JPWO2021230226A1 - - Google Patents

Info

Publication number
JPWO2021230226A1
JPWO2021230226A1 JP2022521922A JP2022521922A JPWO2021230226A1 JP WO2021230226 A1 JPWO2021230226 A1 JP WO2021230226A1 JP 2022521922 A JP2022521922 A JP 2022521922A JP 2022521922 A JP2022521922 A JP 2022521922A JP WO2021230226 A1 JPWO2021230226 A1 JP WO2021230226A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022521922A
Other languages
Japanese (ja)
Other versions
JPWO2021230226A5 (https=
JP7197058B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021230226A1 publication Critical patent/JPWO2021230226A1/ja
Application granted granted Critical
Publication of JP7197058B2 publication Critical patent/JP7197058B2/ja
Publication of JPWO2021230226A5 publication Critical patent/JPWO2021230226A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38—Impedance-matching networks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Waveguide Connection Structure (AREA)
  • Structure Of Printed Boards (AREA)
JP2022521922A 2020-05-14 2021-05-11 回路基板、回路基板の接続構造、および、回路基板の接続構造の製造方法 Active JP7197058B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020084867 2020-05-14
JP2020084867 2020-05-14
PCT/JP2021/017818 WO2021230226A1 (ja) 2020-05-14 2021-05-11 回路基板、回路基板の接続構造、および、回路基板の接続構造の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021230226A1 true JPWO2021230226A1 (https=) 2021-11-18
JP7197058B2 JP7197058B2 (ja) 2022-12-27
JPWO2021230226A5 JPWO2021230226A5 (https=) 2023-01-27

Family

ID=78524379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022521922A Active JP7197058B2 (ja) 2020-05-14 2021-05-11 回路基板、回路基板の接続構造、および、回路基板の接続構造の製造方法

Country Status (4)

Country Link
US (1) US12191549B2 (https=)
JP (1) JP7197058B2 (https=)
CN (1) CN219421172U (https=)
WO (1) WO2021230226A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7842631B2 (ja) * 2022-05-11 2026-04-08 メクテック株式会社 接合プリント配線板および接合プリント配線板の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136347A (ja) * 2003-10-31 2005-05-26 Denso Corp 多層基板及びその製造方法
JP2014086616A (ja) * 2012-10-25 2014-05-12 Denso Corp 電子装置およびその製造方法
WO2019098011A1 (ja) * 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
WO2019098012A1 (ja) * 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
WO2019131288A1 (ja) * 2017-12-28 2019-07-04 株式会社村田製作所 伝送線路装置
WO2019131286A1 (ja) * 2017-12-28 2019-07-04 株式会社村田製作所 多層基板および伝送線路装置
WO2019146253A1 (ja) * 2018-01-23 2019-08-01 株式会社村田製作所 基板接合構造
WO2019159521A1 (ja) * 2018-02-15 2019-08-22 株式会社村田製作所 多層基板および電気素子

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136347A (ja) * 2003-10-31 2005-05-26 Denso Corp 多層基板及びその製造方法
JP2014086616A (ja) * 2012-10-25 2014-05-12 Denso Corp 電子装置およびその製造方法
WO2019098011A1 (ja) * 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
WO2019098012A1 (ja) * 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造
WO2019131288A1 (ja) * 2017-12-28 2019-07-04 株式会社村田製作所 伝送線路装置
WO2019131286A1 (ja) * 2017-12-28 2019-07-04 株式会社村田製作所 多層基板および伝送線路装置
WO2019146253A1 (ja) * 2018-01-23 2019-08-01 株式会社村田製作所 基板接合構造
WO2019159521A1 (ja) * 2018-02-15 2019-08-22 株式会社村田製作所 多層基板および電気素子

Also Published As

Publication number Publication date
JP7197058B2 (ja) 2022-12-27
US12191549B2 (en) 2025-01-07
US20230043114A1 (en) 2023-02-09
WO2021230226A1 (ja) 2021-11-18
CN219421172U (zh) 2023-07-25

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