JP7127132B2 - 真空溶接炉及び溶接方法 - Google Patents

真空溶接炉及び溶接方法 Download PDF

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Publication number
JP7127132B2
JP7127132B2 JP2020536598A JP2020536598A JP7127132B2 JP 7127132 B2 JP7127132 B2 JP 7127132B2 JP 2020536598 A JP2020536598 A JP 2020536598A JP 2020536598 A JP2020536598 A JP 2020536598A JP 7127132 B2 JP7127132 B2 JP 7127132B2
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Prior art keywords
welding
opening
plate
chamber
furnace
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JP2021508602A (ja
JPWO2019128068A5 (https=
JP2021508602A5 (https=
Inventor
シャンドン リー
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シャンドン ツァイジュー エレクトロニック テクノロジー カンパニー リミテッド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0478—Heating appliances electric comprising means for controlling or selecting the temperature or power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Furnace Details (AREA)
  • Tunnel Furnaces (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP2020536598A 2017-12-29 2018-05-24 真空溶接炉及び溶接方法 Active JP7127132B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201711480242.5 2017-12-29
CN201711480242.5A CN107931768B (zh) 2017-12-29 2017-12-29 一种真空焊接炉及焊接工艺
PCT/CN2018/088228 WO2019128068A1 (zh) 2017-12-29 2018-05-24 一种真空焊接炉及焊接工艺

Publications (4)

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JP2021508602A JP2021508602A (ja) 2021-03-11
JPWO2019128068A5 JPWO2019128068A5 (https=) 2022-06-13
JP2021508602A5 JP2021508602A5 (https=) 2022-06-13
JP7127132B2 true JP7127132B2 (ja) 2022-08-29

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JP2020536598A Active JP7127132B2 (ja) 2017-12-29 2018-05-24 真空溶接炉及び溶接方法

Country Status (4)

Country Link
JP (1) JP7127132B2 (https=)
CN (1) CN107931768B (https=)
DE (2) DE112018006635T5 (https=)
WO (1) WO2019128068A1 (https=)

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* Cited by examiner, † Cited by third party
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CN107855623B (zh) * 2017-12-29 2023-07-18 山东才聚电子科技有限公司 一种真空焊接炉控制系统及其控制方法
CN107855622B (zh) * 2017-12-29 2023-05-23 山东才聚电子科技有限公司 一种适应范围广的真空焊接炉
CN107931768B (zh) * 2017-12-29 2023-05-16 山东才聚电子科技有限公司 一种真空焊接炉及焊接工艺
CN107963443B (zh) * 2017-12-29 2019-07-16 山东才聚电子科技有限公司 一种真空焊接炉的搬运机构
CN107838516B (zh) * 2017-12-29 2023-10-03 山东才聚电子科技有限公司 一种真空焊接炉的焊接机构
TWI715161B (zh) * 2019-08-23 2021-01-01 廣化科技股份有限公司 純甲酸供酸焊接系統
CN110744166A (zh) * 2019-11-29 2020-02-04 昆山市嘉源昊泽光电科技有限公司 一种真空焊接炉
CN110787633B (zh) * 2019-12-03 2024-08-20 江苏峰业环境科技集团股份有限公司 脱硝催化剂的再生装置
CN112992685B (zh) * 2019-12-13 2023-09-26 上海超路自动化设备有限公司 一种用于手机通信芯片导热片熔焊、注液一体化生产平台
CN113245654B (zh) * 2021-06-22 2021-12-31 广东钜兴电子科技有限公司 一种芯片自动焊接工艺及焊接装置
CN113714583B (zh) * 2021-08-16 2022-09-16 江苏新智达新能源设备有限公司 一种真空焊接炉
CN117116800A (zh) * 2022-05-17 2023-11-24 泰姆瑞（北京）精密技术有限公司 一种用于芯片封装的防氧化炉及其封装方法
KR20240018908A (ko) * 2022-08-03 2024-02-14 삼성전자주식회사 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법
KR20240018915A (ko) * 2022-08-03 2024-02-14 삼성전자주식회사 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법
CN115625393B (zh) * 2022-12-06 2023-11-14 山东才聚电子科技有限公司 一种静态真空焊接炉
CN117644334B (zh) * 2023-12-29 2024-06-28 青岛中汽特种汽车有限公司 一种喷洒车摆臂架焊接工装
CN117943655A (zh) * 2024-02-28 2024-04-30 深圳新控半导体技术有限公司 一种真空回流焊接炉
CN119794497A (zh) * 2025-03-12 2025-04-11 山东才聚电子科技有限公司 一种芯片焊接装置及焊接方法

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JP2007000915A (ja) 2005-06-27 2007-01-11 Shinko Seiki Co Ltd 半田付け方法及び半田付け装置
DE102005058739A1 (de) 2005-12-08 2007-06-14 Alejandro Fiol Verfahren und Vorrichtung für die Erwärmung von Elementen in der Dampfphase, insbesondere für das Löten von elektronischen Baugruppen
JP2010287635A (ja) 2009-06-09 2010-12-24 Tamura Seisakusho Co Ltd リフロー装置

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JPH0739483Y2 (ja) * 1990-11-15 1995-09-13 千住金属工業株式会社 リフロー炉
JPH05296663A (ja) * 1992-03-31 1993-11-09 Matsushita Electric Ind Co Ltd 加熱装置
JPH07212028A (ja) * 1994-01-13 1995-08-11 Matsushita Electric Ind Co Ltd リフロー装置
JP3527272B2 (ja) * 1994-01-20 2004-05-17 株式会社タムラ製作所 基板冷却装置
JPH10279041A (ja) * 1997-04-10 1998-10-20 Fuji Electric Co Ltd ウォーキングビーム式ワーク搬送装置および電子部品はんだ付け装置
CN2433040Y (zh) * 2000-07-04 2001-06-06 张敏 具废气回收装置的回焊机
US6780225B2 (en) * 2002-05-24 2004-08-24 Vitronics Soltec, Inc. Reflow oven gas management system and method
CN103229604A (zh) * 2010-11-23 2013-07-31 三菱电机株式会社 回流焊装置及回流焊方法
US9440303B2 (en) * 2011-12-26 2016-09-13 Yokota Technica Limited Company Heat processing device
CN103071877A (zh) * 2013-01-07 2013-05-01 山东高唐杰盛半导体科技有限公司 一种真空焊接炉的密封装置
CN103056473B (zh) * 2013-01-07 2015-08-26 山东高唐杰盛半导体科技有限公司 一种连续式真空焊接炉及其焊接方法
JP6144495B2 (ja) * 2013-01-24 2017-06-07 オリジン電気株式会社 加熱接合装置及び加熱接合製品の製造方法
CN103170189B (zh) * 2013-03-07 2016-01-20 南京熊猫电子制造有限公司 惰性气体保护焊用气体净化装置
CN205733334U (zh) * 2016-06-30 2016-11-30 无锡市泰诺试验设备有限公司 一种焊接加热板
CN207746512U (zh) * 2017-12-29 2018-08-21 山东才聚电子科技有限公司 一种真空焊接炉
CN107855623B (zh) * 2017-12-29 2023-07-18 山东才聚电子科技有限公司 一种真空焊接炉控制系统及其控制方法
CN107838516B (zh) * 2017-12-29 2023-10-03 山东才聚电子科技有限公司 一种真空焊接炉的焊接机构
CN107963443B (zh) * 2017-12-29 2019-07-16 山东才聚电子科技有限公司 一种真空焊接炉的搬运机构
CN107931768B (zh) * 2017-12-29 2023-05-16 山东才聚电子科技有限公司 一种真空焊接炉及焊接工艺
CN107855622B (zh) * 2017-12-29 2023-05-23 山东才聚电子科技有限公司 一种适应范围广的真空焊接炉

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007000915A (ja) 2005-06-27 2007-01-11 Shinko Seiki Co Ltd 半田付け方法及び半田付け装置
DE102005058739A1 (de) 2005-12-08 2007-06-14 Alejandro Fiol Verfahren und Vorrichtung für die Erwärmung von Elementen in der Dampfphase, insbesondere für das Löten von elektronischen Baugruppen
JP2010287635A (ja) 2009-06-09 2010-12-24 Tamura Seisakusho Co Ltd リフロー装置

Also Published As

Publication number Publication date
CN107931768A (zh) 2018-04-20
DE202018006535U1 (de) 2021-02-02
DE112018006635T5 (de) 2020-10-29
JP2021508602A (ja) 2021-03-11
WO2019128068A1 (zh) 2019-07-04
CN107931768B (zh) 2023-05-16

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