JP7279858B2 - 搬送装置、搬送方法および搬送システム - Google Patents

搬送装置、搬送方法および搬送システム Download PDF

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Publication number
JP7279858B2
JP7279858B2 JP2022524820A JP2022524820A JP7279858B2 JP 7279858 B2 JP7279858 B2 JP 7279858B2 JP 2022524820 A JP2022524820 A JP 2022524820A JP 2022524820 A JP2022524820 A JP 2022524820A JP 7279858 B2 JP7279858 B2 JP 7279858B2
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Japan
Prior art keywords
robot
substrate
transfer
side wall
chamber
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JP2022524820A
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English (en)
Japanese (ja)
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JPWO2021234928A1 (enExample
JPWO2021234928A5 (enExample
Inventor
剛 山口
裕光 赤江
健輔 大仁
修 小宮路
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
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Yaskawa Electric Corp
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Publication date
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Publication of JPWO2021234928A5 publication Critical patent/JPWO2021234928A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0095—Gripping heads and other end effectors with an external support, i.e. a support which does not belong to the manipulator or the object to be gripped, e.g. for maintaining the gripping head in an accurate position, guiding it or preventing vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/04—Gripping heads and other end effectors with provision for the remote detachment or exchange of the head or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J21/00—Chambers provided with manipulation devices
    • B25J21/005—Clean rooms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/003—Programme-controlled manipulators having parallel kinematics
    • B25J9/0045—Programme-controlled manipulators having parallel kinematics with kinematics chains having a rotary joint at the base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0093—Programme-controlled manipulators co-operating with conveyor means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1682—Dual arm manipulator; Coordination of several manipulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2022524820A 2020-05-21 2020-05-21 搬送装置、搬送方法および搬送システム Active JP7279858B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/020197 WO2021234928A1 (ja) 2020-05-21 2020-05-21 搬送装置、搬送方法および搬送システム

Publications (3)

Publication Number Publication Date
JPWO2021234928A1 JPWO2021234928A1 (enExample) 2021-11-25
JPWO2021234928A5 JPWO2021234928A5 (enExample) 2022-07-21
JP7279858B2 true JP7279858B2 (ja) 2023-05-23

Family

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Family Applications (1)

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JP2022524820A Active JP7279858B2 (ja) 2020-05-21 2020-05-21 搬送装置、搬送方法および搬送システム

Country Status (5)

Country Link
US (1) US11701785B2 (enExample)
JP (1) JP7279858B2 (enExample)
KR (1) KR102672414B1 (enExample)
CN (1) CN113966548B (enExample)
WO (1) WO2021234928A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12163228B2 (en) * 2021-05-18 2024-12-10 Mellanox Technologies, Ltd. CVD system with substrate carrier and associated mechanisms for moving substrate therethrough
JP7771651B2 (ja) * 2021-11-12 2025-11-18 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197709A (ja) 2001-12-25 2003-07-11 Tokyo Electron Ltd 被処理体の搬送機構及び処理システム
JP2003282669A (ja) 2002-03-26 2003-10-03 Hitachi High-Technologies Corp 基板の搬送方法及びその装置
JP2008510317A (ja) 2004-08-17 2008-04-03 マットソン テクノロジイ インコーポレイテッド 高度な低コスト・高スループット処理プラットフォーム
JP2014068009A (ja) 2012-09-12 2014-04-17 Lam Research Corporation 半導体処理装置に関する方法およびシステム
JP2014216519A (ja) 2013-04-26 2014-11-17 株式会社ディスコ 加工装置及びウエーハの輸送方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7067018B2 (en) * 1997-05-05 2006-06-27 Semitool, Inc. Automated system for handling and processing wafers within a carrier
AU2001268656A1 (en) * 2000-07-07 2002-01-21 Semitool, Inc. Automated processing system
US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
JP4660434B2 (ja) 2006-07-21 2011-03-30 株式会社安川電機 搬送機構およびそれを備えた処理装置
US20090022574A1 (en) * 2007-07-16 2009-01-22 Eudy Steve L Workpiece loading system
JP6006643B2 (ja) * 2011-01-20 2016-10-12 東京エレクトロン株式会社 真空処理装置
KR101736855B1 (ko) * 2015-05-29 2017-05-18 세메스 주식회사 기판 처리 설비
JP7246147B2 (ja) * 2017-09-29 2023-03-27 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP2020027936A (ja) * 2018-08-09 2020-02-20 株式会社安川電機 搬送システムおよび搬送方法
KR102483600B1 (ko) * 2020-02-05 2022-12-30 가부시키가이샤 야스카와덴키 반송 시스템, 반송 방법 및 반송 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197709A (ja) 2001-12-25 2003-07-11 Tokyo Electron Ltd 被処理体の搬送機構及び処理システム
JP2003282669A (ja) 2002-03-26 2003-10-03 Hitachi High-Technologies Corp 基板の搬送方法及びその装置
JP2008510317A (ja) 2004-08-17 2008-04-03 マットソン テクノロジイ インコーポレイテッド 高度な低コスト・高スループット処理プラットフォーム
JP2014068009A (ja) 2012-09-12 2014-04-17 Lam Research Corporation 半導体処理装置に関する方法およびシステム
JP2014216519A (ja) 2013-04-26 2014-11-17 株式会社ディスコ 加工装置及びウエーハの輸送方法

Also Published As

Publication number Publication date
CN113966548B (zh) 2025-04-11
CN113966548A (zh) 2022-01-21
US11701785B2 (en) 2023-07-18
KR20220007145A (ko) 2022-01-18
KR102672414B1 (ko) 2024-06-04
JPWO2021234928A1 (enExample) 2021-11-25
WO2021234928A1 (ja) 2021-11-25
US20220111539A1 (en) 2022-04-14

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