JP7154015B2 - 電荷分配構造物を含むスイッチングデバイス - Google Patents
電荷分配構造物を含むスイッチングデバイス Download PDFInfo
- Publication number
- JP7154015B2 JP7154015B2 JP2018031470A JP2018031470A JP7154015B2 JP 7154015 B2 JP7154015 B2 JP 7154015B2 JP 2018031470 A JP2018031470 A JP 2018031470A JP 2018031470 A JP2018031470 A JP 2018031470A JP 7154015 B2 JP7154015 B2 JP 7154015B2
- Authority
- JP
- Japan
- Prior art keywords
- distribution structure
- charge distribution
- active layer
- conductive
- charge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
- H10D62/235—Channel regions of field-effect devices of FETs of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
- H10D64/112—Field plates comprising multiple field plate segments
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
Landscapes
- Junction Field-Effect Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/448,724 | 2017-03-03 | ||
| US15/448,724 US10192981B2 (en) | 2012-06-29 | 2017-03-03 | Switching device with charge distribution structure |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018152555A JP2018152555A (ja) | 2018-09-27 |
| JP2018152555A5 JP2018152555A5 (enExample) | 2021-01-07 |
| JP7154015B2 true JP7154015B2 (ja) | 2022-10-17 |
Family
ID=61563158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018031470A Active JP7154015B2 (ja) | 2017-03-03 | 2018-02-26 | 電荷分配構造物を含むスイッチングデバイス |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3370260A1 (enExample) |
| JP (1) | JP7154015B2 (enExample) |
| CN (1) | CN108538917A (enExample) |
| TW (1) | TWI756375B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20250046345A (ko) | 2019-07-12 | 2025-04-02 | 파워 인티그레이션즈, 인크. | 고 전자 이동도 트랜지스터의 고 전압 동작을 향상시키기 위한 정전용량 네트워크 및 그 방법 |
| CN112768358B (zh) * | 2020-12-31 | 2024-08-09 | 扬州扬杰电子科技股份有限公司 | 一种氮化镓高电子迁移率晶体管及其制备方法 |
| US11774296B2 (en) * | 2021-11-11 | 2023-10-03 | Alpha And Omega Semiconductor International Lp | Method and circuit for sensing MOSFET temperature for load switch application |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008034522A (ja) | 2006-07-27 | 2008-02-14 | Oki Electric Ind Co Ltd | 電界効果トランジスタ |
| US20140001479A1 (en) | 2012-06-29 | 2014-01-02 | Power Integrations, Inc. | Switching device with charge distribution structure |
| JP2015179786A (ja) | 2014-03-19 | 2015-10-08 | 株式会社東芝 | 半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5609083B2 (ja) * | 2009-12-01 | 2014-10-22 | 日本電気株式会社 | 半導体装置、電子装置、半導体装置の製造方法および使用方法 |
| US10002957B2 (en) * | 2011-12-21 | 2018-06-19 | Power Integrations, Inc. | Shield wrap for a heterostructure field effect transistor |
| US9245879B2 (en) * | 2012-06-29 | 2016-01-26 | Power Integrations, Inc. | Static discharge system |
| WO2016100805A1 (en) * | 2014-12-19 | 2016-06-23 | Sensor Electronic Technology, Inc. | Semiconductor device with multiple space-charge control electrodes |
-
2018
- 2018-02-26 JP JP2018031470A patent/JP7154015B2/ja active Active
- 2018-03-01 EP EP18159463.1A patent/EP3370260A1/en not_active Withdrawn
- 2018-03-02 CN CN201810176173.7A patent/CN108538917A/zh active Pending
- 2018-03-02 TW TW107107056A patent/TWI756375B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008034522A (ja) | 2006-07-27 | 2008-02-14 | Oki Electric Ind Co Ltd | 電界効果トランジスタ |
| US20140001479A1 (en) | 2012-06-29 | 2014-01-02 | Power Integrations, Inc. | Switching device with charge distribution structure |
| JP2015179786A (ja) | 2014-03-19 | 2015-10-08 | 株式会社東芝 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3370260A1 (en) | 2018-09-05 |
| TW201836149A (zh) | 2018-10-01 |
| JP2018152555A (ja) | 2018-09-27 |
| CN108538917A (zh) | 2018-09-14 |
| TWI756375B (zh) | 2022-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104871318B (zh) | 具有电荷分布结构的开关器件 | |
| US20170104077A1 (en) | Switching device with charge distribution structure | |
| US9660038B2 (en) | Lateral/vertical semiconductor device | |
| CN104737294B (zh) | 具有集成的限流器的半导体电子元件 | |
| US9166048B2 (en) | Lateral/vertical semiconductor device | |
| CN105247681B (zh) | 增强型iii-氮化物器件 | |
| US9478651B2 (en) | Breakdown voltage multiplying integration scheme | |
| JP2014508413A (ja) | 低伝導電界制御素子を有する半導体デバイス | |
| KR102249390B1 (ko) | 매칭 문턱전압을 갖는 집적회로 및 그 제조 방법 | |
| US9391187B2 (en) | Semiconductor heterojunction device | |
| CN104813454A (zh) | 具有防击穿层的半导体器件 | |
| JP7154015B2 (ja) | 電荷分配構造物を含むスイッチングデバイス | |
| JP7406774B2 (ja) | 窒化物半導体トランジスタ装置 | |
| CN104282745B (zh) | 半导体器件以及改善半导体器件的击穿电压的方法 | |
| US9391189B2 (en) | Lateral/vertical semiconductor device | |
| US10192981B2 (en) | Switching device with charge distribution structure | |
| US9991372B2 (en) | Device with channel having varying carrier concentration | |
| Jun | Tri-gate technologies for high-performance power GaN devices | |
| JP2012190996A (ja) | 半導体装置及びその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201118 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20201118 |
|
| RD13 | Notification of appointment of power of sub attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7433 Effective date: 20210409 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20211221 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20211223 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20220224 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220426 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220705 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220822 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220913 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20221004 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7154015 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |