JPWO2022202825A1 - - Google Patents
Info
- Publication number
- JPWO2022202825A1 JPWO2022202825A1 JP2022575475A JP2022575475A JPWO2022202825A1 JP WO2022202825 A1 JPWO2022202825 A1 JP WO2022202825A1 JP 2022575475 A JP2022575475 A JP 2022575475A JP 2022575475 A JP2022575475 A JP 2022575475A JP WO2022202825 A1 JPWO2022202825 A1 JP WO2022202825A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
- C01B21/0648—After-treatment, e.g. grinding, purification
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Ceramic Products (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021051878 | 2021-03-25 | ||
| JP2021051878 | 2021-03-25 | ||
| PCT/JP2022/013233 WO2022202825A1 (ja) | 2021-03-25 | 2022-03-22 | 窒化ホウ素粉末及び樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022202825A1 true JPWO2022202825A1 (https=) | 2022-09-29 |
| JPWO2022202825A5 JPWO2022202825A5 (https=) | 2023-02-21 |
| JP7303950B2 JP7303950B2 (ja) | 2023-07-05 |
Family
ID=83395655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022575475A Active JP7303950B2 (ja) | 2021-03-25 | 2022-03-22 | 窒化ホウ素粉末及び樹脂組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240217819A1 (https=) |
| JP (1) | JP7303950B2 (https=) |
| KR (1) | KR102945379B1 (https=) |
| CN (1) | CN117043099B (https=) |
| TW (1) | TWI869662B (https=) |
| WO (1) | WO2022202825A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025137039A (ja) * | 2024-03-08 | 2025-09-19 | デンカ株式会社 | 窒化ホウ素粉末及び樹脂組成物 |
| JP2025137036A (ja) * | 2024-03-08 | 2025-09-19 | デンカ株式会社 | 窒化ホウ素粉末及び樹脂組成物 |
| JP7804810B1 (ja) * | 2025-03-31 | 2026-01-22 | デンカ株式会社 | 窒化ホウ素粉末、無機フィラー及び窒化ホウ素粉末の製造方法 |
| JP7796274B1 (ja) * | 2025-03-31 | 2026-01-08 | デンカ株式会社 | 窒化ホウ素粉末、及び無機フィラー |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014136959A1 (ja) * | 2013-03-07 | 2014-09-12 | 電気化学工業株式会社 | 窒化ホウ素粉末及びこれを含有する樹脂組成物 |
| WO2016092952A1 (ja) * | 2014-12-08 | 2016-06-16 | 昭和電工株式会社 | 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート |
| JP2017165609A (ja) * | 2016-03-15 | 2017-09-21 | デンカ株式会社 | 六方晶窒化ホウ素の一次粒子凝集体、樹脂組成物及びその用途 |
| WO2018012484A1 (ja) * | 2016-07-13 | 2018-01-18 | 積水化学工業株式会社 | 複合粒子及び液晶表示装置 |
| JP2018052782A (ja) * | 2016-09-30 | 2018-04-05 | デンカ株式会社 | 六方晶窒化ホウ素一次粒子凝集体 |
| JP2018104253A (ja) * | 2016-12-28 | 2018-07-05 | デンカ株式会社 | 六方晶窒化ホウ素一次粒子凝集体及びその用途 |
| JP2018115275A (ja) * | 2017-01-19 | 2018-07-26 | 積水化学工業株式会社 | 硬化性材料、硬化性材料の製造方法及び積層体 |
| WO2020004600A1 (ja) * | 2018-06-29 | 2020-01-02 | デンカ株式会社 | 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材 |
| WO2020175377A1 (ja) * | 2019-02-27 | 2020-09-03 | 三菱ケミカル株式会社 | 窒化ホウ素凝集粉末、放熱シート及び半導体デバイス |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102574684B (zh) | 2009-10-09 | 2015-04-29 | 水岛合金铁株式会社 | 六方氮化硼粉末及其制备方法 |
| CN109790025B (zh) * | 2016-10-07 | 2023-05-30 | 电化株式会社 | 氮化硼块状粒子、其制造方法及使用了其的导热树脂组合物 |
| JP7104503B2 (ja) * | 2017-10-13 | 2022-07-21 | デンカ株式会社 | 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材 |
| KR102619752B1 (ko) * | 2017-10-13 | 2023-12-29 | 덴카 주식회사 | 질화붕소 분말, 그 제조 방법 및 그것을 사용한 방열 부재 |
| US20220153583A1 (en) * | 2019-03-27 | 2022-05-19 | Denka Company Limited | Bulk boron nitride particles, thermally conductive resin composition, and heat dissipating member |
| JP7259137B2 (ja) * | 2020-08-20 | 2023-04-17 | デンカ株式会社 | 窒化ホウ素粒子、窒化ホウ素粉末、樹脂組成物、及び樹脂組成物の製造方法 |
-
2022
- 2022-03-22 US US18/283,479 patent/US20240217819A1/en active Pending
- 2022-03-22 CN CN202280022951.1A patent/CN117043099B/zh active Active
- 2022-03-22 JP JP2022575475A patent/JP7303950B2/ja active Active
- 2022-03-22 KR KR1020237035741A patent/KR102945379B1/ko active Active
- 2022-03-22 WO PCT/JP2022/013233 patent/WO2022202825A1/ja not_active Ceased
- 2022-03-24 TW TW111110962A patent/TWI869662B/zh active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014136959A1 (ja) * | 2013-03-07 | 2014-09-12 | 電気化学工業株式会社 | 窒化ホウ素粉末及びこれを含有する樹脂組成物 |
| WO2016092952A1 (ja) * | 2014-12-08 | 2016-06-16 | 昭和電工株式会社 | 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート |
| JP2017165609A (ja) * | 2016-03-15 | 2017-09-21 | デンカ株式会社 | 六方晶窒化ホウ素の一次粒子凝集体、樹脂組成物及びその用途 |
| WO2018012484A1 (ja) * | 2016-07-13 | 2018-01-18 | 積水化学工業株式会社 | 複合粒子及び液晶表示装置 |
| JP2018052782A (ja) * | 2016-09-30 | 2018-04-05 | デンカ株式会社 | 六方晶窒化ホウ素一次粒子凝集体 |
| JP2018104253A (ja) * | 2016-12-28 | 2018-07-05 | デンカ株式会社 | 六方晶窒化ホウ素一次粒子凝集体及びその用途 |
| JP2018115275A (ja) * | 2017-01-19 | 2018-07-26 | 積水化学工業株式会社 | 硬化性材料、硬化性材料の製造方法及び積層体 |
| WO2020004600A1 (ja) * | 2018-06-29 | 2020-01-02 | デンカ株式会社 | 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材 |
| WO2020175377A1 (ja) * | 2019-02-27 | 2020-09-03 | 三菱ケミカル株式会社 | 窒化ホウ素凝集粉末、放熱シート及び半導体デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7303950B2 (ja) | 2023-07-05 |
| CN117043099A (zh) | 2023-11-10 |
| TW202300446A (zh) | 2023-01-01 |
| CN117043099B (zh) | 2026-04-03 |
| WO2022202825A1 (ja) | 2022-09-29 |
| TWI869662B (zh) | 2025-01-11 |
| KR20230156792A (ko) | 2023-11-14 |
| KR102945379B1 (ko) | 2026-03-27 |
| US20240217819A1 (en) | 2024-07-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221207 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221207 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20221207 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230207 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230613 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230623 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7303950 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |