JP7296410B2 - 粒子ビーム検査装置 - Google Patents

粒子ビーム検査装置 Download PDF

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Publication number
JP7296410B2
JP7296410B2 JP2020572986A JP2020572986A JP7296410B2 JP 7296410 B2 JP7296410 B2 JP 7296410B2 JP 2020572986 A JP2020572986 A JP 2020572986A JP 2020572986 A JP2020572986 A JP 2020572986A JP 7296410 B2 JP7296410 B2 JP 7296410B2
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Japan
Prior art keywords
wafer
loadlock
temperature
chamber
gas
Prior art date
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JP2020572986A
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English (en)
Japanese (ja)
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JP2021530865A (ja
Inventor
ゴーセン，ジェロエン，ジェラルド
チェン，テ－ユ
バニング，デニス，ハーマン，キャスパー ヴァン
カダイク，エドウィン，コルネリス
フーメン，マーティン，ペトルス，クリスチアヌス ヴァン
ワン，アーハン
ヤコブス，ヨハネス，アンドレアス，ヘンリカス，マリア
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ASML Netherlands BV
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ASML Netherlands BV
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Publication of JP2021530865A publication Critical patent/JP2021530865A/ja
Priority to JP2023043722A priority Critical patent/JP7608500B2/ja
Application granted granted Critical
Publication of JP7296410B2 publication Critical patent/JP7296410B2/ja
Priority to JP2024221528A priority patent/JP2025041727A/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Robotics (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2020572986A 2018-07-17 2019-07-11 粒子ビーム検査装置 Active JP7296410B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023043722A JP7608500B2 (ja) 2018-07-17 2023-03-20 粒子ビーム検査装置
JP2024221528A JP2025041727A (ja) 2018-07-17 2024-12-18 粒子ビーム検査装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862699643P 2018-07-17 2018-07-17
US62/699,643 2018-07-17
US201962869986P 2019-07-02 2019-07-02
US62/869,986 2019-07-02
PCT/EP2019/068637 WO2020016087A1 (en) 2018-07-17 2019-07-11 Particle beam inspection apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023043722A Division JP7608500B2 (ja) 2018-07-17 2023-03-20 粒子ビーム検査装置

Publications (2)

Publication Number Publication Date
JP2021530865A JP2021530865A (ja) 2021-11-11
JP7296410B2 true JP7296410B2 (ja) 2023-06-22

Family

ID=67297162

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2020572986A Active JP7296410B2 (ja) 2018-07-17 2019-07-11 粒子ビーム検査装置
JP2023043722A Active JP7608500B2 (ja) 2018-07-17 2023-03-20 粒子ビーム検査装置
JP2024221528A Pending JP2025041727A (ja) 2018-07-17 2024-12-18 粒子ビーム検査装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023043722A Active JP7608500B2 (ja) 2018-07-17 2023-03-20 粒子ビーム検査装置
JP2024221528A Pending JP2025041727A (ja) 2018-07-17 2024-12-18 粒子ビーム検査装置

Country Status (6)

Country Link
US (4) US11430678B2 (https=)
JP (3) JP7296410B2 (https=)
KR (4) KR102796031B1 (https=)
CN (2) CN112424922A (https=)
TW (5) TWI842517B (https=)
WO (1) WO2020016087A1 (https=)

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KR102796031B1 (ko) * 2018-07-17 2025-04-16 에이에스엠엘 네델란즈 비.브이. 입자 빔 검사 장치
JP7472114B2 (ja) 2018-09-28 2024-04-22 ラム リサーチ コーポレーション 堆積副生成物の蓄積からの真空ポンプの保護
EP3916482A1 (en) * 2020-05-27 2021-12-01 ASML Netherlands B.V. Conditioning device and corresponding object handler, stage apparatus and lithographic apparatus
JP2023538840A (ja) * 2020-08-21 2023-09-12 エーエスエムエル ネザーランズ ビー．ブイ． 荷電粒子検査装置
JP7249989B2 (ja) * 2020-12-16 2023-03-31 日本電子株式会社 荷電粒子線装置
US11892382B2 (en) * 2021-08-27 2024-02-06 Taiwan Semiconductor Manufacturing Company Ltd. Method for detecting environmental parameter in semiconductor fabrication facility
WO2023110244A1 (en) 2021-12-15 2023-06-22 Asml Netherlands B.V. Charged particle assessment system
EP4213176A1 (en) 2022-01-13 2023-07-19 ASML Netherlands B.V. Charged particle assessment system
KR20240161114A (ko) * 2022-03-11 2024-11-12 에이에스엠엘 네델란즈 비.브이. 온도 컨디셔닝 플레이트를 포함한 진공 챔버 시스템
CN119404299A (zh) * 2022-08-05 2025-02-07 Asml荷兰有限公司 高生产量装载锁定腔室
CN115020308B (zh) * 2022-08-08 2022-11-22 上海果纳半导体技术有限公司武汉分公司 晶圆传输装置、设备平台系统及其晶圆传输方法

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JP2006273563A (ja) 2005-03-30 2006-10-12 Tokyo Electron Ltd ロードロック装置，処理システム及び処理方法
JP2006303013A (ja) 2005-04-18 2006-11-02 Tokyo Electron Ltd ロードロック装置及び処理方法
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Publication number Publication date
KR20210022068A (ko) 2021-03-02
TWI879378B (zh) 2025-04-01
JP2023073317A (ja) 2023-05-25
US20200027763A1 (en) 2020-01-23
TW202531455A (zh) 2025-08-01
US20240258138A1 (en) 2024-08-01
KR20240024306A (ko) 2024-02-23
TW202349541A (zh) 2023-12-16
JP2021530865A (ja) 2021-11-11
TW202211349A (zh) 2022-03-16
US11942340B2 (en) 2024-03-26
TW202018755A (zh) 2020-05-16
US11430678B2 (en) 2022-08-30
TWI738028B (zh) 2021-09-01
TW202433637A (zh) 2024-08-16
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