply source 40 through the washing water bypass channel 42. It is supplied to the water channel 20d to clean the cooling water channel 20d.

After the cleaning process, the cleaning water valve 44 is further closed while the cooling water valve 34 remains closed, and the supply of the cleaning water 42a to the cooling water passage 20d is stopped. After that, the air valve 54 is opened, and air 52a is supplied from the air supply source 50 through the air bypass channel 52 to the cooling water channel 20d at a predetermined pressure of, for example, 0.2 MPa to 0.4 MPa.

Thereby, the cooling water passage 20d is dried by the air 52a (drying step). FIG. 4 is a side view of the spindle housing 20a etc. in the drying process. Note that, in FIG. 4 as well, some of the constituent elements are indicated by functional blocks, and water channels, flow paths, etc. are indicated by lines.

The washing process and the drying process may be performed multiple times in this order. By performing the cleaning process and the drying process a plurality of times, the foreign substances and the like accumulated in the cooling water channel 20d can be removed more reliably. In addition, when the cleaning process and the drying process are performed multiple times, the control unit 60 opens and closes each valve, which greatly reduces the manual labor of the operator.

Next, a second embodiment will be described. In the second embodiment, instead of the cleaning process described above, the cooling water passage 20d is cleaned with a two-fluid mixture of cleaning water 42a and air 52a (two-fluid cleaning process). FIG. 5 is a side view of the spindle housing 20a etc. in the two-fluid cleaning process in the second embodiment. Note that, in FIG. 5 as well, some of the constituent elements are indicated by functional blocks, and water channels, flow paths, etc. are indicated by lines.

In the two-fluid cleaning process, for example, the air valve 54 is opened while the cooling water valve 34 and the cleaning water valve 44 are closed, and then the cleaning water valve 44 is opened. As a result, the flow of the cleansing water 42a can be merged with the flow of the air 52a, so that the cleansing water 42a and the air 52a are more likely to be mixed than when the flow of the cleansing water 42a is merged with the air 52a. .

After the two-fluid cleaning process, the drying process is performed as in the first embodiment. Also in the second embodiment, the two-fluid cleaning process and the drying process may be performed multiple times in order. By performing this operation a plurality of times, it is possible to more reliably remove foreign substances and the like that have accumulated in the cooling water passage 20d. Further, when the two-fluid cleaning process and the drying process are performed a plurality of times, the control unit 60 opens and closes each valve, which can greatly reduce the manual labor of the operator.

In addition, the structures, methods, and the like according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. For example, the configuration of the cleaning unit 56 and the cleaning method described above are not limited to the cutting device 2, and can be applied to other processing devices such as a grinding device.

2 Cutting Device 4 Base 2a Housing 4a, 4b, 4e Opening 4c, 4d Support 6a Cassette Elevator 6b Cassette 10 Chuck Table 12 Guide Rail 14, 24 Transfer Unit 14a, 24a Air Cylinder 14b, 24b Rod 14c, 24c Holding Mechanism 14d, 24d suction pad 14e gripping mechanism 16, 26 moving mechanism 18 machining unit moving mechanism 18a Y-axis moving plate 18b Z-axis pulse motor 20 cutting unit (machining unit)
20a spindle housing 20b spindle 20c cutting blade (tool)
20d cooling water channel 20d ₁ first channel 20d ₂ second channel 22 spinner cleaning device 30 cooling water supply source 32a cooling water 34 cooling water valve 36 first connecting portion 38 second connecting portion 40 cleaning water supply source 42 cleaning water Bypass channel 42a Cleaning water 44 Cleaning water valve 50 Air supply source 52 Air bypass channel 52a Air 54 Air valve 56 Cleaning unit 60 Control unit 11 Work piece 13 Dicing tape 15 Frame 17 Work piece unit

Claims (4)

a chuck table on which the workpiece is held;
a machining unit having a spindle to which a tool is attached at one end and a spindle housing that accommodates the spindle in a rotatable manner, and machining the workpiece held by the chuck table;
a cleaning unit for cleaning a cooling water passage provided in the spindle housing and supplied with cooling water having a purity lower than that of pure water;
a control unit that controls the operation of the cleaning unit;
with
The cleaning unit includes a cleaning water supply source that supplies cleaning water having a purity higher than that of the cooling water, a cleaning water bypass channel that connects the cleaning water supply source and the cooling water channel, and a cleaning water supply source that supplies cleaning water to the cooling water channel. and a cleaning water valve for controlling supply of the cleaning water to a cooling water channel. The control unit supplies the washing water to the cooling water passage by opening the washing water valve after the supply of the cooling water to the cooling water passage is stopped. Item 1. The processing apparatus according to item 1. The cleaning unit includes an air supply source that supplies air, an air bypass passage that connects the air supply source and the cooling water passage, and an air supply that controls the supply of the air from the air supply source to the cooling water passage. 3. The processing apparatus of claim 2, further comprising a valve. 4. The processing apparatus according to claim 3, wherein the controller supplies the air to the cooling water passage after the supply of the washing water to the cooling water passage is stopped.

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