JP7269347B2 - 変形可能な導体を有する構造体 - Google Patents

変形可能な導体を有する構造体 Download PDF

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Publication number
JP7269347B2
JP7269347B2 JP2021533390A JP2021533390A JP7269347B2 JP 7269347 B2 JP7269347 B2 JP 7269347B2 JP 2021533390 A JP2021533390 A JP 2021533390A JP 2021533390 A JP2021533390 A JP 2021533390A JP 7269347 B2 JP7269347 B2 JP 7269347B2
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Japan
Prior art keywords
layer
substrate
pattern
contacts
insulating material
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JP2021533390A
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Japanese (ja)
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JPWO2020041605A5 (enExample
JP2021534596A (ja
Inventor
マーク ローナイ，
トレバー スピゲル アントニオ リビエラ，
マイケル アドベンチャー ホプキンス，
エドワード ゴッドシャルク，
チャールズ キンツェル，
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Liquid Wire Inc
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Liquid Wire Inc
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Publication of JP2021534596A publication Critical patent/JP2021534596A/ja
Publication of JPWO2020041605A5 publication Critical patent/JPWO2020041605A5/ja
Priority to JP2023069953A priority Critical patent/JP7577784B2/ja
Application granted granted Critical
Publication of JP7269347B2 publication Critical patent/JP7269347B2/ja
Priority to JP2024186955A priority patent/JP2025013940A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2021533390A 2018-08-22 2019-08-22 変形可能な導体を有する構造体 Active JP7269347B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023069953A JP7577784B2 (ja) 2018-08-22 2023-04-21 変形可能な導体を有する構造体
JP2024186955A JP2025013940A (ja) 2018-08-22 2024-10-23 変形可能な導体を有する構造体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862721538P 2018-08-22 2018-08-22
US62/721,538 2018-08-22
PCT/US2019/047731 WO2020041605A1 (en) 2018-08-22 2019-08-22 Structures with deformable conductors

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023069953A Division JP7577784B2 (ja) 2018-08-22 2023-04-21 変形可能な導体を有する構造体

Publications (3)

Publication Number Publication Date
JP2021534596A JP2021534596A (ja) 2021-12-09
JPWO2020041605A5 JPWO2020041605A5 (enExample) 2022-08-30
JP7269347B2 true JP7269347B2 (ja) 2023-05-08

Family

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Family Applications (3)

Application Number Title Priority Date Filing Date
JP2021533390A Active JP7269347B2 (ja) 2018-08-22 2019-08-22 変形可能な導体を有する構造体
JP2023069953A Active JP7577784B2 (ja) 2018-08-22 2023-04-21 変形可能な導体を有する構造体
JP2024186955A Pending JP2025013940A (ja) 2018-08-22 2024-10-23 変形可能な導体を有する構造体

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023069953A Active JP7577784B2 (ja) 2018-08-22 2023-04-21 変形可能な導体を有する構造体
JP2024186955A Pending JP2025013940A (ja) 2018-08-22 2024-10-23 変形可能な導体を有する構造体

Country Status (5)

Country Link
US (4) US11088063B2 (enExample)
EP (1) EP3841850A4 (enExample)
JP (3) JP7269347B2 (enExample)
CN (1) CN112956283A (enExample)
WO (1) WO2020041605A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11955420B2 (en) 2018-08-22 2024-04-09 Liquid Wire Inc. Structures with deformable conductors

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11880498B2 (en) 2019-03-27 2024-01-23 Liquid Wire Inc. Deformable human interface device
WO2021146643A2 (en) 2020-01-15 2021-07-22 Liquid Wire Inc. Deposition with solid feedstock
JP2023517885A (ja) * 2020-03-04 2023-04-27 リキッド ワイヤ インコーポレイテッド 変形可能なインダクタ
FR3108780B1 (fr) * 2020-03-30 2022-03-18 Commissariat Energie Atomique Procédé de réalisation d’une zone d’individualisation d’un circuit intégré
CN116171376A (zh) 2020-06-12 2023-05-26 液态电线公司 多轴差动应变传感器
US11937372B2 (en) 2020-06-24 2024-03-19 Yale University Biphasic material and stretchable circuit board
US12096563B2 (en) 2020-08-31 2024-09-17 Liquid Wire Inc. Flexible and stretchable structures
JP2024516192A (ja) 2021-02-26 2024-04-12 リキッド ワイヤ エルエルシー 非常にサスティナブルな回路を製造または使用するための装置、システム、および方法
WO2022246402A1 (en) 2021-05-18 2022-11-24 Liquid Wire Inc. Flexible high-power electronics bus
EP4120806A1 (en) 2021-07-15 2023-01-18 Imec VZW An interconnect, an electronic assembly and a method for manufacturing an electronic assembly
US20250016931A1 (en) 2021-07-30 2025-01-09 Liquid Wire Inc. Flexible and stretchable structures
EP4388825A1 (en) * 2021-08-16 2024-06-26 Liquid Wire Inc. Stretchable and flexible metal film structures
EP4397143A1 (en) * 2021-08-31 2024-07-10 Liquid Wire Inc. Flexible and stretchable structures
US20240428981A1 (en) 2021-10-22 2024-12-26 Liquid Wire Inc. Flexible three-dimensional electronic component
US20240418495A1 (en) 2021-10-27 2024-12-19 Liquid Wire Inc. Two-dimensional motion capture strain sensors
WO2023147358A1 (en) 2022-01-25 2023-08-03 Liquid Wire Inc. Electronic component appliques
US12431418B2 (en) * 2022-05-20 2025-09-30 Micron Technology, Inc. Three dimensional semiconductor trace length matching and associated systems and methods

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183092A (ja) 1998-12-16 2000-06-30 Matsushita Electric Ind Co Ltd バンプ付電子部品の実装構造および実装方法
JP2000286555A (ja) 1999-03-30 2000-10-13 Sumitomo Metal Electronics Devices Inc セラミック基板及びその製造方法
WO2015151433A1 (ja) 2014-04-01 2015-10-08 パナソニックＩｐマネジメント株式会社 部品実装基板
JP2016143763A (ja) 2015-02-02 2016-08-08 株式会社フジクラ 伸縮性回路基板

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4729003A (en) 1984-08-31 1988-03-01 Texas Instruments Incorporated Configuration of a metal insulator semiconductor with a processor based gate
JPH0666549B2 (ja) 1988-08-31 1994-08-24 信越ポリマー株式会社 スルーホール付きフレキシブル基板の製造方法
US5198189A (en) 1989-08-03 1993-03-30 International Business Machines Corporation Liquid metal matrix thermal paste
US5056706A (en) 1989-11-20 1991-10-15 Microelectronics And Computer Technology Corporation Liquid metal paste for thermal and electrical connections
US5478978A (en) 1993-02-25 1995-12-26 The Center For Innovative Technology Electrical switches and sensors which use a non-toxic liquid metal composition
US5792236A (en) 1993-02-25 1998-08-11 Virginia Tech Intellectual Properties, Inc. Non-toxic liquid metal composition for use as a mercury substitute
US5391846A (en) 1993-02-25 1995-02-21 The Center For Innovative Technology Alloy substitute for mercury in switch applications
JPH0715122A (ja) * 1993-06-23 1995-01-17 Matsushita Electric Ind Co Ltd 接合用フィルム構体および電子部品実装方法
JP3311899B2 (ja) * 1995-01-20 2002-08-05 松下電器産業株式会社 回路基板及びその製造方法
JP3610999B2 (ja) * 1996-06-07 2005-01-19 松下電器産業株式会社 半導体素子の実装方法
US6812624B1 (en) 1999-07-20 2004-11-02 Sri International Electroactive polymers
US6781284B1 (en) 1997-02-07 2004-08-24 Sri International Electroactive polymer transducers and actuators
US6064116A (en) 1997-06-06 2000-05-16 Micron Technology, Inc. Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
US5961144A (en) 1997-11-12 1999-10-05 Trw Inc. Folded combination horn pad and driver position sensor assembly and method for providing the assembly
US6462414B1 (en) * 1999-03-05 2002-10-08 Altera Corporation Integrated circuit package utilizing a conductive structure for interlocking a conductive ball to a ball pad
WO2000059033A1 (fr) * 1999-03-25 2000-10-05 Seiko Epson Corporation Tableau de repartition, tableau de connexion, dispositif semi-conducteur, son procede de fabrication, carte de circuit imprime, et instrument electronique
DE20007729U1 (de) * 2000-04-28 2000-08-03 Siemens AG, 80333 München Leiterplatte
JP4401070B2 (ja) * 2002-02-05 2010-01-20 ソニー株式会社 半導体装置内蔵多層配線基板及びその製造方法
KR100998039B1 (ko) * 2003-10-01 2010-12-03 삼성테크윈 주식회사 기판 제조 방법 및 이를 이용하여 제조된 스마트 라벨
WO2005058083A2 (en) 2003-12-12 2005-06-30 Beck Gregory S Safety helmet with shock detector, helmet attachement device with shock detector & methods
TWI347151B (en) * 2004-03-19 2011-08-11 Panasonic Corp Flexible substrate having interlaminar junctions, and process for producing the same
CN100502621C (zh) * 2004-04-06 2009-06-17 株式会社村田制作所 内部导体的连接结构及多层基板
CN101048868B (zh) * 2004-08-20 2010-06-09 佐伊科比株式会社 具有三维层叠结构的半导体器件的制造方法
EP1720389B1 (en) 2005-04-25 2019-07-03 Brother Kogyo Kabushiki Kaisha Method for forming pattern and a wired board
KR20080023303A (ko) * 2005-05-18 2008-03-13 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 마이크로유체 그물구조 내 전도성 경로, 마이크로회로 및마이크로구조물의 제작
JP5568206B2 (ja) 2006-09-15 2014-08-06 東海ゴム工業株式会社 変形センサ
US20100052163A1 (en) * 2007-04-27 2010-03-04 Nec Corporation Semiconductor device, method of manufacturing same and method of repairing same
FR2922342B1 (fr) 2007-10-11 2010-07-30 Ask Sa Support de dispositif d'identification radiofrequence renforce et son procede de fabrication
US7939945B2 (en) * 2008-04-30 2011-05-10 Intel Corporation Electrically conductive fluid interconnects for integrated circuit devices
US8097926B2 (en) * 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US7854173B2 (en) 2008-11-28 2010-12-21 The Hong Kong Polytechnic University Strain sensor
CN101505575B (zh) * 2008-12-26 2011-01-19 深圳大学 一种基于pdms生物可兼容性的柔性电路的制作方法
US8329493B2 (en) * 2009-03-20 2012-12-11 University Of Utah Research Foundation Stretchable circuit configuration
JP2011017626A (ja) 2009-07-09 2011-01-27 Sony Corp 力学量検知部材及び力学量検知装置
WO2012060427A1 (ja) 2010-11-04 2012-05-10 東海ゴム工業株式会社 曲げセンサ
US8069735B1 (en) 2010-11-10 2011-12-06 Artann Laboratories Inc. Tactile sensor array for soft tissue elasticity imaging
JP5740484B2 (ja) 2010-12-22 2015-06-24 カーディオインサイト テクノロジーズ インコーポレイテッド 多層センサー装置
US8896125B2 (en) * 2011-07-05 2014-11-25 Sony Corporation Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
WO2013075234A1 (en) 2011-11-22 2013-05-30 Westport Power Inc. Apparatus and method for fuelling a flexible-fuel internal combustion engine
TWI473218B (zh) 2012-07-26 2015-02-11 欣興電子股份有限公司 穿孔中介板及其製法與封裝基板及其製法
WO2014058806A1 (en) 2012-10-08 2014-04-17 Stc.Unm Improved pliable pressure-sensing fabric
JP2014086664A (ja) * 2012-10-26 2014-05-12 Nec Corp 配線基板、電子機器、および配線基板の製造方法
IL225374A0 (en) 2013-03-21 2013-07-31 Noveto Systems Ltd Array@Matamari
KR101497230B1 (ko) 2013-08-20 2015-02-27 삼성전기주식회사 전자부품 내장기판 및 전자부품 내장기판 제조방법
WO2015029951A1 (ja) * 2013-08-26 2015-03-05 日立金属株式会社 実装基板用ウエハ、多層セラミックス基板、実装基板、チップモジュール、及び実装基板用ウエハの製造方法
CN103474809B (zh) * 2013-09-20 2016-08-10 番禺得意精密电子工业有限公司 电连接器及其制造方法
JP6308493B2 (ja) 2013-12-03 2018-04-11 国立大学法人 筑波大学 漆塗膜の加工方法
EP3092661A4 (en) 2014-01-06 2017-09-27 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
US9753568B2 (en) 2014-05-15 2017-09-05 Bebop Sensors, Inc. Flexible sensors and applications
KR101689547B1 (ko) 2015-01-22 2016-12-26 주식회사 유니드 전기 접속 구조의 제조 방법
JP2016178121A (ja) * 2015-03-18 2016-10-06 タツタ電線株式会社 ストレッチャブルケーブルおよびストレッチャブル回路基板
KR102432009B1 (ko) 2015-09-03 2022-08-12 엘지이노텍 주식회사 압력 센서
CN108135362B (zh) 2015-10-06 2021-07-09 Lg伊诺特有限公司 压力感测椅
US10406269B2 (en) 2015-12-29 2019-09-10 Fresenius Medical Care Holdings, Inc. Electrical sensor for fluids
US10617809B2 (en) 2015-12-29 2020-04-14 Fresenius Medical Care Holdings, Inc. Electrical sensor for fluids
US11156509B2 (en) 2016-02-29 2021-10-26 Liquid Wire Inc. Sensors with deformable conductors and selective deformation
US10672530B2 (en) 2016-02-29 2020-06-02 Liquid Wire Inc. Deformable conductors and related sensors, antennas and multiplexed systems
US10304604B2 (en) 2016-05-03 2019-05-28 The United States Of America As Represented By The Secretary Of The Army Deformable inductive devices having a magnetic core formed of an elastomer with magnetic particles therein along with a deformable electrode
US10039186B2 (en) 2016-09-16 2018-07-31 Intel Corporation Stretchable and flexible electrical substrate interconnections
US11184975B2 (en) 2017-02-06 2021-11-23 Carnegie Mellon University Method of creating a flexible circuit
US10275069B2 (en) 2017-09-22 2019-04-30 Apple Inc. Pressure resistant force sensing enclosure
EP3841850A4 (en) 2018-08-22 2022-10-26 Liquid Wire Inc. STRUCTURES WITH DEFORMABLE LADDERS

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183092A (ja) 1998-12-16 2000-06-30 Matsushita Electric Ind Co Ltd バンプ付電子部品の実装構造および実装方法
JP2000286555A (ja) 1999-03-30 2000-10-13 Sumitomo Metal Electronics Devices Inc セラミック基板及びその製造方法
WO2015151433A1 (ja) 2014-04-01 2015-10-08 パナソニックＩｐマネジメント株式会社 部品実装基板
JP2016143763A (ja) 2015-02-02 2016-08-08 株式会社フジクラ 伸縮性回路基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11955420B2 (en) 2018-08-22 2024-04-09 Liquid Wire Inc. Structures with deformable conductors
US12125778B2 (en) 2018-08-22 2024-10-22 Liquid Wire Inc. Structures with deformable conductors

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