GB2549728A - Radiofrequency structures in electronic packages - Google Patents

Radiofrequency structures in electronic packages Download PDF

Info

Publication number
GB2549728A
GB2549728A GB1607216.7A GB201607216A GB2549728A GB 2549728 A GB2549728 A GB 2549728A GB 201607216 A GB201607216 A GB 201607216A GB 2549728 A GB2549728 A GB 2549728A
Authority
GB
United Kingdom
Prior art keywords
transmission layer
coaxial structure
cavity
open coaxial
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB1607216.7A
Other languages
English (en)
Inventor
Bonazzoli Mario
Galeotti Roberto
Gobbi Luigi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumentum Technology UK Ltd
Original Assignee
Oclaro Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oclaro Technology Ltd filed Critical Oclaro Technology Ltd
Priority to GB1607216.7A priority Critical patent/GB2549728A/en
Priority to JP2018555952A priority patent/JP7270380B2/ja
Priority to PCT/GB2017/051127 priority patent/WO2017187142A1/en
Priority to CN201780024486.4A priority patent/CN109076691B/zh
Priority to US16/090,557 priority patent/US10720688B2/en
Priority to EP17719895.9A priority patent/EP3449703B1/en
Publication of GB2549728A publication Critical patent/GB2549728A/en
Priority to JP2022030933A priority patent/JP7367096B2/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/045—Coaxial joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/037—Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Details Of Aerials (AREA)
GB1607216.7A 2016-04-26 2016-04-26 Radiofrequency structures in electronic packages Withdrawn GB2549728A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB1607216.7A GB2549728A (en) 2016-04-26 2016-04-26 Radiofrequency structures in electronic packages
JP2018555952A JP7270380B2 (ja) 2016-04-26 2017-04-24 電子パッケージ内の無線周波数構造
PCT/GB2017/051127 WO2017187142A1 (en) 2016-04-26 2017-04-24 Radiofrequency structures in electronic packages
CN201780024486.4A CN109076691B (zh) 2016-04-26 2017-04-24 电子封装中的射频结构
US16/090,557 US10720688B2 (en) 2016-04-26 2017-04-24 RF transition assembly comprising an open coaxial structure with a cavity for receiving a conductor that is coupled orthogonal to an RF transmission layer
EP17719895.9A EP3449703B1 (en) 2016-04-26 2017-04-24 Radiofrequency structures in electronic packages
JP2022030933A JP7367096B2 (ja) 2016-04-26 2022-03-01 電子パッケージ内の無線周波数構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1607216.7A GB2549728A (en) 2016-04-26 2016-04-26 Radiofrequency structures in electronic packages

Publications (1)

Publication Number Publication Date
GB2549728A true GB2549728A (en) 2017-11-01

Family

ID=58638891

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1607216.7A Withdrawn GB2549728A (en) 2016-04-26 2016-04-26 Radiofrequency structures in electronic packages

Country Status (6)

Country Link
US (1) US10720688B2 (https=)
EP (1) EP3449703B1 (https=)
JP (2) JP7270380B2 (https=)
CN (1) CN109076691B (https=)
GB (1) GB2549728A (https=)
WO (1) WO2017187142A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12564064B2 (en) 2023-01-12 2026-02-24 Bae Systems Information And Electronic Systems Integration Inc. RF bridge

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113131166B (zh) * 2019-12-30 2022-05-03 清华大学 电路板信号传输装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100289596A1 (en) * 2006-08-22 2010-11-18 Molex Incorporated Impedance matched circuit board
US20150035615A1 (en) * 2012-07-11 2015-02-05 University Of South Florida (A Florida Non-Profit Corporation) Vertical microcoaxial interconnects
EP2958188A1 (en) * 2013-02-18 2015-12-23 Fujikura Ltd. Mode converter and production method therefor

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757272A (en) 1972-07-12 1973-09-04 Raytheon Co Strip transmission line coupler
JPS5822321Y2 (ja) * 1978-12-12 1983-05-13 富士通株式会社 垂直変換回路
JPS61100004U (https=) * 1984-12-05 1986-06-26
US4951011A (en) * 1986-07-24 1990-08-21 Harris Corporation Impedance matched plug-in package for high speed microwave integrated circuits
US5356298A (en) 1993-04-01 1994-10-18 Trw Inc. Wideband solderless right-angle RF interconnect
JP2661600B2 (ja) * 1995-09-27 1997-10-08 日本電気株式会社 同軸とストリップとの線路接続構造
US5797765A (en) * 1996-11-01 1998-08-25 Hewlett-Packard Company Coaxial connector for mounting on a circuit substrate
US20040038587A1 (en) 2002-08-23 2004-02-26 Yeung Hubert K. High frequency coaxial connector for microcircuit packaging
US7484900B2 (en) 2006-10-05 2009-02-03 Avanex Corporation Air cavity plastic package for high frequency optical devices
US7750764B2 (en) * 2008-02-27 2010-07-06 Microsemi Corporation Coaxial-to-microstrip transitions and manufacturing methods
JP5682182B2 (ja) 2010-08-30 2015-03-11 富士通オプティカルコンポーネンツ株式会社 光変調器モジュール
TWI563718B (en) * 2015-06-11 2016-12-21 Univ Nat Taipei Technology Vertical Transition Structure
CN105024126B (zh) 2015-06-23 2018-05-01 西安空间无线电技术研究所 一种垂直型同轴-微带转换电路

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100289596A1 (en) * 2006-08-22 2010-11-18 Molex Incorporated Impedance matched circuit board
US20150035615A1 (en) * 2012-07-11 2015-02-05 University Of South Florida (A Florida Non-Profit Corporation) Vertical microcoaxial interconnects
EP2958188A1 (en) * 2013-02-18 2015-12-23 Fujikura Ltd. Mode converter and production method therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12564064B2 (en) 2023-01-12 2026-02-24 Bae Systems Information And Electronic Systems Integration Inc. RF bridge

Also Published As

Publication number Publication date
JP7270380B2 (ja) 2023-05-10
WO2017187142A1 (en) 2017-11-02
EP3449703B1 (en) 2025-07-23
JP2022066317A (ja) 2022-04-28
US10720688B2 (en) 2020-07-21
JP7367096B2 (ja) 2023-10-23
CN109076691B (zh) 2021-04-13
JP2019519095A (ja) 2019-07-04
CN109076691A (zh) 2018-12-21
EP3449703A1 (en) 2019-03-06
US20190124759A1 (en) 2019-04-25

Similar Documents

Publication Publication Date Title
CN105229858B (zh) 波导型缝隙阵列天线以及缝隙阵列天线模块
US20160365684A1 (en) Vertical-transition structure
US9972880B2 (en) Method for building a connection between a coaxial RF cable and hybrid package using 3D printing and a connection receptacle
CN107636515B (zh) 光调制器
US8829659B2 (en) Integrated circuit
EP3493252A1 (en) Substrate for mounting semiconductor element and semiconductor device
JP7367096B2 (ja) 電子パッケージ内の無線周波数構造
US12120812B2 (en) Circuit board and method of manufacturing thereof
US10588215B2 (en) Inter-board connection structure
JPWO2015064637A1 (ja) 回路基板、電子部品収納用パッケージおよび電子装置
US20190181528A1 (en) Transmission line
JP2017005646A (ja) 高周波接続線路
US6100774A (en) High uniformity microstrip to modified-square-ax interconnect
KR20180088002A (ko) 전송선로-도파관 전이 장치
CN105977241B (zh) 一种用于光电子集成芯片的封装结构
US20140043190A1 (en) Planar inverted f antenna structure
US20110241803A1 (en) Signal transmission line
JP4601573B2 (ja) 導波管変換器
JP2019519095A5 (https=)
JP6871146B2 (ja) コネクタおよびコネクタ−基板接続構造
WO2021002077A1 (ja) 同軸マイクロストリップ線路変換回路
US8297985B1 (en) Connector with surface mount signal pin
KR101840214B1 (ko) 임피던스 정합 회로기판
JP4563980B2 (ja) 表面実装型パッケージ及び半導体装置
JP2000049526A (ja) 誘電体平面アンテナ

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)