CN114208028A - 压电振子及其制造方法 - Google Patents
压电振子及其制造方法 Download PDFInfo
- Publication number
- CN114208028A CN114208028A CN202080056557.0A CN202080056557A CN114208028A CN 114208028 A CN114208028 A CN 114208028A CN 202080056557 A CN202080056557 A CN 202080056557A CN 114208028 A CN114208028 A CN 114208028A
- Authority
- CN
- China
- Prior art keywords
- layer
- electrodes
- electrode
- piezoelectric
- quartz
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0504—Holders or supports for bulk acoustic wave devices
- H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
- H03H9/0519—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for cantilever
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
- H03H2003/0485—Resonance frequency during the manufacture of a cantilever
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019175977 | 2019-09-26 | ||
| JP2019-175977 | 2019-09-26 | ||
| PCT/JP2020/019308 WO2021059581A1 (ja) | 2019-09-26 | 2020-05-14 | 圧電振動子及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114208028A true CN114208028A (zh) | 2022-03-18 |
Family
ID=75166005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080056557.0A Pending CN114208028A (zh) | 2019-09-26 | 2020-05-14 | 压电振子及其制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12376497B2 (https=) |
| JP (1) | JP7273377B2 (https=) |
| CN (1) | CN114208028A (https=) |
| WO (1) | WO2021059581A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07308317A (ja) * | 1994-05-17 | 1995-11-28 | Olympus Optical Co Ltd | 超音波探触子 |
| US20050275316A1 (en) * | 2004-06-14 | 2005-12-15 | Fuji Xerox Co., Ltd. | Piezoelectric element, inkjet recording head and inkjet recording device |
| CN1795610A (zh) * | 2003-05-26 | 2006-06-28 | 株式会社村田制作所 | 压电电子元件,其制造工艺,和通信装置 |
| JP2009207068A (ja) * | 2008-02-29 | 2009-09-10 | Kyocera Kinseki Corp | 圧電デバイス |
| JP2010232806A (ja) * | 2009-03-26 | 2010-10-14 | Seiko Epson Corp | 圧電振動子、圧電発振器、電子機器、及び圧電振動子の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57107624A (en) * | 1980-12-25 | 1982-07-05 | Seikosha Co Ltd | Piezoelectric oscillator |
| JPS62165421A (ja) * | 1986-01-16 | 1987-07-22 | Murata Mfg Co Ltd | 電子部品およびその製造方法 |
| JPH1141051A (ja) * | 1997-07-16 | 1999-02-12 | Matsushita Electric Ind Co Ltd | 圧電共振部品およびその製造方法 |
| JP2003198312A (ja) | 2001-12-25 | 2003-07-11 | Seiko Epson Corp | 圧電デバイスとその製造方法、及び圧電デバイスを利用した携帯電話装置ならびに圧電デバイスを利用した電子機器 |
| JP4852850B2 (ja) | 2005-02-03 | 2012-01-11 | セイコーエプソン株式会社 | 圧電振動素子、圧電振動子、圧電発振器、周波数安定化方法、及び圧電振動子の製造方法 |
| US7794063B2 (en) * | 2006-03-15 | 2010-09-14 | Brother Kogyo Kabushiki Kaisha | Liquid-droplet jetting head and liquid-droplet jetting apparatus |
| JP5346182B2 (ja) * | 2008-07-30 | 2013-11-20 | 富士フイルム株式会社 | 体腔内超音波探触子 |
| WO2012140936A1 (ja) * | 2011-04-11 | 2012-10-18 | 株式会社村田製作所 | 電子部品及び電子部品の製造方法 |
| US9881741B2 (en) * | 2014-12-11 | 2018-01-30 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
-
2020
- 2020-05-14 CN CN202080056557.0A patent/CN114208028A/zh active Pending
- 2020-05-14 WO PCT/JP2020/019308 patent/WO2021059581A1/ja not_active Ceased
- 2020-05-14 JP JP2021548325A patent/JP7273377B2/ja active Active
-
2022
- 2022-02-17 US US17/651,483 patent/US12376497B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07308317A (ja) * | 1994-05-17 | 1995-11-28 | Olympus Optical Co Ltd | 超音波探触子 |
| CN1795610A (zh) * | 2003-05-26 | 2006-06-28 | 株式会社村田制作所 | 压电电子元件,其制造工艺,和通信装置 |
| US20050275316A1 (en) * | 2004-06-14 | 2005-12-15 | Fuji Xerox Co., Ltd. | Piezoelectric element, inkjet recording head and inkjet recording device |
| JP2009207068A (ja) * | 2008-02-29 | 2009-09-10 | Kyocera Kinseki Corp | 圧電デバイス |
| JP2010232806A (ja) * | 2009-03-26 | 2010-10-14 | Seiko Epson Corp | 圧電振動子、圧電発振器、電子機器、及び圧電振動子の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20220199892A1 (en) | 2022-06-23 |
| US12376497B2 (en) | 2025-07-29 |
| WO2021059581A1 (ja) | 2021-04-01 |
| JP7273377B2 (ja) | 2023-05-15 |
| JPWO2021059581A1 (https=) | 2021-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |