JP7146528B2 - 基板検査装置、基板処理装置、基板検査方法および基板処理方法 - Google Patents

基板検査装置、基板処理装置、基板検査方法および基板処理方法 Download PDF

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JP7146528B2
JP7146528B2 JP2018159731A JP2018159731A JP7146528B2 JP 7146528 B2 JP7146528 B2 JP 7146528B2 JP 2018159731 A JP2018159731 A JP 2018159731A JP 2018159731 A JP2018159731 A JP 2018159731A JP 7146528 B2 JP7146528 B2 JP 7146528B2
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JP2020034355A (ja
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幸治 中川
友宏 松尾
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Priority to JP2018159731A priority Critical patent/JP7146528B2/ja
Priority to PCT/JP2019/026530 priority patent/WO2020044784A1/ja
Priority to TW108124598A priority patent/TWI716032B/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects

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  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
JP2018159731A 2018-08-28 2018-08-28 基板検査装置、基板処理装置、基板検査方法および基板処理方法 Active JP7146528B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018159731A JP7146528B2 (ja) 2018-08-28 2018-08-28 基板検査装置、基板処理装置、基板検査方法および基板処理方法
PCT/JP2019/026530 WO2020044784A1 (ja) 2018-08-28 2019-07-03 基板検査装置、基板処理装置、基板検査方法および基板処理方法
TW108124598A TWI716032B (zh) 2018-08-28 2019-07-12 基板檢查裝置、基板處理裝置、基板檢查方法及基板處理方法

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JP2018159731A JP7146528B2 (ja) 2018-08-28 2018-08-28 基板検査装置、基板処理装置、基板検査方法および基板処理方法

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JP2020034355A JP2020034355A (ja) 2020-03-05
JP7146528B2 true JP7146528B2 (ja) 2022-10-04

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JP (1) JP7146528B2 (zh)
TW (1) TWI716032B (zh)
WO (1) WO2020044784A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023173587A (ja) * 2022-05-26 2023-12-07 株式会社Ｓｃｒｅｅｎホールディングス 状態検出方法、および、状態検出装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050174584A1 (en) 2000-07-06 2005-08-11 Chalmers Scott A. Method and apparatus for high-speed thickness mapping of patterned thin films
JP2005284377A (ja) 2004-03-26 2005-10-13 Toyota Motor Corp 標識認識装置及び標識認識方法
JP2007190288A (ja) 2006-01-20 2007-08-02 Toshiba Corp 医用画像処理装置、超音波診断装置及び医用画像処理プログラム
JP2016156822A (ja) 2015-02-25 2016-09-01 株式会社昭和電気研究所 ウェハ欠陥検査装置
JP2018036235A (ja) 2016-09-02 2018-03-08 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置、基板処理装置、基板検査方法および基板処理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002250614A (ja) * 2001-02-27 2002-09-06 Matsushita Electric Ind Co Ltd 画像入力方法および画像入力装置
JP2006300553A (ja) * 2005-04-15 2006-11-02 Nikon Corp 検査装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050174584A1 (en) 2000-07-06 2005-08-11 Chalmers Scott A. Method and apparatus for high-speed thickness mapping of patterned thin films
JP2005284377A (ja) 2004-03-26 2005-10-13 Toyota Motor Corp 標識認識装置及び標識認識方法
JP2007190288A (ja) 2006-01-20 2007-08-02 Toshiba Corp 医用画像処理装置、超音波診断装置及び医用画像処理プログラム
JP2016156822A (ja) 2015-02-25 2016-09-01 株式会社昭和電気研究所 ウェハ欠陥検査装置
JP2018036235A (ja) 2016-09-02 2018-03-08 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置、基板処理装置、基板検査方法および基板処理方法

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TWI716032B (zh) 2021-01-11
WO2020044784A1 (ja) 2020-03-05
JP2020034355A (ja) 2020-03-05
TW202009478A (zh) 2020-03-01

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