Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0237—High frequency adaptations
  • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
  • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0237—High frequency adaptations
  • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
  • H01P1/00—Auxiliary devices
  • H01P1/04—Fixed joints
  • H01P1/045—Coaxial joints
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
  • H01P1/00—Auxiliary devices
  • H01P1/04—Fixed joints
  • H01P1/047—Strip line joints
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
  • H01P5/00—Coupling devices of the waveguide type
  • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
  • H01P5/085—Coaxial-line/strip-line transitions
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/11—Printed elements for providing electric connections to or between printed circuits
  • H05K1/111—Pads for surface mounting, e.g. lay-out
  • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/11—Printed elements for providing electric connections to or between printed circuits
  • H05K1/115—Via connections; Lands around holes or via connections
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
  • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
  • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
  • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
  • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
  • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
  • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/0332—Structure of the conductor
  • H05K2201/0364—Conductor shape
  • H05K2201/037—Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/0929—Conductive planes
  • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09372—Pads and lands
  • H05K2201/09481—Via in pad; Pad over filled via
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/095—Conductive through-holes or vias
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/095—Conductive through-holes or vias
  • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
  • H05K2201/09809—Coaxial layout
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/04—Soldering or other types of metallurgic bonding
  • H05K2203/049—Wire bonding

Definitions

• the present invention generally relates to radiofrequency structures. More particularly, the invention relates to radiofrequency structures comprising a transition between layers in packages for electronic or optoelectronic devices.
• Electronic devices such as optoelectronic devices are frequently formed in assemblies which contain components which are arranged in multilayer structures. There is therefore a need for structures comprising angled transitions to connect electronic components located in layers of differing heights.
• surface mounted devices are typically powered via electrical connections which pass through a package body to connect radiofrequency transmission layers disposed on opposing faces of the package body.
• the electrical connection may be orthogonal to the radiofrequency transmission layers, resulting in a pair of angled transitions of 90°.
• angled transitions are known to be problematic for high performance radiofrequency (RF) devices.
• angled transitions comprising interconnections to a circuit or radiofrequency transmission layer housed within a package may require careful impedance matching to ensure high RF performance.
• Ceramic materials may be used as a supporting structure for the radiofrequency transmission layers, in which case electrical connections can be located in holes through the ceramic material.
• US784900 describes conductors bent within a plastic material to realise a transition between internal and external conducting layers in an optoelectronic device. The bending of the conductors avoids inductance parasitic effects which may degrade the radiofrequency performance.
• a further approach for forming angled transitions uses a coaxial glass bead mounted within the package body.
• the coaxial glass bead comprises an insulating glass cylinder with a central conducting pin which may be connected to a radiofrequency transmission layer by soldering.
• This approach has the advantage that a metal package body can be used and frequently results in good radiofrequency performance.
• the approach can suffer from problems related to tolerances and process control, particularly when multiple circuits must be interconnected simultaneously.
• an RF transition assembly for enabling a radiofrequency transition between an RF transmission layer of an electronic device and a conductor which is electrically connected to the RF transmission layer.
• the conductor extends generally orthogonal to the RF transmission layer.
• the assembly comprises an open coaxial structure located adjacent to an edge of the RF transmission layer.
• the open coaxial structure comprises a cavity extending therethrough for receiving the conductor.
• the cavity comprises an opening facing the edge of the RF transmission layer so as to direct electromagnetic radiation towards the RF transmission layer.
• at least a portion of the open coaxial structure extends in the plane of the RF transmission layer.
• the cavity of the open coaxial structure guides the electromagnetic field generated by radiofrequency structure across the angled transition such that losses through microwave emission can be reduced. Electrical losses at the interfaces of the conducting elements are also reduced by the guidance effect, thereby improving RF transmission through the angled transition.
• the guidance of the electromagnetic field provided by the cavity of the open coaxial structure can be varied by altering the size and shape of the cavity.
• the cavity may have a cross section corresponding to a circular segment and the angle enclosed by the cavity may be greater than 180°.
• an angle of between about 1803 ⁇ 4nd 340°, optionally about 240°, may be used.
• the open coaxial structure may further comprise one or more ground interconnections between the open coaxial structure and one or more grounding regions associated with the RF transmission layer.
• the cavity of the open coaxial structure may extend beyond an end of the conductor adjacent to the RF transmission layer to improve the guidance of the electromagnetic field.
• the cavity of the open coaxial structure may extend beyond the end of the conductor by a length of at least the radius of the cavity.
• the open coaxial structure may be provided with one or more stepped grounding regions adjacent to the conducting layer which are approximately coplanar with one or more grounding regions of the conducting layer. Grounded interconnections may then be made between the one or more stepped grounding regions and one or more grounding regions of the conducting layer.
• the RF transition may be used in a package for an electronic device, including for example, an electro-optical modulator.
• an electronic device comprising an RF substrate mounted on a face of a package body.
• An RF transmission layer is mounted on the RF substrate such that the RF substrate forms a layer between the RF transmission layer and the package body.
• a conductor is electrically connected to the radiofrequency transmission layer and extends through the package body in a direction generally orthogonal to the RF transmission layer.
• An open coaxial structure is mounted on the face of the package body adjacent to an edge of the RF transmission layer.
• the open coaxial structure comprises a cavity extending therethrough for receiving the conductor.
• the cavity comprises an opening facing the edge of the radiofrequency transmission layer so as to direct electromagnetic radiation towards the radiofrequency transmission layer.
• an RF transition assembly for enabling radiofrequency transitions between a stacked arrangement of RF transmission layers and a conductor.
• the conductor is electrically connected to each RF transmission layer and extends generally orthogonal to the stacked arrangement of RF transmission layers.
• An open coaxial structure is located adjacent to the stacked arrangement of RF transmission layers and comprises a cavity extending therethrough for receiving the conductor.
• the cavity comprises one or more openings facing the edges of the RF transmission layers so as to direct electromagnetic radiation towards each of the RF transmission layers.
• FIG. 1 is a perspective view of a conventional RF transition involving a substrate mounted RF circuit and a coaxial glass bead;
• FIG. 2 is a section view of the RF transition shown in FIG. 1 ;
• FIG. 3 is a perspective view of an RF transition comprising an open coaxial structure
• FIG. 4 is a perspective view of an RF transition in which the open coaxial structure is grounded
• FIG. 5 is a perspective view of a further RF transition in which the open coaxial structure is grounded
• FIG. 6 is a perspective view of an alternative RF transition having an open coaxial structure
• FIG. 7 is a perspective view of a further alternative RF transition.
• FIG. 1 is a perspective view of a 90° radiofrequency transition 100 known in the art in which an upper RF transmission layer 101 , such as a transmission line or RF circuit, mounted in or on an RF substrate 103 is interconnected to a coaxial glass bead (not shown in Figure 1 ).
• the RF substrate 103 is disposed on the upper surface of a package body 105, whilst an external RF transmission layer 107, such as a flexible circuit, is located on the lower surface of the package body 105.
• the external RF transmission layer 107 and the RF circuit 101 are electrically connected by a pin or central conductor 109 of the coaxial glass bead which passes vertically through the RF substrate 103 and the package body 105, and into the external RF transmission layer 107.
• the upper RF transmission Iayer101 is connected to the central conductor 109 by a solder interconnection 1 11 to form the RF transition with an angle of 90°. It will be appreciated that “upper” and “lower” are relative terms, used with respect to the package body 105 as illustrated in the drawings. In use, the device or apparatus may be oriented in any direction.
• FIG. 2 is a section view of the 90° RF transition 100 shown in FIG. 1 .
• the coaxial glass bead 202 has a cylindrical body formed of an insulating material and provided with a central bore through which the central conductor 109 is securely mounted.
• the coaxial glass bead 202 is itself fixed within a void of the package body 105 located between the RF substrate 103 and the external RF transmission layer 107.
• the central conductor 109 is electrically connected to the RF circuit by a solder interconnection 213.
• FIG. 3 shows a perspective view of an exemplary RF transition 300.
• an open coaxial structure 313 is mounted on an upper face of a package body 305 adjacent to an RF transmission layer 301 mounted on an RF substrate 303, which is itself mounted on the upper face of the package body 305.
• the open coaxial structure 313 is shown as a layer formed on the upper face of the package body 305.
• the upper end of a central conductor 309 of a coaxial glass bead (not shown in Figure 3) is also located adjacent to the RF transmission layer 301 and accommodated within a cavity 315 formed in the open coaxial structure 313.
• the cavity 315 of the open coaxial structure 313 comprises an opening facing the RF transmission layer 301 and may have a cross section corresponding to a circular segment.
• the cavity 325 may be a cylindrical segment formed by truncating a cylinder in a plane parallel to the axis of the cylinder.
• the central conductor 309 of the coaxial glass bead and the RF transmission layer 301 may be interconnected by a bonding interconnection 317, such as a ribbon or wire bonding interconnection, or an alternative interconnection technique may be used.
• the central conductor 309, the RF transmission layer 301 and the open coaxial structure 313 extend to a similar height above the upper surface of the package body 305.
• the cavity 315 of the open coaxial structure 313 guides the electromagnetic field across the 90° angle from the central conductor 309 of the coaxial glass bead towards the RF transmission layer 301 , thereby improving the transition feature by reducing RF electrical losses, and leading to improvements in circuit (and device) electrical performance.
• the angled transition is not limited to a 90° transition and the present invention may also be used for angled transitions of greater than or less than 90°.
• the open coaxial structure may be formed from a conductive material or from a dielectric or ceramic which is plated with a conductive material.
• the open coaxial structure may also be integrated with a conducting package body.
• the cavity 315 of the open coaxial structure 313 may enclose an angle of 180°, as would be the case for a semi-cylindrical cavity, or the cavity 315 may enclose an angle that is greater than 0 ° and less than 360 °.
• the cavity 315 may enclose an angle greater than 180 ° as it has been found that this is particularly beneficial in guiding the electromagnetic field.
• the optimal size or shape of the cavity 313 or the optimal angle enclosed by the cavity 313 may depend on the diameter of the central conductor 309, the material from which the open coaxial structure 313 is formed and any RF performance requirement, such a particular impedance or required transmission frequency. An angle of about 240° has been found to be particularly suitable in forming a 50 Ohm RF transition, for example.
• FIG. 4 illustrates a modification to the arrangement of Figure 3 in which the open coaxial structure 313 is electrically grounded to one or more grounding regions 419 located adjacent to the RF transmission layer 301 on the upper surface of the substrate 303.
• the electrical grounding may be provided by one or more ground interconnections 421 extending between a grounding region 419 of the RF substrate 303 and the open coaxial structure 313.
• the cavity encloses more than 180°, and this has the further beneficial effect of improving the ground reporting between the open coaxial structure 313 and the grounding regions 419 by minimising the length of the ground interconnections 421 .
• FIG. 5 illustrates a modification to the arrangement of Figure 4 in which the open coaxial structure 513 is separated from the RF substrate 303 by a gap 510.
• the cavity 515 of the open coaxial structure 313 encloses an angle of 180° and the grounded interconnections 521 are wire interconnections.
• FIG. 6 shows an alternative arrangement for an RF transition 600, in which the open coaxial structure 613 extends in a direction away from the upper surface of the package body 305 such that the open coaxial structure 613 extends above the upper end of the central conductor 309.
• the end of the central conductor 309 and the RF transmission layer 301 are a similar height above the upper surface of the package body 305.
• the extended height of the open coaxial structure 513 with respect to the central conductor 309 produces an additional guidance effect for the electromagnetic field associated with the RF transition.
• FIG. 7 illustrates a further modification of the arrangement of Figure 6, in which the upper surface of the open coaxial structure 713 comprises one or more stepped grounding regions 723 adjacent to the substrate 303 which are lower in height than the remainder of the open coaxial structure 713.
• the one or more stepped grounding regions 723 of the open coaxial structure 713 should be located adjacent to a grounding region 419 of the RF substrate 303 to minimise the length of the grounding interconnections 521 and facilitate ground reporting.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
• Details Of Aerials (AREA)

Priority Applications (4)

Applications Claiming Priority (2)

Publications (1)

Family

ID=58638891

Family Applications (1)

Country Status (6)

Families Citing this family (2)

Citations (3)

Family Cites Families (13)

• 2016
  • 2016-04-26 GB GB1607216.7A patent/GB2549728A/en not_active Withdrawn
• 2017
  • 2017-04-24 EP EP17719895.9A patent/EP3449703B1/en active Active
  • 2017-04-24 US US16/090,557 patent/US10720688B2/en active Active
  • 2017-04-24 WO PCT/GB2017/051127 patent/WO2017187142A1/en not_active Ceased
  • 2017-04-24 CN CN201780024486.4A patent/CN109076691B/zh active Active
  • 2017-04-24 JP JP2018555952A patent/JP7270380B2/ja active Active
• 2022
  • 2022-03-01 JP JP2022030933A patent/JP7367096B2/ja active Active

Patent Citations (3)

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events