JP5070674B2 - インクジェット記録ヘッド、及びインクジェット記録装置 - Google Patents
インクジェット記録ヘッド、及びインクジェット記録装置 Download PDFInfo
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- JP5070674B2 JP5070674B2 JP2005000708A JP2005000708A JP5070674B2 JP 5070674 B2 JP5070674 B2 JP 5070674B2 JP 2005000708 A JP2005000708 A JP 2005000708A JP 2005000708 A JP2005000708 A JP 2005000708A JP 5070674 B2 JP5070674 B2 JP 5070674B2
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Images
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Description
インク滴を吐出するノズルと、
前記ノズルと連通し、インクが充填される圧力室と、
前記圧力室の一部を構成する振動板と、
前記圧力室へインク流路を介して供給するインクをプールするインクプール室と、
前記振動板を変位させる圧電素子と、
を有するインクジェット記録ヘッドにおいて、
前記圧電素子は、圧電体と前記圧電体を挟む二つの電極とを有し、且つ低透水性絶縁膜と樹脂絶縁膜とを順次積層した保護膜で被覆されており、
前記電極の一方に接続される第一配線が設けられ、前記保護膜はさらに前記第一配線を被覆し層間絶縁膜として機能させており、
前記保護膜は、前記インクプール室に面しており、
前記低透水性絶縁膜は、ダングリングボンド密度が1×10 18 cm -3 以上5×10 19 cm -3 以下であることを特徴としている。
請求項1に記載の発明では、低水性絶縁膜のダングリングボンド密度を上記範囲とすることで、十分な耐湿性を圧電素子に付与できる。また、耐湿性を十分付与するダングリングボンドの総数を得るための膜厚が薄くすることができ、圧電素子の機械的拘束が小さくなり、圧電素子変移の阻害が防止される。
請求項1に記載の発明では、保護膜を圧電素子と圧電素子と接続する配線の一方を被覆して、圧電素子と接続する配線の層間絶縁膜として機能させ、構成を簡易化させることができる。
以下、上記実施例において、圧電素子46をダングリングボンド密度が1×1018cm-3以上の低透水性絶縁膜80と樹脂絶縁膜82を順次積層した保護膜で被覆した構成1、この構成1と比較するために圧電素子46を樹脂絶縁膜82のみで被覆した構成2を作製し、以下の評価を行った。また、ダングリングボンド密度が1×1018cm-3未満の低透水性絶縁膜80と樹脂絶縁膜82を順次積層した保護膜で被覆した構成3を作製し、同様に評価した。
次のようにして、ダングリングボンド密度が1×1018cm-3以上の低透水性絶縁膜80と樹脂絶縁膜82を順次積層して、圧電素子46を被覆した。
低透水性絶縁膜(SIOx膜)はECR CVD法でO2/SiH4比=1.2、マイクロ波電力=300W、着膜温度=100℃、ガス圧力=0.13Pa)の条件で膜厚0.5μm成膜する。この時の膜中におけるダングリングボンド密度は5×1018cm-3である。続いてポリイミド樹脂膜を塗布法により膜厚1μm成膜し、硬化熱処理をN2ガス中で300℃、20分間実施する。この熱処理によりポリイミド材料の耐インク性が大きく向上する。
次のようにして、樹脂絶縁膜82を積層して、圧電素子46を被覆した。
ポリイミド樹脂膜を塗布法により膜厚1μm成膜し、硬化熱処理をN2ガス中で300℃、20分間実施する。この熱処理によりポリイミド材料の耐インク性が大きく向上する。上記構成例1におけるポリイミド樹脂膜と同じ条件で形成している。
ダングリングボンド密度が1×1018cm-3未満の低透水性絶縁膜80と樹脂絶縁膜82を順次積層して、圧電素子46を被覆した。
絶縁膜(SiOxNy膜)はRFプラズマCVD法でN2O/SiH4比=45、RF電力=120W、着膜温度=300℃、ガス圧力=130Pa)の条件で膜厚0.5μm成膜する。この時の膜中におけるダングリングボンド密度は1×1017cm-3である。続いてポリイミド樹脂膜を塗布法により膜厚1μm成膜し、硬化熱処理をN2ガス中で300℃、20分間実施する。この熱処理によりポリイミド材料の耐インク性が大きく向上する。上記構成例1および構成例2におけるポリイミド樹脂膜と同じ条件で形成している。
上記3つの構成で作製したインクジェットヘッドを用いて下記2つの試験を実施した。
1.耐湿性試験:湿度85%、温度50℃の環境条件のもとで通電パルス試験を実施した(インクは充填しない)。圧電体は封止していないため、前記環境条件に直接さらされている。寿命の判定基準は圧電特性(静電容量)が初期値から20%低下した時のパルスの数とした。
2.耐インク性試験:ヘッドをpH9、65℃、のインクに所定時間浸漬した後、圧電素子部の腐食を光学顕微鏡と走査型電子顕微鏡で観察した。圧電素子上の保護膜(耐湿性絶縁膜とポリイミド樹脂)が消失し、電極が露出した段階を寿命と判定した。
構成1では耐湿性試験において1×1010パルスの通電試験後においても特性劣化はほとんど無く、所定の範囲内におさまった。また耐インク性試験においては400時間放置後も保護膜(ポリイミド膜)の劣化はみられなかった。
構成2では耐湿性試験において5×106パルスの通電試験後において20%特性劣化が見られた。一方、耐インク性試験においては400時間放置後も保護膜(ポリイミド膜)の劣化はみられなかった。
構成3では耐湿性試験において2×107パルスの通電試験後において20%特性劣化が見られた。一方、耐インク性試験においては400時間放置後も保護膜(ポリイミド膜)の劣化はみられなかった。
30 インクジェット記録ユニット
32 インクジェット記録ヘッド
36 インク供給ポート
38 インクプール室
40 天板
42 隔壁
44 エアダンパー
46 圧電素子
48 振動板
50 圧力室
56 ノズル
60 駆動IC
66 インク流路
68 インク流路
70 圧電素子基板
72 流路基板
76 第1支持基板
80 低透水性絶縁膜(保護膜)
82 樹脂絶縁膜(保護膜)
88 樹脂保護膜(第2樹脂絶縁膜)
86 金属配線(第二配線)
90 金属配線
100 第2支持基板
110 インク
Claims (7)
- インク滴を吐出するノズルと、
前記ノズルと連通し、インクが充填される圧力室と、
前記圧力室の一部を構成する振動板と、
前記圧力室へインク流路を介して供給するインクをプールするインクプール室と、
前記振動板を変位させる圧電素子と、
を有するインクジェット記録ヘッドにおいて、
前記圧電素子は、圧電体と前記圧電体を挟む二つの電極とを有し、且つ低透水性絶縁膜と樹脂絶縁膜とを順次積層した保護膜で被覆されており、
前記電極の一方に接続される第一配線が設けられ、前記保護膜はさらに前記第一配線を被覆し層間絶縁膜として機能させており、
前記保護膜は、前記インクプール室に面しており、
前記低透水性絶縁膜は、ダングリングボンド密度が1×10 18 cm -3 以上5×10 19 cm -3 以下であることを特徴とするインクジェット記録ヘッド。 - 前記樹脂絶縁膜は、ポリイミド系、ポリアミド系、エポキシ系、ポリウレタン系、又はシリコーン系の樹脂膜で構成されることを特徴とする請求項1に記載のインクジェット記録ヘッド。
- 前記低透水性絶縁膜は、ECR(Electron Cyclotron Resonance)法で形成されることを特徴とする請求項1に記載のインクジェット記録ヘッド。
- 前記低透水性絶縁膜は、Si系酸化膜、Si系窒化膜、又はSi系酸窒化膜で構成されることを特徴とする請求項1に記載のインクジェット記録ヘッド。
- 前記保護膜上には前記電極の一方に接続される第二配線が設けられ、さらに当該配線を覆うように第2樹脂絶縁膜が設けられていることを特徴とする請求項1に記載のインクジェット記録ヘッド。
- 前記第2樹脂絶縁膜は、前記保護膜として設けられる前記樹脂絶縁膜と同一の樹脂膜で構成されることを特徴とする請求項5に記載の圧電素子。
- 請求項1〜6のいずれか1項に記載のインクジェット記録ヘッドを備えたことを特徴とするインクジェット記録装置。
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