JP7239065B2 - 半導体パッケージ用基板材料を製造する方法、プリプレグ、及び半導体パッケージ用基板材料 - Google Patents

半導体パッケージ用基板材料を製造する方法、プリプレグ、及び半導体パッケージ用基板材料 Download PDF

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JP7239065B2
JP7239065B2 JP2022534621A JP2022534621A JP7239065B2 JP 7239065 B2 JP7239065 B2 JP 7239065B2 JP 2022534621 A JP2022534621 A JP 2022534621A JP 2022534621 A JP2022534621 A JP 2022534621A JP 7239065 B2 JP7239065 B2 JP 7239065B2
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temperature
prepreg
laminate
melt viscosity
substrate material
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JPWO2022059716A5 (https=
JPWO2022059716A1 (https=
Inventor
俊亮 大竹
一行 満倉
伸治 島岡
広明 藤田
正樹 高橋
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Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/737—Dimensions, e.g. volume or area
    • B32B2307/7375—Linear, e.g. length, distance or width
    • B32B2307/7376—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • Physics & Mathematics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
JP2022534621A 2020-09-18 2021-09-15 半導体パッケージ用基板材料を製造する方法、プリプレグ、及び半導体パッケージ用基板材料 Active JP7239065B2 (ja)

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JP2023031149A JP7764871B2 (ja) 2020-09-18 2023-03-01 半導体パッケージ用基板材料を製造する方法、プリプレグ、及び半導体パッケージ用基板材料

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PCT/JP2020/035462 WO2022059167A1 (ja) 2020-09-18 2020-09-18 半導体パッケージ用基板材料を製造する方法、プリプレグ、及び半導体パッケージ用基板材料
JPPCT/JP2020/035462 2020-09-18
PCT/JP2021/033973 WO2022059716A1 (ja) 2020-09-18 2021-09-15 半導体パッケージ用基板材料を製造する方法、プリプレグ、及び半導体パッケージ用基板材料

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JP2023031149A Active JP7764871B2 (ja) 2020-09-18 2023-03-01 半導体パッケージ用基板材料を製造する方法、プリプレグ、及び半導体パッケージ用基板材料

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023081928A (ja) * 2020-09-18 2023-06-13 株式会社レゾナック 半導体パッケージ用基板材料を製造する方法、プリプレグ、及び半導体パッケージ用基板材料

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KR20240053065A (ko) * 2021-09-15 2024-04-23 가부시끼가이샤 레조낙 반도체 패키지용 기판 재료를 제조하는 방법, 프리프레그, 및 프리프레그의 응용
KR20250120288A (ko) * 2022-12-07 2025-08-08 가부시끼가이샤 레조낙 금속장 적층판, 프린트 배선판 및 반도체 패키지
JP7635894B2 (ja) * 2022-12-07 2025-02-26 株式会社レゾナック 金属張り積層板、プリント配線板及び半導体パッケージ
WO2025154213A1 (ja) * 2024-01-17 2025-07-24 株式会社レゾナック 半導体パッケージを製造する方法、半導体パッケージ用基板材料、及び半導体パッケージ用基板材料を製造する方法
WO2025154212A1 (ja) * 2024-01-17 2025-07-24 株式会社レゾナック 半導体パッケージ用基板及びその製造方法、配線基板、並びに半導体パッケージ

Citations (6)

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JP2016050294A (ja) 2014-09-02 2016-04-11 日立化成株式会社 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、積層板及びプリント配線板
JP2016060870A (ja) 2014-09-19 2016-04-25 日立化成株式会社 熱硬化性樹脂組成物及びその製造方法、並びにこれを用いたプリプレグ、積層板及びプリント配線板
JP2016069389A (ja) 2014-09-26 2016-05-09 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板及びプリント配線板
JP2017008174A (ja) 2015-06-19 2017-01-12 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP2019172898A (ja) 2018-03-29 2019-10-10 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
WO2019230943A1 (ja) 2018-06-01 2019-12-05 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板

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JPH08198982A (ja) 1995-01-24 1996-08-06 Matsushita Electric Works Ltd 積層板の製造方法
JPH11126978A (ja) 1997-10-24 1999-05-11 Kyocera Corp 多層配線基板
WO2022059167A1 (ja) * 2020-09-18 2022-03-24 昭和電工マテリアルズ株式会社 半導体パッケージ用基板材料を製造する方法、プリプレグ、及び半導体パッケージ用基板材料

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016050294A (ja) 2014-09-02 2016-04-11 日立化成株式会社 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、積層板及びプリント配線板
JP2016060870A (ja) 2014-09-19 2016-04-25 日立化成株式会社 熱硬化性樹脂組成物及びその製造方法、並びにこれを用いたプリプレグ、積層板及びプリント配線板
JP2016069389A (ja) 2014-09-26 2016-05-09 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板及びプリント配線板
JP2017008174A (ja) 2015-06-19 2017-01-12 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP2019172898A (ja) 2018-03-29 2019-10-10 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
WO2019230943A1 (ja) 2018-06-01 2019-12-05 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023081928A (ja) * 2020-09-18 2023-06-13 株式会社レゾナック 半導体パッケージ用基板材料を製造する方法、プリプレグ、及び半導体パッケージ用基板材料
JP7764871B2 (ja) 2020-09-18 2025-11-06 株式会社レゾナック 半導体パッケージ用基板材料を製造する方法、プリプレグ、及び半導体パッケージ用基板材料

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WO2022059167A1 (ja) 2022-03-24
TW202216868A (zh) 2022-05-01
JP2023081928A (ja) 2023-06-13
WO2022059716A1 (ja) 2022-03-24
KR20230058428A (ko) 2023-05-03
US20230331946A1 (en) 2023-10-19
JP7764871B2 (ja) 2025-11-06

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