JP7211669B2 - 引裂またはシワ不良を防止できる電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法 - Google Patents
引裂またはシワ不良を防止できる電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法 Download PDFInfo
- Publication number
- JP7211669B2 JP7211669B2 JP2021551986A JP2021551986A JP7211669B2 JP 7211669 B2 JP7211669 B2 JP 7211669B2 JP 2021551986 A JP2021551986 A JP 2021551986A JP 2021551986 A JP2021551986 A JP 2021551986A JP 7211669 B2 JP7211669 B2 JP 7211669B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- secondary battery
- electrolytic copper
- electrolytic
- roughness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/18—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using inorganic inhibitors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/18—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using inorganic inhibitors
- C23F11/181—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/18—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using inorganic inhibitors
- C23F11/187—Mixtures of inorganic inhibitors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/661—Metal or alloys, e.g. alloy coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/665—Composites
- H01M4/667—Composites in the form of layers, e.g. coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/70—Carriers or collectors characterised by shape or form
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M2004/021—Physical characteristics, e.g. porosity, surface area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M2004/026—Electrodes composed of, or comprising, active material characterised by the polarity
- H01M2004/027—Negative electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Description
幅方向重量偏差(%)=(重量の標準偏差/重量の算術平均)×100
谷平均粗さVMR=[粗さプロファイルの最大谷深さRv]/[表面粗さRa]
幅方向重量偏差(%)=(重量の標準偏差/重量の算術平均)×100
谷平均粗さVMR=[粗さプロファイルの最大谷深さRv]/[表面粗さRa]
電解液の単位分当りの流量偏差(%)=[(分当り流量の最大値-分当り流量の最小値)/分当り流量の平均値]×100
幅方向の重量偏差(%)=(重量の標準偏差/重量の算術平均)×100
谷平均粗さVMR=[粗さプロファイルの最大谷深さRv]/[表面粗さRa]
電解液の単位分当りの流量偏差(%)=[(分当り流量の最大値-分当り流量の最小値)/分当り流量の平均値]×100
電解銅箔表面の任意の3個の地点でMitutoyo社の粗さ計を利用して、JIS B 0601:2001規格により「粗さプロファイルの最大谷深さRv」および「表面粗さRa」をそれぞれ測定[サンプリング長さ(sampling length):4mm、スタイラスチップ(stylus tip)の半径:2μm、スタイラスチップのテーパー角(taper angle):60°、測定力(measuring force):0.75mN]した後、これらの平均値を算出し、算出した「粗さプロファイルの最大谷深さRv」および「表面粗さRa」の測定値を下記の式2により計算して「谷平均粗さVMR」を算出することができる。
谷平均粗さVMR=[粗さプロファイルの最大谷深さRv]/[表面粗さRa]
引張強度は万能試験機(UTM)を利用して測定するが、この時、サンプルを135℃で10分の間熱処理後に測定する。この時、サンプルの幅は12.7mmであり、Grip間の距離は50mmであり、テスト速度は50mm/minである。
30°~95°の回折角(2θ)範囲でX線回折法(XRD)[Target:Copper K alpha 1、2θinterval:0.01°、2θscan speed:3°/min]を実施することによって、n個の結晶面に対応するピークを有するXRDグラフ[例えば、図3に例示された通り(111)面、(200)面、(220)面、および(311)面に該当するピーク(n=4)が現れたXRDグラフ]を得、このグラフから各結晶面(hkl)のXRD回折強度[I(hkl)]を求める。また、JCPDS(Joint Committee on Powder Diffraction Standards)により規定された標準銅粉末の前記n個の結晶面それぞれに対するXRD回折強度[I0(hkl)を求める。引き続き、前記n個の結晶面のI(hkl)/I0(hkl)の算術平均値を求めた後、前記算術平均値で(220)面のI(220)/I0(220)を割ることによって(220)面集合組織係数[TC(220)]を算出する。すなわち、(220)面集合組織係数[TC(220)]は下記の式3に基づいて算出される。
電解銅箔102の幅方向に沿って位置する左側地点、中央地点、および右側地点から5cm×5cmの大きさのサンプルをそれぞれ取った後、この3個のサンプルの重量をそれぞれ測定する。引き続き、前記測定値の算術平均および標準偏差を求め、下記の式1によって幅方向の重量偏差を算出する。
幅方向の重量偏差(%)=(重量の標準偏差/重量の算術平均)×100
商業的に利用可能な負極活物質用シリコン/カーボン複合負極材100重量部に2重量部のスチレンブタジエンゴム(SBR)および2重量部のカルボキシメチルセルロース(CMC)を混合し、蒸溜水を溶剤として利用して負極活物質用スラリーを調製した。ドクターブレードを利用して10cm幅を有する実施形態1~7および比較例1~7の電解銅箔上に40μm厚さで負極活物質用スラリーを塗布し、これを120℃で乾燥し、1ton/cm2の圧力を加えて二次電池用負極を製造した。
エチレンカーボネート(EC)およびエチルメチルカーボネート(EMC)を1:2の割合で混合した非水性有機溶媒に溶質であるLiPF6を1Mの濃度で溶解して基本電解液を製造した。99.5重量%の基本電解液と0.5重量%の琥珀酸無水物(Succinic anhydride)を混合して非水電解液を製造した。
Li1.1Mn1.85Al0.05O4であるリチウムマンガン酸化物とo-LiMnO2であるorthorhombic結晶構造のリチウムマンガン酸化物を90:10(重量比)の比で混合して正極活物質を製造した。正極活物質、カーボンブラック、および結着剤であるPVDF[Poly(vinylidenefluoride)]を85:10:5(重量比)で混合して、これを有機溶媒であるNMPと混合してスラリーを製造した。このように製造されたスラリーを厚さ20μmのAl箔(foil)の両面に塗布した後、乾燥して正極を製造した。
アルミニウム缶の内部に、アルミニウム缶と絶縁されるように正極と負極を配置し、その間に非水電解液および分離膜を配置し、コイン形態のリチウム二次電池を製造した。使われた分離膜はポリプロピレン(Celgard 2325;厚さ25μm、average pore sizeφ28 nm、porosity 40%)であった。
このように製造されたリチウム二次電池を利用して、4.3V充電電圧および3.4V放電電圧で電池を駆動し、50℃の高温で0.2C率(current rate、C-rate)で100回の充/放電を遂行した。
100回の充放電後に二次電池を分解して銅箔にシワまたは引裂が発生するか否かを観察した。銅箔にシワまたは引裂が発行した場合を「発生」で表示し、発生しなかった場合を「なし」で表記した。
112a、112b:第1および第2保護層
120a、120b:第1および第2活物質層
103、104:二次電池用電極
MS:マット面
SS:シャイニー面
Claims (18)
- 銅層を含み、
0.8~12.5の谷平均粗さ(Valley Mean Roughness)、
0.49~1.28の(220)面集合組織係数[TC(220)]、
25~51kgf/mm2の引張強度、および
3%以下の幅方向の重量偏差を有する、電解銅箔;
前記幅方向の重量偏差は下記の式1で算出され、
前記谷平均粗さ(Valley Mean Roughness)は下記の式2で算出される。
[式1]
幅方向の重量偏差(%)=(重量の標準偏差/重量の算術平均)×100
[式2]
谷平均粗さ(VMR)=[粗さプロファイルの最大谷深さ(Rv)]/[表面粗さ(Ra)] - 2.5μm以下の表面粗さ(Rz)を有する、請求項1に記載の電解銅箔。
- 両面の表面粗さ(Rz)の差は0.65μm以下である、請求項1に記載の電解銅箔。
- 4~30μmの厚さを有する、請求項1に記載の電解銅箔。
- 前記銅層に配置された保護層を含む、請求項1に記載の電解銅箔。
- 前記保護層はクロム(Cr)、シラン化合物および窒素化合物のうち少なくとも一つを含む、請求項5に記載の電解銅箔。
- 電解銅箔;および
前記電解銅箔上に配置された活物質層を含むものの、
前記電解銅箔は銅層を含み;
0.8~12.5の谷平均粗さ(Valley Mean Roughness);
0.49~1.28の(220)面集合組織係数[TC(220)];
25~51kgf/mm2の引張強度;および
3%以下の幅方向の重量偏差;を有する、二次電池用電極;
前記幅方向の重量偏差は下記の式1で算出され、
前記谷平均粗さ(Valley Mean Roughness)は下記の式2で算出される。
[式1]
幅方向の重量偏差(%)=(重量の標準偏差/重量の算術平均)×100
[式2]
谷平均粗さ(VMR)=[粗さプロファイルの最大谷深さ(Rv)]/[表面粗さ(Ra)] - 前記電解銅箔は2.5μm以下の表面粗さ(Rz)を有する、請求項7に記載の二次電池用電極。
- 前記電解銅箔は両面の表面粗さ(Rz)の差が0.65μm以下である、請求項7に記載の二次電池用電極。
- 前記電解銅箔は4~30μmの厚さを有する、請求項7に記載の二次電池用電極。
- 前記電解銅箔は、前記銅層に配置された保護層を含む、請求項7に記載の二次電池用電極。
- 前記保護層はクロム(Cr)、シラン化合物および窒素化合物のうち少なくとも一つを含む、請求項11に記載の二次電池用電極。
- 前記活物質層は、
炭素;
Si、Ge、Sn、Li、Zn、Mg、Cd、Ce、NiまたはFeの金属;
前記金属を含む合金;
前記金属の酸化物;および
前記金属と炭素の複合体からなる群から選択される一つ以上の活物質を含む、請求項7に記載の二次電池用電極。 - 正極(cathode);
請求項7~請求項13のいずれか一項に記載された二次電池用電極で構成された負極(anode);
前記正極と負極の間でリチウムイオンが移動できる環境を提供する電解質(electrolyte);および
前記正極と前記負極を電気的に絶縁させる分離膜(separator)を含むことを特徴とする、二次電池。 - 電解液を準備する段階;および
前記電解液を利用して電気メッキを遂行して銅層を形成する段階を含み、
前記電解液は、
70~90g/Lの銅イオン、
50~150g/Lの硫酸、
5~45mg/Lのヒ素(As)、
5~25mg/Lのアセトアミド(Acetamide)、および
5~20mg/Lのポリプロピレングリコール(Polypropyleneglycol、PPG)を含み、
前記銅層を形成する段階は、前記電解液内に互いに離隔するように配置された電極板および回転ドラムの間に40~80A/dm2の電流密度を加える段階を含み、
前記銅層を形成する段階で、
前記電解液は単位分当り5%以下の流量偏差で供給される電解銅箔製造方法;
前記単位分当りの流量偏差は下記の式4で算出される。
[式4]
電解液の単位分当りの流量偏差(%)=[(分当り流量の最大値-分当り流量の最小値)/分当り流量の平均値]×100 - 前記銅層上に保護層を形成する段階をさらに含む、請求項15に記載の電解銅箔製造方法。
- 前記保護層を形成する段階は、クロム(Cr)、シラン化合物、および窒素化合物のうち少なくとも一つを利用して前記銅層の表面を防錆処理する段階を含む、請求項16に記載の電解銅箔製造方法。
- 前記保護層を形成する段階は、0.5~1.5g/Lのクロム(Cr)を含む防錆液内に前記銅層を浸漬させる段階を含む、請求項16に記載の電解銅箔製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2019-0150514 | 2019-11-21 | ||
KR1020190150514A KR20210062369A (ko) | 2019-11-21 | 2019-11-21 | 찢김 또는 주름 불량을 방지할 수 있는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
PCT/KR2020/015965 WO2021101176A1 (ko) | 2019-11-21 | 2020-11-13 | 찢김 또는 주름 불량을 방지할 수 있는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022522513A JP2022522513A (ja) | 2022-04-19 |
JP7211669B2 true JP7211669B2 (ja) | 2023-01-24 |
Family
ID=75980849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021551986A Active JP7211669B2 (ja) | 2019-11-21 | 2020-11-13 | 引裂またはシワ不良を防止できる電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20220200010A1 (ja) |
EP (1) | EP3919655A4 (ja) |
JP (1) | JP7211669B2 (ja) |
KR (1) | KR20210062369A (ja) |
CN (1) | CN113661587A (ja) |
MY (1) | MY196205A (ja) |
TW (1) | TWI747626B (ja) |
WO (1) | WO2021101176A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI777760B (zh) | 2021-08-09 | 2022-09-11 | 頎邦科技股份有限公司 | 具散熱片之軟性電路板及其散熱片 |
KR20240039471A (ko) | 2022-09-19 | 2024-03-26 | 동아대학교 산학협력단 | 전기도금을 이용한 다층 금속박판의 제조방법 및 이로부터 제조되는 다층 금속박판 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001505955A (ja) | 1996-12-13 | 2001-05-08 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 銅層の電解析出方法 |
JP2018032624A (ja) | 2016-08-23 | 2018-03-01 | エル エス エムトロン リミテッドLS Mtron Ltd. | 二次電池の容量維持率を向上できる電解銅箔、それを含む電極、それを含む二次電池およびその製造方法 |
JP2018111882A (ja) | 2017-01-13 | 2018-07-19 | エル エス エムトロン リミテッドLS Mtron Ltd. | しわが実質的にない電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法 |
US20190003066A1 (en) | 2017-06-20 | 2019-01-03 | Kcf Technologies Co., Ltd. | Copper foil with minimized bagginess and tear, electrode comprising the same, secondary battery comprising the same and method for manufacturing the same |
WO2019027174A1 (ko) | 2017-07-31 | 2019-02-07 | 케이씨에프테크놀로지스 주식회사 | 주름 발생이 방지된 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3124523B2 (ja) * | 1999-01-28 | 2001-01-15 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 銅メッキ方法 |
KR20180054985A (ko) * | 2016-11-15 | 2018-05-25 | 케이씨에프테크놀로지스 주식회사 | 말림이 최소화된 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
KR102646185B1 (ko) * | 2017-02-27 | 2024-03-08 | 에스케이넥실리스 주식회사 | 우수한 접착력을 갖는 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
TW201900939A (zh) * | 2017-05-09 | 2019-01-01 | 日商Jx金屬股份有限公司 | 電解銅箔、覆銅積層板、印刷配線板及其製造方法、以及電子機器及其製造方法 |
-
2019
- 2019-11-21 KR KR1020190150514A patent/KR20210062369A/ko active Search and Examination
-
2020
- 2020-11-13 EP EP20890652.9A patent/EP3919655A4/en active Pending
- 2020-11-13 CN CN202080027239.1A patent/CN113661587A/zh active Pending
- 2020-11-13 MY MYPI2021005130A patent/MY196205A/en unknown
- 2020-11-13 WO PCT/KR2020/015965 patent/WO2021101176A1/ko unknown
- 2020-11-13 US US17/600,443 patent/US20220200010A1/en active Pending
- 2020-11-13 JP JP2021551986A patent/JP7211669B2/ja active Active
- 2020-11-20 TW TW109140797A patent/TWI747626B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001505955A (ja) | 1996-12-13 | 2001-05-08 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 銅層の電解析出方法 |
JP2018032624A (ja) | 2016-08-23 | 2018-03-01 | エル エス エムトロン リミテッドLS Mtron Ltd. | 二次電池の容量維持率を向上できる電解銅箔、それを含む電極、それを含む二次電池およびその製造方法 |
JP2018111882A (ja) | 2017-01-13 | 2018-07-19 | エル エス エムトロン リミテッドLS Mtron Ltd. | しわが実質的にない電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法 |
US20190003066A1 (en) | 2017-06-20 | 2019-01-03 | Kcf Technologies Co., Ltd. | Copper foil with minimized bagginess and tear, electrode comprising the same, secondary battery comprising the same and method for manufacturing the same |
WO2019027174A1 (ko) | 2017-07-31 | 2019-02-07 | 케이씨에프테크놀로지스 주식회사 | 주름 발생이 방지된 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
MY196205A (en) | 2023-03-22 |
TW202120748A (zh) | 2021-06-01 |
CN113661587A (zh) | 2021-11-16 |
KR20210062369A (ko) | 2021-05-31 |
WO2021101176A1 (ko) | 2021-05-27 |
EP3919655A1 (en) | 2021-12-08 |
JP2022522513A (ja) | 2022-04-19 |
TWI747626B (zh) | 2021-11-21 |
EP3919655A4 (en) | 2022-08-10 |
US20220200010A1 (en) | 2022-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111801444B (zh) | 电解铜箔、电极及包含其的锂离子二次电池 | |
JP7324297B2 (ja) | 引裂またはシワ不良を防止できる電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法 | |
US10547081B2 (en) | Electrolytic copper foil capable of improving capacity retention rate of secondary battery, electrode including the same, secondary battery including the same, and method of manufacturing the same | |
US20200181790A1 (en) | Copper foil free from generation of wrinkles, electrode comprising the same, secondary battery comprising the same and method for manufacturing the same | |
JP6822629B2 (ja) | 銅箔、その製造方法、それを含む電極、及びそれを含む二次電池 | |
JP2018109226A (ja) | 最適化したピーク粗さを有する電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法 | |
JP7211669B2 (ja) | 引裂またはシワ不良を防止できる電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法 | |
JP2021193214A (ja) | 優れた接着力を有する銅箔、それを備える電極、それを備える二次電池、及びその製造方法 | |
KR102546687B1 (ko) | 고용량 이차전지 제조를 가능하게 하는 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 | |
Jeong et al. | Embossed aluminum as a current collector for high-rate lithium cathode performance | |
CN111316486A (zh) | 电解铜箔、其制造方法以及包含该电解铜箔的高容量锂二次电池用负极 | |
KR102492813B1 (ko) | 핸들링성이 우수한 고용량 이차전지용 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 | |
JP2022529462A (ja) | シワの発生が防止された銅箔、それを含む電極、それを含む二次電池、およびその製造方法 | |
KR20220096493A (ko) | 말림, 찢김 또는 주름 불량을 방지할 수 있는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210901 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220822 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220830 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221128 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20221213 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230106 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7211669 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |