JP7280027B2 - メモリプレーンを含む不揮発性メモリ装置及びその動作方法 - Google Patents
メモリプレーンを含む不揮発性メモリ装置及びその動作方法 Download PDFInfo
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- JP7280027B2 JP7280027B2 JP2018180268A JP2018180268A JP7280027B2 JP 7280027 B2 JP7280027 B2 JP 7280027B2 JP 2018180268 A JP2018180268 A JP 2018180268A JP 2018180268 A JP2018180268 A JP 2018180268A JP 7280027 B2 JP7280027 B2 JP 7280027B2
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/30—Power supply circuits
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0602—Interfaces specially adapted for storage systems specifically adapted to achieve a particular effect
- G06F3/0625—Power saving in storage systems
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0628—Interfaces specially adapted for storage systems making use of a particular technique
- G06F3/0653—Monitoring storage devices or systems
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0668—Interfaces specially adapted for storage systems adopting a particular infrastructure
- G06F3/0671—In-line storage system
- G06F3/0683—Plurality of storage devices
- G06F3/0688—Non-volatile semiconductor memory arrays
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/32—Timing circuits
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Memories (AREA)
- Memory System (AREA)
- Read Only Memory (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170132752A KR102631350B1 (ko) | 2017-10-12 | 2017-10-12 | 메모리 플레인들을 포함하는 비휘발성 메모리 장치 및 상기 비휘발성 메모리 장치의 동작 방법 |
| KR10-2017-0132752 | 2017-10-12 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019075105A JP2019075105A (ja) | 2019-05-16 |
| JP2019075105A5 JP2019075105A5 (cg-RX-API-DMAC7.html) | 2021-10-28 |
| JP7280027B2 true JP7280027B2 (ja) | 2023-05-23 |
Family
ID=65910381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018180268A Active JP7280027B2 (ja) | 2017-10-12 | 2018-09-26 | メモリプレーンを含む不揮発性メモリ装置及びその動作方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10712955B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7280027B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102631350B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN109658967B (cg-RX-API-DMAC7.html) |
| DE (1) | DE102018116927B4 (cg-RX-API-DMAC7.html) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11270759B2 (en) | 2019-10-21 | 2022-03-08 | Samsung Electronics Co., Ltd. | Flash memory device and computing device including flash memory cells |
| KR102838205B1 (ko) * | 2019-10-21 | 2025-07-25 | 삼성전자주식회사 | 플래시 메모리 장치 및 플래시 메모리 셀들을 포함하는 컴퓨팅 장치 |
| KR20210073754A (ko) | 2019-12-11 | 2021-06-21 | 에스케이하이닉스 주식회사 | 시스템, 컨트롤러 및 시스템의 동작 방법 |
| US11056195B1 (en) * | 2020-04-27 | 2021-07-06 | Macronix International Co., Ltd. | Nonvolatile memory device and related driving method |
| US11200001B2 (en) * | 2020-05-15 | 2021-12-14 | Micron Technology, Inc. | Management of power during memory device reset and initialization |
| US11385810B2 (en) * | 2020-06-30 | 2022-07-12 | Sandisk Technologies Llc | Dynamic staggering for programming in nonvolatile memory |
| JP7467692B2 (ja) | 2020-11-26 | 2024-04-15 | 長江存儲科技有限責任公司 | マルチダイ動作のための動的なピーク電力管理 |
| US11532348B2 (en) * | 2020-12-02 | 2022-12-20 | Micron Technology, Inc. | Power management across multiple packages of memory dies |
| US11520497B2 (en) | 2020-12-02 | 2022-12-06 | Micron Technology, Inc. | Peak power management in a memory device |
| US12362022B2 (en) * | 2022-08-15 | 2025-07-15 | Micron Technology, Inc. | Scheduled interrupts for peak power management token ring communication |
| US12118219B2 (en) | 2022-09-06 | 2024-10-15 | SanDisk Technologies, Inc. | Asymmetric time division peak power management (TD-PPM) timing windows |
| US11893253B1 (en) | 2022-09-20 | 2024-02-06 | Western Digital Technologies, Inc. | Dynamic TD-PPM state and die mapping in multi-NAND channels |
| US20240152295A1 (en) * | 2022-11-08 | 2024-05-09 | Micron Technology, Inc. | Peak power management with dynamic data path operation current budget management |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008197807A (ja) | 2007-02-09 | 2008-08-28 | Toshiba Corp | 半導体記憶システム |
| JP2011065708A (ja) | 2009-09-16 | 2011-03-31 | Toshiba Corp | 不揮発性半導体記憶装置 |
| JP2012043420A (ja) | 2010-07-26 | 2012-03-01 | Apple Inc | 電力消費を制限するように不揮発性メモリの動作を動的に制御する方法及びシステム |
| US20160307910A1 (en) | 2015-04-15 | 2016-10-20 | Jae-Ick SON | Memory device having cell over periphery (cop) structure, memory package and method of manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101226685B1 (ko) | 2007-11-08 | 2013-01-25 | 삼성전자주식회사 | 수직형 반도체 소자 및 그 제조 방법. |
| KR101519061B1 (ko) * | 2008-01-21 | 2015-05-11 | 삼성전자주식회사 | 하나의 고전압 레벨 쉬프터를 공유하는 로우 디코더를 갖는플래쉬 메모리 장치 |
| WO2010090691A2 (en) | 2009-02-09 | 2010-08-12 | Rambus Inc. | Multiple plane, non-volatile memory with synchronized control |
| KR101691092B1 (ko) | 2010-08-26 | 2016-12-30 | 삼성전자주식회사 | 불휘발성 메모리 장치, 그것의 동작 방법, 그리고 그것을 포함하는 메모리 시스템 |
| US8553466B2 (en) | 2010-03-04 | 2013-10-08 | Samsung Electronics Co., Ltd. | Non-volatile memory device, erasing method thereof, and memory system including the same |
| US9536970B2 (en) | 2010-03-26 | 2017-01-03 | Samsung Electronics Co., Ltd. | Three-dimensional semiconductor memory devices and methods of fabricating the same |
| KR101682666B1 (ko) | 2010-08-11 | 2016-12-07 | 삼성전자주식회사 | 비휘발성 메모리 장치, 그것의 채널 부스팅 방법, 그것의 프로그램 방법 및 그것을 포함하는 메모리 시스템 |
| JP2012058860A (ja) * | 2010-09-06 | 2012-03-22 | Toshiba Corp | メモリシステム |
| DE102012109612A1 (de) * | 2011-10-13 | 2013-04-18 | Samsung Electronics Co., Ltd. | Nichtflüchtige Speichervorrichtung, Programmierungsverfahren für nichtflüchtige Speichervorrichtungen und Speichersystem, das eine nichtflüchtiger Speichervorrichtung umfasst |
| US20130290611A1 (en) | 2012-03-23 | 2013-10-31 | Violin Memory Inc. | Power management in a flash memory |
| US8848478B2 (en) | 2012-09-24 | 2014-09-30 | Micron Technology, Inc. | Power consumption control |
| US9443600B2 (en) | 2013-03-28 | 2016-09-13 | Intel Corporation | Auto-suspend and auto-resume operations for a multi-die NAND memory device to reduce peak power consumption |
| US9368214B2 (en) | 2013-10-03 | 2016-06-14 | Apple Inc. | Programmable peak-current control in non-volatile memory devices |
| JP2015135875A (ja) * | 2014-01-16 | 2015-07-27 | 株式会社東芝 | 半導体パッケージおよび電子機器 |
| KR102225989B1 (ko) * | 2014-03-04 | 2021-03-10 | 삼성전자주식회사 | 불휘발성 메모리 시스템 및 그것의 동작 방법 |
| KR102233808B1 (ko) * | 2014-03-14 | 2021-03-30 | 삼성전자주식회사 | 저장 장치 및 그것의 테이블 관리 방법 |
| US10013345B2 (en) | 2014-09-17 | 2018-07-03 | Sandisk Technologies Llc | Storage module and method for scheduling memory operations for peak-power management and balancing |
| KR102259943B1 (ko) * | 2014-12-08 | 2021-06-04 | 삼성전자주식회사 | 멀티 플래인을 포함하는 불 휘발성 메모리 장치 |
| US20160162215A1 (en) | 2014-12-08 | 2016-06-09 | Sandisk Technologies Inc. | Meta plane operations for a storage device |
| KR20160074929A (ko) * | 2014-12-19 | 2016-06-29 | 에스케이하이닉스 주식회사 | 비휘발성 메모리 장치 및 이의 동작 방법 |
| KR102296741B1 (ko) * | 2015-07-07 | 2021-09-01 | 삼성전자 주식회사 | 메모리 장치 및 메모리 시스템 |
| US9875049B2 (en) | 2015-08-24 | 2018-01-23 | Sandisk Technologies Llc | Memory system and method for reducing peak current consumption |
| KR20170034126A (ko) * | 2015-09-18 | 2017-03-28 | 에스케이하이닉스 주식회사 | 고전압 스위치 회로 및 이를 포함하는 반도체 메모리 장치 |
| US20170256955A1 (en) | 2016-03-02 | 2017-09-07 | Sandisk Technologies Inc. | Efficient Peak Current Management In A Multi-Die Stack |
| KR102713411B1 (ko) | 2017-01-18 | 2024-10-08 | 삼성전자주식회사 | 불휘발성 메모리 장치 및 그것을 포함하는 메모리 시스템 |
-
2017
- 2017-10-12 KR KR1020170132752A patent/KR102631350B1/ko active Active
-
2018
- 2018-07-12 DE DE102018116927.2A patent/DE102018116927B4/de active Active
- 2018-09-26 JP JP2018180268A patent/JP7280027B2/ja active Active
- 2018-09-28 US US16/145,772 patent/US10712955B2/en active Active
- 2018-10-12 CN CN201811189134.7A patent/CN109658967B/zh active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008197807A (ja) | 2007-02-09 | 2008-08-28 | Toshiba Corp | 半導体記憶システム |
| JP2011065708A (ja) | 2009-09-16 | 2011-03-31 | Toshiba Corp | 不揮発性半導体記憶装置 |
| JP2012043420A (ja) | 2010-07-26 | 2012-03-01 | Apple Inc | 電力消費を制限するように不揮発性メモリの動作を動的に制御する方法及びシステム |
| US20160307910A1 (en) | 2015-04-15 | 2016-10-20 | Jae-Ick SON | Memory device having cell over periphery (cop) structure, memory package and method of manufacturing the same |
Non-Patent Citations (1)
| Title |
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| TALLIS, Billy,Micron 3D NAND Status Update,2016年02月,https://web.archive.org/web/20160213093225/https://www.anandtech.com/show/10028/micron-3d-nand-status-update |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109658967A (zh) | 2019-04-19 |
| DE102018116927A1 (de) | 2019-04-18 |
| JP2019075105A (ja) | 2019-05-16 |
| CN109658967B (zh) | 2023-08-29 |
| KR20190041319A (ko) | 2019-04-22 |
| US10712955B2 (en) | 2020-07-14 |
| DE102018116927B4 (de) | 2024-11-28 |
| US20190114099A1 (en) | 2019-04-18 |
| KR102631350B1 (ko) | 2024-01-31 |
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