JP7197058B2 - 回路基板、回路基板の接続構造、および、回路基板の接続構造の製造方法 - Google Patents

回路基板、回路基板の接続構造、および、回路基板の接続構造の製造方法 Download PDF

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Publication number
JP7197058B2
JP7197058B2 JP2022521922A JP2022521922A JP7197058B2 JP 7197058 B2 JP7197058 B2 JP 7197058B2 JP 2022521922 A JP2022521922 A JP 2022521922A JP 2022521922 A JP2022521922 A JP 2022521922A JP 7197058 B2 JP7197058 B2 JP 7197058B2
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Japan
Prior art keywords
circuit board
conductor
opening
laminate
region
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JP2022521922A
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English (en)
Japanese (ja)
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JPWO2021230226A5 (https=
JPWO2021230226A1 (https=
Inventor
健太朗 川辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38—Impedance-matching networks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Waveguide Connection Structure (AREA)
  • Structure Of Printed Boards (AREA)
JP2022521922A 2020-05-14 2021-05-11 回路基板、回路基板の接続構造、および、回路基板の接続構造の製造方法 Active JP7197058B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020084867 2020-05-14
JP2020084867 2020-05-14
PCT/JP2021/017818 WO2021230226A1 (ja) 2020-05-14 2021-05-11 回路基板、回路基板の接続構造、および、回路基板の接続構造の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021230226A1 JPWO2021230226A1 (https=) 2021-11-18
JP7197058B2 true JP7197058B2 (ja) 2022-12-27
JPWO2021230226A5 JPWO2021230226A5 (https=) 2023-01-27

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JP2022521922A Active JP7197058B2 (ja) 2020-05-14 2021-05-11 回路基板、回路基板の接続構造、および、回路基板の接続構造の製造方法

Country Status (4)

Country Link
US (1) US12191549B2 (https=)
JP (1) JP7197058B2 (https=)
CN (1) CN219421172U (https=)
WO (1) WO2021230226A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7842631B2 (ja) * 2022-05-11 2026-04-08 メクテック株式会社 接合プリント配線板および接合プリント配線板の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136347A (ja) 2003-10-31 2005-05-26 Denso Corp 多層基板及びその製造方法
WO2019098011A1 (ja) 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
WO2019098012A1 (ja) 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
WO2019131288A1 (ja) 2017-12-28 2019-07-04 株式会社村田製作所 伝送線路装置
WO2019131286A1 (ja) 2017-12-28 2019-07-04 株式会社村田製作所 多層基板および伝送線路装置
WO2019146253A1 (ja) 2018-01-23 2019-08-01 株式会社村田製作所 基板接合構造
WO2019159521A1 (ja) 2018-02-15 2019-08-22 株式会社村田製作所 多層基板および電気素子

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014086616A (ja) * 2012-10-25 2014-05-12 Denso Corp 電子装置およびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136347A (ja) 2003-10-31 2005-05-26 Denso Corp 多層基板及びその製造方法
WO2019098011A1 (ja) 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
WO2019098012A1 (ja) 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
WO2019131288A1 (ja) 2017-12-28 2019-07-04 株式会社村田製作所 伝送線路装置
WO2019131286A1 (ja) 2017-12-28 2019-07-04 株式会社村田製作所 多層基板および伝送線路装置
WO2019146253A1 (ja) 2018-01-23 2019-08-01 株式会社村田製作所 基板接合構造
WO2019159521A1 (ja) 2018-02-15 2019-08-22 株式会社村田製作所 多層基板および電気素子

Also Published As

Publication number Publication date
JPWO2021230226A1 (https=) 2021-11-18
US12191549B2 (en) 2025-01-07
US20230043114A1 (en) 2023-02-09
WO2021230226A1 (ja) 2021-11-18
CN219421172U (zh) 2023-07-25

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