JP7270380B2 - 電子パッケージ内の無線周波数構造 - Google Patents

電子パッケージ内の無線周波数構造 Download PDF

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JP7270380B2
JP7270380B2 JP2018555952A JP2018555952A JP7270380B2 JP 7270380 B2 JP7270380 B2 JP 7270380B2 JP 2018555952 A JP2018555952 A JP 2018555952A JP 2018555952 A JP2018555952 A JP 2018555952A JP 7270380 B2 JP7270380 B2 JP 7270380B2
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coaxial structure
cavity
transmission layer
open coaxial
conductor
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Japanese (ja)
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JP2019519095A (ja
JP2019519095A5 (https=
Inventor
マリオ・ボナッツォーリ
ロベルト・ガレオッティ
ルイージ・ゴッビ
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ルメンタム・テクノロジー・ユーケー・リミテッド
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Priority to JP2022030933A priority Critical patent/JP7367096B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/045—Coaxial joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/037—Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Details Of Aerials (AREA)
JP2018555952A 2016-04-26 2017-04-24 電子パッケージ内の無線周波数構造 Active JP7270380B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022030933A JP7367096B2 (ja) 2016-04-26 2022-03-01 電子パッケージ内の無線周波数構造

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1607216.7A GB2549728A (en) 2016-04-26 2016-04-26 Radiofrequency structures in electronic packages
GB1607216.7 2016-04-26
PCT/GB2017/051127 WO2017187142A1 (en) 2016-04-26 2017-04-24 Radiofrequency structures in electronic packages

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022030933A Division JP7367096B2 (ja) 2016-04-26 2022-03-01 電子パッケージ内の無線周波数構造

Publications (3)

Publication Number Publication Date
JP2019519095A JP2019519095A (ja) 2019-07-04
JP2019519095A5 JP2019519095A5 (https=) 2020-06-18
JP7270380B2 true JP7270380B2 (ja) 2023-05-10

Family

ID=58638891

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018555952A Active JP7270380B2 (ja) 2016-04-26 2017-04-24 電子パッケージ内の無線周波数構造
JP2022030933A Active JP7367096B2 (ja) 2016-04-26 2022-03-01 電子パッケージ内の無線周波数構造

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022030933A Active JP7367096B2 (ja) 2016-04-26 2022-03-01 電子パッケージ内の無線周波数構造

Country Status (6)

Country Link
US (1) US10720688B2 (https=)
EP (1) EP3449703B1 (https=)
JP (2) JP7270380B2 (https=)
CN (1) CN109076691B (https=)
GB (1) GB2549728A (https=)
WO (1) WO2017187142A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113131166B (zh) * 2019-12-30 2022-05-03 清华大学 电路板信号传输装置
US12564064B2 (en) 2023-01-12 2026-02-24 Bae Systems Information And Electronic Systems Integration Inc. RF bridge

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757272A (en) 1972-07-12 1973-09-04 Raytheon Co Strip transmission line coupler
JPS5822321Y2 (ja) * 1978-12-12 1983-05-13 富士通株式会社 垂直変換回路
JPS61100004U (https=) * 1984-12-05 1986-06-26
US4951011A (en) * 1986-07-24 1990-08-21 Harris Corporation Impedance matched plug-in package for high speed microwave integrated circuits
US5356298A (en) 1993-04-01 1994-10-18 Trw Inc. Wideband solderless right-angle RF interconnect
JP2661600B2 (ja) * 1995-09-27 1997-10-08 日本電気株式会社 同軸とストリップとの線路接続構造
US5797765A (en) * 1996-11-01 1998-08-25 Hewlett-Packard Company Coaxial connector for mounting on a circuit substrate
US20040038587A1 (en) 2002-08-23 2004-02-26 Yeung Hubert K. High frequency coaxial connector for microcircuit packaging
JP2008053799A (ja) * 2006-08-22 2008-03-06 Molex Inc 回路基板
US7484900B2 (en) 2006-10-05 2009-02-03 Avanex Corporation Air cavity plastic package for high frequency optical devices
US7750764B2 (en) * 2008-02-27 2010-07-06 Microsemi Corporation Coaxial-to-microstrip transitions and manufacturing methods
JP5682182B2 (ja) 2010-08-30 2015-03-11 富士通オプティカルコンポーネンツ株式会社 光変調器モジュール
US9178261B2 (en) * 2012-07-11 2015-11-03 University Of South Florida Vertical microcoaxial interconnects
JP5978149B2 (ja) * 2013-02-18 2016-08-24 株式会社フジクラ モード変換器の製造方法
TWI563718B (en) * 2015-06-11 2016-12-21 Univ Nat Taipei Technology Vertical Transition Structure
CN105024126B (zh) 2015-06-23 2018-05-01 西安空间无线电技术研究所 一种垂直型同轴-微带转换电路

Also Published As

Publication number Publication date
WO2017187142A1 (en) 2017-11-02
EP3449703B1 (en) 2025-07-23
JP2022066317A (ja) 2022-04-28
US10720688B2 (en) 2020-07-21
JP7367096B2 (ja) 2023-10-23
CN109076691B (zh) 2021-04-13
JP2019519095A (ja) 2019-07-04
CN109076691A (zh) 2018-12-21
GB2549728A (en) 2017-11-01
EP3449703A1 (en) 2019-03-06
US20190124759A1 (en) 2019-04-25

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