JP7283589B2 - 内部遮蔽を有する電子部品 - Google Patents
内部遮蔽を有する電子部品 Download PDFInfo
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- JP7283589B2 JP7283589B2 JP2022010929A JP2022010929A JP7283589B2 JP 7283589 B2 JP7283589 B2 JP 7283589B2 JP 2022010929 A JP2022010929 A JP 2022010929A JP 2022010929 A JP2022010929 A JP 2022010929A JP 7283589 B2 JP7283589 B2 JP 7283589B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0049—Casings being metallic containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
少なくとも1つの第1の側壁、および、少なくとも1つの第1の側壁に接合された第1の区画天井と、
少なくとも1つの第2の側壁、および、少なくとも1つの第2の側壁に接合された第2の区画天井と、
第1の区画天井と第2の区画天井との間に延在する少なくとも1つのセパレータであって、セパレータは、第1の区画天井から第1の平面に向かって延在する、少なくとも1つのセパレータと
を形成する。
Claims (7)
- パッケージ基部と、前記パッケージ基部に取り付けられて筐体を形成する金属製キャップとを備える電子部品であって、前記電子部品は、前記筐体内で前記パッケージ基部内のチップ搭載面に搭載される少なくとも1つの電子チップを含み、以て、前記チップ搭載面は第1の平面を規定し、
前記金属製キャップは自己支持キャップであり、当該金属製キャップが、前記筐体を少なくとも第1の区画と第2の区画とに分離し、前記電子チップが前記第1の区画内にあり、前記金属製キャップが前記筐体を前記第1の区画と前記第2の区画とに分離し、前記金属製キャップの形状が、
少なくとも1つの第1の側壁、および、前記少なくとも1つの第1の側壁に接合された第1の区画天井と、
少なくとも1つの第2の側壁、および、前記少なくとも1つの第2の側壁に接合された第2の区画天井と、
前記第1の区画天井と前記第2の区画天井との間に延在する少なくとも1つのセパレータであって、前記セパレータが、前記第1の区画天井から前記第1の平面に向かって延在する、少なくとも1つのセパレータと
を形成し、
前記電子チップは微小電気機械チップであり、前記第1の区画天井と前記電子チップとの間に隙間があることを特徴とする、電子部品。 - 前記金属製キャップの方向における前記第1の平面と前記セパレータとの間の距離が、セパレータ間隙の高さであり、前記セパレータ間隙の高さが実質的にゼロであることを特徴とする、請求項1に記載の電子部品。
- 前記金属製キャップの方向における前記第1の平面と前記セパレータとの間の距離が、セパレータ間隙の高さであり、前記第1の平面に垂直な方向における前記第1の平面から前記第2の区画天井までの距離が、前記第2の区画の高さであり、前記セパレータ間隙の高さが、ゼロよりも大きく、前記第2の区画の高さが、前記セパレータ間隙の高さに実質的に等しいことを特徴とする、請求項1に記載の電子部品。
- 前記金属製キャップの方向における前記第1の平面と前記セパレータとの間の距離が、セパレータ間隙の高さであり、前記第1の平面に垂直な方向における前記第1の平面から前記第2の区画天井までの距離が、前記第2の区画の高さであり、前記セパレータ間隙の高さが、ゼロよりも大きく、前記第2の区画の高さが、前記セパレータ間隙の高さよりも大きいことを特徴とする、請求項1に記載の電子部品。
- 前記チップ搭載面が、前記第1の区画から前記第2の区画まで延在し、前記チップ搭載面が、回路基板であることを特徴とする、請求項1~4のいずれか一項に記載の電子部品。
- 前記電子チップへの通信インターフェース接続を提供するワイヤが、前記第2の区画内の前記回路基板に取り付けられることを特徴とする、請求項5に記載の電子部品。
- 前記金属製キャップの方向における前記第1の平面と前記セパレータとの間の距離が、セパレータ間隙の高さであり、前記セパレータが、前記セパレータ間隙の高さが負になるように、前記第1の平面の下方に延在することを特徴とする、請求項1に記載の電子部品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20215121 | 2021-02-04 | ||
FI20215121 | 2021-02-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022119735A JP2022119735A (ja) | 2022-08-17 |
JP7283589B2 true JP7283589B2 (ja) | 2023-05-30 |
Family
ID=79316862
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Application Number | Title | Priority Date | Filing Date |
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JP2022010929A Active JP7283589B2 (ja) | 2021-02-04 | 2022-01-27 | 内部遮蔽を有する電子部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20220248576A1 (ja) |
EP (1) | EP4040483A3 (ja) |
JP (1) | JP7283589B2 (ja) |
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JP2010177520A (ja) | 2009-01-30 | 2010-08-12 | Toshiba Corp | 電子回路モジュールおよびその製造方法 |
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JP2019106404A (ja) | 2017-12-08 | 2019-06-27 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
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-
2021
- 2021-12-22 EP EP21216971.8A patent/EP4040483A3/en active Pending
-
2022
- 2022-01-10 US US17/572,073 patent/US20220248576A1/en active Pending
- 2022-01-27 JP JP2022010929A patent/JP7283589B2/ja active Active
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US20090302439A1 (en) | 2008-06-04 | 2009-12-10 | Stats Chippac, Ltd. | Semiconductor Device Having Electrical Devices Mounted to IPD Structure and Method of Shielding Electromagnetic Interference |
JP2010177520A (ja) | 2009-01-30 | 2010-08-12 | Toshiba Corp | 電子回路モジュールおよびその製造方法 |
JP2010225620A (ja) | 2009-03-19 | 2010-10-07 | Panasonic Corp | 回路モジュール |
WO2012101920A1 (ja) | 2011-01-27 | 2012-08-02 | 株式会社村田製作所 | 回路モジュール及びその製造方法 |
JP2017212377A (ja) | 2016-05-26 | 2017-11-30 | 新光電気工業株式会社 | 半導体装置、半導体装置の製造方法 |
JP2019106404A (ja) | 2017-12-08 | 2019-06-27 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
Also Published As
Publication number | Publication date |
---|---|
US20220248576A1 (en) | 2022-08-04 |
JP2022119735A (ja) | 2022-08-17 |
EP4040483A3 (en) | 2022-10-26 |
EP4040483A2 (en) | 2022-08-10 |
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