JP7181747B2 - ヒートシンクとそれを備えた制御装置 - Google Patents

ヒートシンクとそれを備えた制御装置 Download PDF

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Publication number
JP7181747B2
JP7181747B2 JP2018188526A JP2018188526A JP7181747B2 JP 7181747 B2 JP7181747 B2 JP 7181747B2 JP 2018188526 A JP2018188526 A JP 2018188526A JP 2018188526 A JP2018188526 A JP 2018188526A JP 7181747 B2 JP7181747 B2 JP 7181747B2
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JP
Japan
Prior art keywords
heat sink
fixed
fixing
fixing screw
screw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018188526A
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English (en)
Japanese (ja)
Other versions
JP2020057718A (ja
Inventor
毅 田頭
誠 橋元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawasaki Motors Ltd
Original Assignee
Kawasaki Jukogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Jukogyo KK filed Critical Kawasaki Jukogyo KK
Priority to JP2018188526A priority Critical patent/JP7181747B2/ja
Priority to CN201980064056.4A priority patent/CN112771660B/zh
Priority to KR1020217011533A priority patent/KR102498630B1/ko
Priority to PCT/JP2019/038921 priority patent/WO2020071426A1/ja
Publication of JP2020057718A publication Critical patent/JP2020057718A/ja
Application granted granted Critical
Publication of JP7181747B2 publication Critical patent/JP7181747B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2018188526A 2018-10-03 2018-10-03 ヒートシンクとそれを備えた制御装置 Active JP7181747B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018188526A JP7181747B2 (ja) 2018-10-03 2018-10-03 ヒートシンクとそれを備えた制御装置
CN201980064056.4A CN112771660B (zh) 2018-10-03 2019-10-02 散热器以及具备散热器的控制装置
KR1020217011533A KR102498630B1 (ko) 2018-10-03 2019-10-02 히트 싱크 및 이를 구비하는 제어 장치
PCT/JP2019/038921 WO2020071426A1 (ja) 2018-10-03 2019-10-02 ヒートシンクとそれを備えた制御装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018188526A JP7181747B2 (ja) 2018-10-03 2018-10-03 ヒートシンクとそれを備えた制御装置

Publications (2)

Publication Number Publication Date
JP2020057718A JP2020057718A (ja) 2020-04-09
JP7181747B2 true JP7181747B2 (ja) 2022-12-01

Family

ID=70055949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018188526A Active JP7181747B2 (ja) 2018-10-03 2018-10-03 ヒートシンクとそれを備えた制御装置

Country Status (4)

Country Link
JP (1) JP7181747B2 (zh)
KR (1) KR102498630B1 (zh)
CN (1) CN112771660B (zh)
WO (1) WO2020071426A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001136724A (ja) 1999-11-04 2001-05-18 Calsonic Kansei Corp ブラシレスモータのターミナルケース取付構造
JP2007115965A (ja) 2005-10-21 2007-05-10 Nec Corp 電子装置
JP3132867U (ja) 2007-04-11 2007-06-21 奇▲こう▼科技股▲ふん▼有限公司 ヒートシンクモジュールのネジ固定機構
JP2012204715A (ja) 2011-03-28 2012-10-22 Yaskawa Electric Corp モータ制御装置
JP2013232614A (ja) 2012-04-06 2013-11-14 Toyota Industries Corp 半導体装置
JP2016009209A (ja) 2014-06-20 2016-01-18 レノボ・シンガポール・プライベート・リミテッド 部品取付構造及び電子機器
JP2017129218A (ja) 2016-01-20 2017-07-27 日本精機株式会社 ねじの保持構造

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260573A (ja) * 1993-03-05 1994-09-16 Mitsubishi Electric Corp 半導体パッケージと冷却フィンとの組立構造物
CA2123962A1 (en) * 1994-05-19 1995-11-20 Gary C. Edwards Engine block heater
JPH0842546A (ja) * 1994-08-04 1996-02-13 Sony Corp ネジの脱落防止構造
TW578981U (en) * 2001-11-30 2004-03-01 Foxconn Prec Components Co Ltd Heat dissipating assembly
JP2005289243A (ja) * 2004-04-01 2005-10-20 Fujikura Ltd 自動車空調機用風量制御モジュール
CN201064030Y (zh) * 2007-03-13 2008-05-21 奇鋐科技股份有限公司 散热器模块及其结构式固定螺丝机构
US7606032B2 (en) * 2007-05-01 2009-10-20 Asia Vital Components Co., Ltd. Structural screw secure device for a radiator assembly
CN201167443Y (zh) * 2008-03-18 2008-12-17 洋鑫科技股份有限公司 固定组件
CN201181697Y (zh) * 2008-04-09 2009-01-14 安天德百电股份有限公司 散热器固定架结构
JP5860740B2 (ja) * 2012-03-23 2016-02-16 東芝電波プロダクツ株式会社 筐体カバー構造

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001136724A (ja) 1999-11-04 2001-05-18 Calsonic Kansei Corp ブラシレスモータのターミナルケース取付構造
JP2007115965A (ja) 2005-10-21 2007-05-10 Nec Corp 電子装置
JP3132867U (ja) 2007-04-11 2007-06-21 奇▲こう▼科技股▲ふん▼有限公司 ヒートシンクモジュールのネジ固定機構
JP2012204715A (ja) 2011-03-28 2012-10-22 Yaskawa Electric Corp モータ制御装置
JP2013232614A (ja) 2012-04-06 2013-11-14 Toyota Industries Corp 半導体装置
JP2016009209A (ja) 2014-06-20 2016-01-18 レノボ・シンガポール・プライベート・リミテッド 部品取付構造及び電子機器
JP2017129218A (ja) 2016-01-20 2017-07-27 日本精機株式会社 ねじの保持構造

Also Published As

Publication number Publication date
CN112771660A (zh) 2021-05-07
CN112771660B (zh) 2024-04-09
JP2020057718A (ja) 2020-04-09
KR20210060581A (ko) 2021-05-26
WO2020071426A1 (ja) 2020-04-09
KR102498630B1 (ko) 2023-02-10

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