JP7170761B2 - インテリジェントなパワーモジュールパッケージング構造 - Google Patents
インテリジェントなパワーモジュールパッケージング構造 Download PDFInfo
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- JP7170761B2 JP7170761B2 JP2021014918A JP2021014918A JP7170761B2 JP 7170761 B2 JP7170761 B2 JP 7170761B2 JP 2021014918 A JP2021014918 A JP 2021014918A JP 2021014918 A JP2021014918 A JP 2021014918A JP 7170761 B2 JP7170761 B2 JP 7170761B2
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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Description
110 絶縁放熱基板
110a 第1の表面
110b 第2の表面
110s 側壁
112 上部金属層
120 パワーデバイス
130 制御チップ
140 リードフレーム
150 封止材
162 第1の相互接続
164 第2の相互接続
170 受動デバイス
Claims (11)
- 第1の表面および該第1の表面の反対側の第2の表面を有している絶縁放熱基板と、
前記第1の表面上に配置された複数のパワーデバイスと、
前記第1の表面上に配置され、前記パワーデバイスを駆動するためのゲートドライバ機能および前記パワーデバイスを制御するためのパルス幅変調機能を提供する制御チップと、
前記第1の表面に接合されたリードフレームであって、前記パワーデバイスが前記制御チップおよび該リードフレームに電気的に接続される、リードフレームと、
前記パワーデバイス、前記制御チップ、および前記リードフレームの少なくとも一部分を少なくとも包む封止材であって、前記第2の表面は、全体または一部が該封止材の外部に露出している、封止材と、
を備え、前記パワーデバイスは、金属ワイヤを介して互いに電気的に接続され、前記パワーデバイスは、金属クリップを介して前記制御チップに電気的に接続される、インテリジェントなパワーモジュールパッケージング構造。 - 前記パワーデバイスは、フリップチップ方式で前記第1の表面上に配置される、請求項1に記載のインテリジェントなパワーモジュールパッケージング構造。
- 前記制御チップは、ダイボンディング方式で前記第1の表面上に配置される、請求項1に記載のインテリジェントなパワーモジュールパッケージング構造。
- 前記パワーデバイスおよび前記制御チップは、それぞれ第1の相互接続および第2の相互接続によって前記リードフレームに電気的に接続される、請求項1に記載のインテリジェントなパワーモジュールパッケージング構造。
- 前記第1の相互接続および前記第2の相互接続の各々は、金属ワイヤ、金属クリップ、インターポーザ、またはこれらの組み合わせを含む、請求項4に記載のインテリジェントなパワーモジュールパッケージング構造。
- 前記インターポーザは、前記パワーデバイスの前記リードフレームへの電気的接続または前記制御チップの前記リードフレームへの電気的接続のためのパターン加工された電気回路を含んでいる前記絶縁放熱基板である、請求項5に記載のインテリジェントなパワーモジュールパッケージング構造。
- 前記リードフレームは、前記封止材の内部から前記封止材の外部へと延び、前記封止材によって覆われていない前記リードフレームの一部分が、当該インテリジェントなパワーモジュールパッケージング構造の外側ピンとして機能する、請求項1に記載のインテリジェントなパワーモジュールパッケージング構造。
- 前記第1の表面上に配置され、前記リードフレームに電気的に接続された受動デバイスを備える、請求項1に記載のインテリジェントなパワーモジュールパッケージング構造。
- 前記制御チップは、モータコントローラ、前記パワーデバイスを駆動するためのゲートドライバ機能を有するゲートドライバ、および前記パワーデバイスを制御するためのパルス幅変調機能を有するパルス幅変調コントローラを備える、請求項1に記載のインテリジェントなパワーモジュールパッケージング構造。
- 前記絶縁放熱基板は、前記第1の表面に近接した上部金属層を備え、該上部金属層と前記リードフレームとが、一体的に形成された構造物である、請求項1に記載のインテリジェントなパワーモジュールパッケージング構造。
- 前記絶縁放熱基板は、直接接合銅基板、絶縁金属基板、またはプリント回路基板を備える、請求項1に記載のインテリジェントなパワーモジュールパッケージング構造。
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Application Number | Priority Date | Filing Date | Title |
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TW109129435A TWI764256B (zh) | 2020-08-28 | 2020-08-28 | 智慧功率模組封裝結構 |
TW109129435 | 2020-08-28 |
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JP2022039912A JP2022039912A (ja) | 2022-03-10 |
JP7170761B2 true JP7170761B2 (ja) | 2022-11-14 |
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US (1) | US11810835B2 (ja) |
JP (1) | JP7170761B2 (ja) |
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CN116032101A (zh) * | 2023-02-27 | 2023-04-28 | 合肥惟新数控科技有限公司 | 一种智能功率模块拓扑驱动控制结构 |
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