JP7194116B2 - 酸化ケイ素の核形成/接着の向上により膜粗さを改善するための処理アプローチ - Google Patents
酸化ケイ素の核形成/接着の向上により膜粗さを改善するための処理アプローチ Download PDFInfo
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- JP7194116B2 JP7194116B2 JP2019554823A JP2019554823A JP7194116B2 JP 7194116 B2 JP7194116 B2 JP 7194116B2 JP 2019554823 A JP2019554823 A JP 2019554823A JP 2019554823 A JP2019554823 A JP 2019554823A JP 7194116 B2 JP7194116 B2 JP 7194116B2
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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- Plasma & Fusion (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762482872P | 2017-04-07 | 2017-04-07 | |
| US62/482,872 | 2017-04-07 | ||
| PCT/US2018/023474 WO2018187034A1 (en) | 2017-04-07 | 2018-03-21 | Treatment approach to improve film roughness by improving nucleation/adhesion of silicon oxide |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020517098A JP2020517098A (ja) | 2020-06-11 |
| JP2020517098A5 JP2020517098A5 (enExample) | 2021-05-06 |
| JP7194116B2 true JP7194116B2 (ja) | 2022-12-21 |
Family
ID=63711859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019554823A Active JP7194116B2 (ja) | 2017-04-07 | 2018-03-21 | 酸化ケイ素の核形成/接着の向上により膜粗さを改善するための処理アプローチ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10276379B2 (enExample) |
| JP (1) | JP7194116B2 (enExample) |
| KR (1) | KR102492223B1 (enExample) |
| CN (1) | CN110419093B (enExample) |
| WO (1) | WO2018187034A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102509390B1 (ko) * | 2017-07-24 | 2023-03-14 | 어플라이드 머티어리얼스, 인코포레이티드 | 산화규소 상의 초박형 비정질 규소 막의 연속성을 개선하기 위한 전처리 접근법 |
| KR20190035036A (ko) * | 2017-09-25 | 2019-04-03 | 삼성전자주식회사 | 박막 형성 장치 및 이를 이용한 비정질 실리콘 막 형성방법 |
| KR102578827B1 (ko) * | 2018-04-24 | 2023-09-15 | 삼성전자주식회사 | 유연한 유무기 보호막 및 그 제조방법 |
| KR102889307B1 (ko) * | 2019-12-10 | 2025-11-20 | 도쿄엘렉트론가부시키가이샤 | 희생 캡핑 층으로서의 자가-조립된 모노층 |
| US20210327891A1 (en) * | 2020-04-16 | 2021-10-21 | Applied Materials, Inc. | Stack for 3d-nand memory cell |
| US11640905B2 (en) * | 2020-12-17 | 2023-05-02 | Applied Materials, Inc. | Plasma enhanced deposition of silicon-containing films at low temperature |
| KR20250129178A (ko) | 2024-02-22 | 2025-08-29 | 세메스 주식회사 | 기판 처리 방법 및 시스템 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| Publication number | Publication date |
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| CN110419093B (zh) | 2023-12-01 |
| JP2020517098A (ja) | 2020-06-11 |
| US20180294157A1 (en) | 2018-10-11 |
| CN110419093A (zh) | 2019-11-05 |
| WO2018187034A1 (en) | 2018-10-11 |
| US10276379B2 (en) | 2019-04-30 |
| KR20190128668A (ko) | 2019-11-18 |
| KR102492223B1 (ko) | 2023-01-25 |
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