JP7285125B2 - 減圧乾燥装置 - Google Patents

減圧乾燥装置 Download PDF

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Publication number
JP7285125B2
JP7285125B2 JP2019078071A JP2019078071A JP7285125B2 JP 7285125 B2 JP7285125 B2 JP 7285125B2 JP 2019078071 A JP2019078071 A JP 2019078071A JP 2019078071 A JP2019078071 A JP 2019078071A JP 7285125 B2 JP7285125 B2 JP 7285125B2
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Japan
Prior art keywords
substrate
solvent
region
panel
collection net
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019078071A
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English (en)
Japanese (ja)
Other versions
JP2020176746A (ja
Inventor
淳志 戸原
輝幸 林
雄 今田
明典 島村
澄美 大島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2019078071A priority Critical patent/JP7285125B2/ja
Priority to KR1020200041049A priority patent/KR20200121733A/ko
Priority to TW109111598A priority patent/TWI837341B/zh
Priority to CN202010263606.XA priority patent/CN111834553A/zh
Publication of JP2020176746A publication Critical patent/JP2020176746A/ja
Application granted granted Critical
Publication of JP7285125B2 publication Critical patent/JP7285125B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/005—Treatment of dryer exhaust gases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/06—Chambers, containers, or receptacles
    • F26B25/08—Parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Drying Of Solid Materials (AREA)
JP2019078071A 2019-04-16 2019-04-16 減圧乾燥装置 Active JP7285125B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019078071A JP7285125B2 (ja) 2019-04-16 2019-04-16 減圧乾燥装置
KR1020200041049A KR20200121733A (ko) 2019-04-16 2020-04-03 감압 건조 장치
TW109111598A TWI837341B (zh) 2019-04-16 2020-04-07 減壓乾燥裝置
CN202010263606.XA CN111834553A (zh) 2019-04-16 2020-04-07 减压干燥装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019078071A JP7285125B2 (ja) 2019-04-16 2019-04-16 減圧乾燥装置

Publications (2)

Publication Number Publication Date
JP2020176746A JP2020176746A (ja) 2020-10-29
JP7285125B2 true JP7285125B2 (ja) 2023-06-01

Family

ID=72913582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019078071A Active JP7285125B2 (ja) 2019-04-16 2019-04-16 減圧乾燥装置

Country Status (4)

Country Link
JP (1) JP7285125B2 (ko)
KR (1) KR20200121733A (ko)
CN (1) CN111834553A (ko)
TW (1) TWI837341B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113915971A (zh) * 2021-12-09 2022-01-11 中国华能集团清洁能源技术研究院有限公司 一种真空闪蒸系统及真空闪蒸方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010169308A (ja) 2009-01-22 2010-08-05 Panasonic Corp 乾燥装置
JP2014199806A (ja) 2013-03-14 2014-10-23 東京エレクトロン株式会社 乾燥装置及び乾燥処理方法
JP2018059697A (ja) 2016-09-30 2018-04-12 東京エレクトロン株式会社 減圧乾燥装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6397488B1 (en) * 2000-06-15 2002-06-04 Hewlett-Packard Company Apparatus and method for drying printing composition on a print medium
KR101994874B1 (ko) * 2013-03-14 2019-07-01 도쿄엘렉트론가부시키가이샤 건조 장치 및 건조 처리 방법
JP2018059597A (ja) 2016-10-07 2018-04-12 大日本印刷株式会社 保冷保温箱
JP6920131B2 (ja) * 2017-08-10 2021-08-18 東京エレクトロン株式会社 減圧乾燥装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010169308A (ja) 2009-01-22 2010-08-05 Panasonic Corp 乾燥装置
JP2014199806A (ja) 2013-03-14 2014-10-23 東京エレクトロン株式会社 乾燥装置及び乾燥処理方法
JP2018059697A (ja) 2016-09-30 2018-04-12 東京エレクトロン株式会社 減圧乾燥装置

Also Published As

Publication number Publication date
TW202044337A (zh) 2020-12-01
CN111834553A (zh) 2020-10-27
TWI837341B (zh) 2024-04-01
KR20200121733A (ko) 2020-10-26
JP2020176746A (ja) 2020-10-29

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