JP7273377B2 - 圧電振動子及びその製造方法 - Google Patents

圧電振動子及びその製造方法 Download PDF

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Publication number
JP7273377B2
JP7273377B2 JP2021548325A JP2021548325A JP7273377B2 JP 7273377 B2 JP7273377 B2 JP 7273377B2 JP 2021548325 A JP2021548325 A JP 2021548325A JP 2021548325 A JP2021548325 A JP 2021548325A JP 7273377 B2 JP7273377 B2 JP 7273377B2
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Prior art keywords
piezoelectric
electrode
layer
electrodes
crystal
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JP2021548325A
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English (en)
Japanese (ja)
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JPWO2021059581A5 (https=
JPWO2021059581A1 (https=
Inventor
茂夫 尾島
正紀 後
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H03H9/0519—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for cantilever
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
    • H03H2003/0414—Resonance frequency
    • H03H2003/0485—Resonance frequency during the manufacture of a cantilever

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2021548325A 2019-09-26 2020-05-14 圧電振動子及びその製造方法 Active JP7273377B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019175977 2019-09-26
JP2019175977 2019-09-26
PCT/JP2020/019308 WO2021059581A1 (ja) 2019-09-26 2020-05-14 圧電振動子及びその製造方法

Publications (3)

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JPWO2021059581A1 JPWO2021059581A1 (https=) 2021-04-01
JPWO2021059581A5 JPWO2021059581A5 (https=) 2022-04-08
JP7273377B2 true JP7273377B2 (ja) 2023-05-15

Family

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Family Applications (1)

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JP2021548325A Active JP7273377B2 (ja) 2019-09-26 2020-05-14 圧電振動子及びその製造方法

Country Status (4)

Country Link
US (1) US12376497B2 (https=)
JP (1) JP7273377B2 (https=)
CN (1) CN114208028A (https=)
WO (1) WO2021059581A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003198312A (ja) 2001-12-25 2003-07-11 Seiko Epson Corp 圧電デバイスとその製造方法、及び圧電デバイスを利用した携帯電話装置ならびに圧電デバイスを利用した電子機器
JP2010232806A (ja) 2009-03-26 2010-10-14 Seiko Epson Corp 圧電振動子、圧電発振器、電子機器、及び圧電振動子の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57107624A (en) * 1980-12-25 1982-07-05 Seikosha Co Ltd Piezoelectric oscillator
JPS62165421A (ja) * 1986-01-16 1987-07-22 Murata Mfg Co Ltd 電子部品およびその製造方法
JPH07308317A (ja) * 1994-05-17 1995-11-28 Olympus Optical Co Ltd 超音波探触子
JPH1141051A (ja) * 1997-07-16 1999-02-12 Matsushita Electric Ind Co Ltd 圧電共振部品およびその製造方法
WO2004105237A1 (ja) * 2003-05-26 2004-12-02 Murata Manufacturing Co., Ltd. 圧電電子部品、およびその製造方法、通信機
JP5070674B2 (ja) * 2004-06-14 2012-11-14 富士ゼロックス株式会社 インクジェット記録ヘッド、及びインクジェット記録装置
JP4852850B2 (ja) 2005-02-03 2012-01-11 セイコーエプソン株式会社 圧電振動素子、圧電振動子、圧電発振器、周波数安定化方法、及び圧電振動子の製造方法
US7794063B2 (en) * 2006-03-15 2010-09-14 Brother Kogyo Kabushiki Kaisha Liquid-droplet jetting head and liquid-droplet jetting apparatus
JP2009207068A (ja) * 2008-02-29 2009-09-10 Kyocera Kinseki Corp 圧電デバイス
JP5346182B2 (ja) * 2008-07-30 2013-11-20 富士フイルム株式会社 体腔内超音波探触子
WO2012140936A1 (ja) * 2011-04-11 2012-10-18 株式会社村田製作所 電子部品及び電子部品の製造方法
US9881741B2 (en) * 2014-12-11 2018-01-30 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003198312A (ja) 2001-12-25 2003-07-11 Seiko Epson Corp 圧電デバイスとその製造方法、及び圧電デバイスを利用した携帯電話装置ならびに圧電デバイスを利用した電子機器
JP2010232806A (ja) 2009-03-26 2010-10-14 Seiko Epson Corp 圧電振動子、圧電発振器、電子機器、及び圧電振動子の製造方法

Also Published As

Publication number Publication date
CN114208028A (zh) 2022-03-18
US20220199892A1 (en) 2022-06-23
US12376497B2 (en) 2025-07-29
WO2021059581A1 (ja) 2021-04-01
JPWO2021059581A1 (https=) 2021-04-01

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