JP7302595B2 - ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム - Google Patents
ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム Download PDFInfo
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- JP7302595B2 JP7302595B2 JP2020517041A JP2020517041A JP7302595B2 JP 7302595 B2 JP7302595 B2 JP 7302595B2 JP 2020517041 A JP2020517041 A JP 2020517041A JP 2020517041 A JP2020517041 A JP 2020517041A JP 7302595 B2 JP7302595 B2 JP 7302595B2
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018088184 | 2018-05-01 | ||
JP2018088184 | 2018-05-01 | ||
PCT/JP2019/016036 WO2019211972A1 (ja) | 2018-05-01 | 2019-04-12 | ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019211972A1 JPWO2019211972A1 (ja) | 2021-05-13 |
JP7302595B2 true JP7302595B2 (ja) | 2023-07-04 |
Family
ID=68386394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020517041A Active JP7302595B2 (ja) | 2018-05-01 | 2019-04-12 | ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7302595B2 (ko) |
KR (1) | KR20210003100A (ko) |
CN (1) | CN112041371B (ko) |
TW (1) | TWI812701B (ko) |
WO (1) | WO2019211972A1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7167402B2 (ja) * | 2018-08-30 | 2022-11-09 | サムソン エレクトロ-メカニックス カンパニーリミテッド. | ポリイミド樹脂、感光性樹脂組成物、及び、硬化物 |
WO2021033544A1 (ja) * | 2019-08-20 | 2021-02-25 | 三菱瓦斯化学株式会社 | ポリイミド樹脂組成物、ポリイミドワニス及びポリイミドフィルム |
CN115348987A (zh) * | 2020-03-27 | 2022-11-15 | 三菱瓦斯化学株式会社 | 聚酰亚胺薄膜和层叠体 |
JP2021175790A (ja) | 2020-04-24 | 2021-11-04 | 旭化成株式会社 | ポリイミド前駆体及びそれを含む樹脂組成物、ポリイミド樹脂膜、樹脂フィルム及びその製造方法 |
CN115551922A (zh) * | 2020-05-13 | 2022-12-30 | 三菱瓦斯化学株式会社 | 聚酰亚胺树脂、聚酰亚胺清漆和聚酰亚胺薄膜 |
WO2021241763A1 (ja) * | 2020-05-28 | 2021-12-02 | 旭化成株式会社 | 樹脂組成物 |
CN112646183A (zh) * | 2020-12-22 | 2021-04-13 | 宁波长阳科技股份有限公司 | 聚酰亚胺材料及其制备方法和应用 |
JP7174199B1 (ja) | 2021-04-02 | 2022-11-17 | 旭化成株式会社 | ポリイミド、樹脂組成物、ポリイミドフィルム、及び、その製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011065131A1 (ja) | 2009-11-26 | 2011-06-03 | 株式会社カネカ | 光学フィルム、光学フィルムの製造方法、透明基板、画像表示装置及び太陽電池 |
JP2017071193A (ja) | 2015-10-09 | 2017-04-13 | Jxエネルギー株式会社 | 金属張積層板、それを用いたプリント配線基板及び電子機器 |
WO2017195574A1 (ja) | 2016-05-09 | 2017-11-16 | 三菱瓦斯化学株式会社 | ポリイミド樹脂及びポリイミド樹脂組成物 |
WO2017221776A1 (ja) | 2016-06-24 | 2017-12-28 | 東レ株式会社 | ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機el素子およびその製造方法 |
WO2018042999A1 (ja) | 2016-08-31 | 2018-03-08 | 株式会社カネカ | ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法 |
WO2018088543A1 (ja) | 2016-11-11 | 2018-05-17 | 宇部興産株式会社 | ポリイミドフィルムとハードコート層とを含む積層体 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005232383A (ja) | 2004-02-20 | 2005-09-02 | Asahi Kasei Electronics Co Ltd | ポリアミド酸誘導体 |
JP6451507B2 (ja) * | 2015-05-29 | 2019-01-16 | 三菱瓦斯化学株式会社 | ポリイミド樹脂組成物 |
TWI804465B (zh) * | 2016-05-02 | 2023-06-11 | 日商三菱瓦斯化學股份有限公司 | 聚醯亞胺樹脂、聚醯亞胺樹脂組成物及聚醯亞胺薄膜 |
-
2019
- 2019-04-12 KR KR1020207028736A patent/KR20210003100A/ko not_active Application Discontinuation
- 2019-04-12 JP JP2020517041A patent/JP7302595B2/ja active Active
- 2019-04-12 WO PCT/JP2019/016036 patent/WO2019211972A1/ja active Application Filing
- 2019-04-12 CN CN201980029003.9A patent/CN112041371B/zh active Active
- 2019-04-16 TW TW108113133A patent/TWI812701B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011065131A1 (ja) | 2009-11-26 | 2011-06-03 | 株式会社カネカ | 光学フィルム、光学フィルムの製造方法、透明基板、画像表示装置及び太陽電池 |
JP2017071193A (ja) | 2015-10-09 | 2017-04-13 | Jxエネルギー株式会社 | 金属張積層板、それを用いたプリント配線基板及び電子機器 |
WO2017195574A1 (ja) | 2016-05-09 | 2017-11-16 | 三菱瓦斯化学株式会社 | ポリイミド樹脂及びポリイミド樹脂組成物 |
WO2017221776A1 (ja) | 2016-06-24 | 2017-12-28 | 東レ株式会社 | ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機el素子およびその製造方法 |
WO2018042999A1 (ja) | 2016-08-31 | 2018-03-08 | 株式会社カネカ | ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法 |
WO2018088543A1 (ja) | 2016-11-11 | 2018-05-17 | 宇部興産株式会社 | ポリイミドフィルムとハードコート層とを含む積層体 |
Also Published As
Publication number | Publication date |
---|---|
TW201945437A (zh) | 2019-12-01 |
JPWO2019211972A1 (ja) | 2021-05-13 |
KR20210003100A (ko) | 2021-01-11 |
CN112041371B (zh) | 2023-05-02 |
CN112041371A (zh) | 2020-12-04 |
WO2019211972A1 (ja) | 2019-11-07 |
TWI812701B (zh) | 2023-08-21 |
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