JP7303950B2 - 窒化ホウ素粉末及び樹脂組成物 - Google Patents

窒化ホウ素粉末及び樹脂組成物 Download PDF

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Publication number
JP7303950B2
JP7303950B2 JP2022575475A JP2022575475A JP7303950B2 JP 7303950 B2 JP7303950 B2 JP 7303950B2 JP 2022575475 A JP2022575475 A JP 2022575475A JP 2022575475 A JP2022575475 A JP 2022575475A JP 7303950 B2 JP7303950 B2 JP 7303950B2
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boron nitride
particles
boron
nitride powder
less
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Japanese (ja)
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JPWO2022202825A1 (https=
JPWO2022202825A5 (https=
Inventor
祐輔 佐々木
建治 宮田
智成 宮崎
貴子 新井
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C01B21/0648—After-treatment, e.g. grinding, purification
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Ceramic Products (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
JP2022575475A 2021-03-25 2022-03-22 窒化ホウ素粉末及び樹脂組成物 Active JP7303950B2 (ja)

Applications Claiming Priority (3)

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JP2021051878 2021-03-25
JP2021051878 2021-03-25
PCT/JP2022/013233 WO2022202825A1 (ja) 2021-03-25 2022-03-22 窒化ホウ素粉末及び樹脂組成物

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JPWO2022202825A1 JPWO2022202825A1 (https=) 2022-09-29
JPWO2022202825A5 JPWO2022202825A5 (https=) 2023-02-21
JP7303950B2 true JP7303950B2 (ja) 2023-07-05

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US (1) US20240217819A1 (https=)
JP (1) JP7303950B2 (https=)
KR (1) KR102945379B1 (https=)
CN (1) CN117043099B (https=)
TW (1) TWI869662B (https=)
WO (1) WO2022202825A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7796274B1 (ja) * 2025-03-31 2026-01-08 デンカ株式会社 窒化ホウ素粉末、及び無機フィラー
JP7804810B1 (ja) * 2025-03-31 2026-01-22 デンカ株式会社 窒化ホウ素粉末、無機フィラー及び窒化ホウ素粉末の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025137039A (ja) * 2024-03-08 2025-09-19 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物
JP2025137036A (ja) * 2024-03-08 2025-09-19 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014136959A1 (ja) 2013-03-07 2014-09-12 電気化学工業株式会社 窒化ホウ素粉末及びこれを含有する樹脂組成物
WO2016092952A1 (ja) 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP2017165609A (ja) 2016-03-15 2017-09-21 デンカ株式会社 六方晶窒化ホウ素の一次粒子凝集体、樹脂組成物及びその用途
WO2018012484A1 (ja) 2016-07-13 2018-01-18 積水化学工業株式会社 複合粒子及び液晶表示装置
JP2018052782A (ja) 2016-09-30 2018-04-05 デンカ株式会社 六方晶窒化ホウ素一次粒子凝集体
JP2018104253A (ja) 2016-12-28 2018-07-05 デンカ株式会社 六方晶窒化ホウ素一次粒子凝集体及びその用途
JP2018115275A (ja) 2017-01-19 2018-07-26 積水化学工業株式会社 硬化性材料、硬化性材料の製造方法及び積層体
WO2020004600A1 (ja) 2018-06-29 2020-01-02 デンカ株式会社 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材
WO2020175377A1 (ja) 2019-02-27 2020-09-03 三菱ケミカル株式会社 窒化ホウ素凝集粉末、放熱シート及び半導体デバイス

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102574684B (zh) 2009-10-09 2015-04-29 水岛合金铁株式会社 六方氮化硼粉末及其制备方法
CN109790025B (zh) * 2016-10-07 2023-05-30 电化株式会社 氮化硼块状粒子、其制造方法及使用了其的导热树脂组合物
JP7104503B2 (ja) * 2017-10-13 2022-07-21 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
KR102619752B1 (ko) * 2017-10-13 2023-12-29 덴카 주식회사 질화붕소 분말, 그 제조 방법 및 그것을 사용한 방열 부재
US20220153583A1 (en) * 2019-03-27 2022-05-19 Denka Company Limited Bulk boron nitride particles, thermally conductive resin composition, and heat dissipating member
JP7259137B2 (ja) * 2020-08-20 2023-04-17 デンカ株式会社 窒化ホウ素粒子、窒化ホウ素粉末、樹脂組成物、及び樹脂組成物の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014136959A1 (ja) 2013-03-07 2014-09-12 電気化学工業株式会社 窒化ホウ素粉末及びこれを含有する樹脂組成物
WO2016092952A1 (ja) 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP2017165609A (ja) 2016-03-15 2017-09-21 デンカ株式会社 六方晶窒化ホウ素の一次粒子凝集体、樹脂組成物及びその用途
WO2018012484A1 (ja) 2016-07-13 2018-01-18 積水化学工業株式会社 複合粒子及び液晶表示装置
JP2018052782A (ja) 2016-09-30 2018-04-05 デンカ株式会社 六方晶窒化ホウ素一次粒子凝集体
JP2018104253A (ja) 2016-12-28 2018-07-05 デンカ株式会社 六方晶窒化ホウ素一次粒子凝集体及びその用途
JP2018115275A (ja) 2017-01-19 2018-07-26 積水化学工業株式会社 硬化性材料、硬化性材料の製造方法及び積層体
WO2020004600A1 (ja) 2018-06-29 2020-01-02 デンカ株式会社 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材
WO2020175377A1 (ja) 2019-02-27 2020-09-03 三菱ケミカル株式会社 窒化ホウ素凝集粉末、放熱シート及び半導体デバイス

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7796274B1 (ja) * 2025-03-31 2026-01-08 デンカ株式会社 窒化ホウ素粉末、及び無機フィラー
JP7804810B1 (ja) * 2025-03-31 2026-01-22 デンカ株式会社 窒化ホウ素粉末、無機フィラー及び窒化ホウ素粉末の製造方法

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CN117043099A (zh) 2023-11-10
TW202300446A (zh) 2023-01-01
JPWO2022202825A1 (https=) 2022-09-29
CN117043099B (zh) 2026-04-03
WO2022202825A1 (ja) 2022-09-29
TWI869662B (zh) 2025-01-11
KR20230156792A (ko) 2023-11-14
KR102945379B1 (ko) 2026-03-27
US20240217819A1 (en) 2024-07-04

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