JP7214848B2 - SiCエピタキシャル成長装置 - Google Patents
SiCエピタキシャル成長装置 Download PDFInfo
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- 239000006227 byproduct Substances 0.000 claims description 49
- 238000011144 upstream manufacturing Methods 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000000460 chlorine Substances 0.000 claims description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 5
- 229910052801 chlorine Inorganic materials 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 35
- 238000010586 diagram Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 9
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- BUMGIEFFCMBQDG-UHFFFAOYSA-N dichlorosilicon Chemical compound Cl[Si]Cl BUMGIEFFCMBQDG-UHFFFAOYSA-N 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- -1 for example Chemical compound 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/42—Silicides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02529—Silicon carbide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Treating Waste Gases (AREA)
Description
図1は、第1実施形態に係るSiCエピタキシャル成長装置の概略的な構成を示す図である。本実施形態では、エピタキシャル成長処理を行う基板として半導体ウェハWを用い、この半導体ウェハW上に単一の膜を、あるいは複数の薄膜を積層して、気相エピタキシャル成長する例を説明する。
図10は、第2実施形態に係るSiCエピタキシャル成長装置の概略的な構成を示す図である。図10では、図1に示すSiCエピタキシャル成長装置1と同様の構成要素には同じ符号を付し詳細な説明を省略する。
Claims (9)
- 少なくともシリコンおよび炭素を含むプロセスガスが導入され、前記プロセスガスによりエピタキシャル成長される基板を収容可能なチャンバと、
前記基板上へのエピタキシャル成長に伴って生成された副生成物を含んだガスを前記チャンバから排出する配管と、
前記配管の途中に設けられた圧力制御用のバルブと、を備え、
前記バルブは、前記チャンバと前記バルブとを連通する前記配管の上流部分から前記ガスが流入する流入口と、前記バルブを介して前記上流部分と連通する前記配管の下流部分へ前記ガスを流出する流出口と、を有し、少なくとも前記流出口より低い位置に前記下流部分の一部が設けられ、前記下流部分に前記副生成物を貯留可能なトラップ部を備え、
前記上流部分および前記下流部分の各々は、各々の両端部間に配置される最下部を有し、
前記バルブは、前記上流部分の前記最下部と、前記下流部分の前記最下部との間に配置されるSiCエピタキシャル成長装置。 - 少なくともシリコンおよび炭素を含むプロセスガスが導入され、前記プロセスガスによりエピタキシャル成長される基板を収容可能なチャンバと、
前記基板上へのエピタキシャル成長に伴って生成された副生成物を含んだガスを前記チャンバから排出する配管と、
前記配管の途中に設けられた圧力制御用のバルブと、を備え、
前記バルブは、前記チャンバと前記バルブとを連通する前記配管の上流部分から前記ガスが流入する流入口と、前記バルブを介して前記上流部分と連通する前記配管の下流部分へ前記ガスを流出する流出口と、を有し、少なくとも前記流出口より低い位置に前記下流部分の一部が設けられ、前記下流部分に前記副生成物を貯留可能なトラップ部を備え、
前記トラップ部は、少なくとも前記下流部分の最下部に配置されている、SiCエピタキシャル成長装置。 - 前記プロセスガスは、塩素を含む請求項1または2に記載のSiCエピタキシャル成長装置。
- 少なくとも前記流入口および前記流出口のいずれかが下向きの配管と連通する請求項1または2に記載のSiCエピタキシャル成長装置。
- 少なくとも前記流入口および流出口のいずれかと連通する前記配管は、水平部分を有し、前記水平部分の長さは、前記水平部分の直径の16倍以下である、請求項1または2に記載のSiCエピタキシャル成長装置。
- 前記上流部分における前記バルブよりも低い位置で前記副生成物を貯留可能なトラップ部をさらに備える、請求項1または2に記載のSiCエピタキシャル成長装置。
- 前記トラップ部は、前記配管に設けられ、排ガスの流れる方向に垂直な面において、前記配管に対して大きい断面積を有する請求項1または2に記載のSiCエピタキシャル成長装置。
- 前記トラップ部は、前記下流部分より取り外し可能である、請求項1または2に記載のSiCエピタキシャル成長装置。
- 前記トラップ部より上流側に、少なくとも前記トラップ部より高い位置に配置される前記配管を有する、請求項1または2に記載のSiCエピタキシャル成長装置。
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JP2023005373A JP7386365B2 (ja) | 2019-04-15 | 2023-01-17 | SiCエピタキシャル成長装置およびSiCエピタキシャル成長装置の副生成物除去方法 |
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JP2019077204 | 2019-04-15 | ||
JP2019077204 | 2019-04-15 | ||
PCT/JP2020/015890 WO2020213503A1 (ja) | 2019-04-15 | 2020-04-08 | SiCエピタキシャル成長装置 |
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JP2023005373A Division JP7386365B2 (ja) | 2019-04-15 | 2023-01-17 | SiCエピタキシャル成長装置およびSiCエピタキシャル成長装置の副生成物除去方法 |
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JPWO2020213503A1 JPWO2020213503A1 (ja) | 2020-10-22 |
JPWO2020213503A5 JPWO2020213503A5 (ja) | 2022-02-18 |
JP7214848B2 true JP7214848B2 (ja) | 2023-01-30 |
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US (1) | US20220005696A1 (ja) |
EP (1) | EP3957777A4 (ja) |
JP (2) | JP7214848B2 (ja) |
CN (1) | CN113260742A (ja) |
TW (1) | TWI753402B (ja) |
WO (1) | WO2020213503A1 (ja) |
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JP2001126999A (ja) | 1999-10-29 | 2001-05-11 | Tokyo Electron Ltd | 熱処理装置 |
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JP2013045799A (ja) | 2011-08-22 | 2013-03-04 | Nuflare Technology Inc | 成膜装置および成膜方法 |
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JP2013227648A (ja) | 2012-03-29 | 2013-11-07 | Tokyo Electron Ltd | トラップ機構、排気系及び成膜装置 |
JP2016225411A (ja) | 2015-05-28 | 2016-12-28 | 株式会社東芝 | 成膜装置 |
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JP2005108932A (ja) * | 2003-09-29 | 2005-04-21 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
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2020
- 2020-04-08 CN CN202080007995.8A patent/CN113260742A/zh active Pending
- 2020-04-08 JP JP2021514909A patent/JP7214848B2/ja active Active
- 2020-04-08 WO PCT/JP2020/015890 patent/WO2020213503A1/ja unknown
- 2020-04-08 EP EP20790913.6A patent/EP3957777A4/en active Pending
- 2020-04-13 TW TW109112395A patent/TWI753402B/zh active
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Patent Citations (7)
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JP2001044185A (ja) | 1999-07-27 | 2001-02-16 | Tokyo Electron Ltd | 処理装置の排気システム |
JP2001126999A (ja) | 1999-10-29 | 2001-05-11 | Tokyo Electron Ltd | 熱処理装置 |
JP2009016635A (ja) | 2007-07-06 | 2009-01-22 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2013045799A (ja) | 2011-08-22 | 2013-03-04 | Nuflare Technology Inc | 成膜装置および成膜方法 |
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JP2016225411A (ja) | 2015-05-28 | 2016-12-28 | 株式会社東芝 | 成膜装置 |
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JP7386365B2 (ja) | 2023-11-24 |
US20220005696A1 (en) | 2022-01-06 |
WO2020213503A1 (ja) | 2020-10-22 |
JP2023053959A (ja) | 2023-04-13 |
EP3957777A1 (en) | 2022-02-23 |
KR20210095686A (ko) | 2021-08-02 |
CN113260742A (zh) | 2021-08-13 |
TW202103221A (zh) | 2021-01-16 |
EP3957777A4 (en) | 2022-12-28 |
JPWO2020213503A1 (ja) | 2020-10-22 |
TWI753402B (zh) | 2022-01-21 |
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