JP7117747B2 - 電子部品の製造方法 - Google Patents

電子部品の製造方法 Download PDF

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Publication number
JP7117747B2
JP7117747B2 JP2017101964A JP2017101964A JP7117747B2 JP 7117747 B2 JP7117747 B2 JP 7117747B2 JP 2017101964 A JP2017101964 A JP 2017101964A JP 2017101964 A JP2017101964 A JP 2017101964A JP 7117747 B2 JP7117747 B2 JP 7117747B2
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Japan
Prior art keywords
plating layer
plating
layer
copper
nickel
Prior art date
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JP2017101964A
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English (en)
Japanese (ja)
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JP2018157173A5 (https=
JP2018157173A (ja
Inventor
怜史 大矢
早紀 中木原
敏之 芳片
比呂志 新子
廣一 志方
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Qualtec Co Ltd
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Qualtec Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5438—Dispositions of bond wires the bond wires having multiple connections on the same bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemically Coating (AREA)
JP2017101964A 2016-09-29 2017-05-23 電子部品の製造方法 Active JP7117747B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016192095 2016-09-29
JP2016192095 2016-09-29
JP2017061686 2017-03-27
JP2017061686 2017-03-27

Publications (3)

Publication Number Publication Date
JP2018157173A JP2018157173A (ja) 2018-10-04
JP2018157173A5 JP2018157173A5 (https=) 2020-07-02
JP7117747B2 true JP7117747B2 (ja) 2022-08-15

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ID=63717420

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JP2017101964A Active JP7117747B2 (ja) 2016-09-29 2017-05-23 電子部品の製造方法

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JP (1) JP7117747B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109504956A (zh) * 2018-11-02 2019-03-22 江西华度电子新材料有限公司 一种提高热管、热板吸液芯表面抗氧化的处理方法
US20210387290A1 (en) * 2018-12-17 2021-12-16 Heraeus Precious Metals North America Conshohocken Llc Process for forming an electric heater
CN110644025A (zh) * 2019-11-12 2020-01-03 长沙理工大学 一种超薄镍铜合金箔及其制备方法
KR102325114B1 (ko) * 2019-12-06 2021-11-11 제엠제코(주) 반도체 패키지의 제조 방법
CN115767948B (zh) * 2022-11-14 2024-04-02 北京自动化控制设备研究所 Mems惯性系统高密度低应力集成方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006066716A (ja) 2004-08-27 2006-03-09 Fuji Electric Holdings Co Ltd 半導体装置
JP2008270353A (ja) 2007-04-17 2008-11-06 Toyota Central R&D Labs Inc パワー半導体モジュール
JP2009108394A (ja) 2007-10-31 2009-05-21 Meltex Inc ニッケルで形成された被めっき表面の前処理に用いる活性化処理液及びその活性化処理液を用いた前処理方法
JP2010040691A (ja) 2008-08-04 2010-02-18 Ebara Corp 鉛フリーバンプ形成方法
WO2010032780A1 (ja) 2008-09-18 2010-03-25 古河電気工業株式会社 金属張積層体、回路基板及び電子部品
JP2011134925A (ja) 2009-12-25 2011-07-07 Sanken Electric Co Ltd 電極構造
JP2013057127A (ja) 2012-11-05 2013-03-28 Jcu Corp 酸性電解銅めっき液
JP2016092064A (ja) 2014-10-30 2016-05-23 トヨタ自動車株式会社 半導体装置とその製造方法
JP2016146402A (ja) 2015-02-06 2016-08-12 凸版印刷株式会社 配線基板、半導体装置及び半導体装置の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006066716A (ja) 2004-08-27 2006-03-09 Fuji Electric Holdings Co Ltd 半導体装置
JP2008270353A (ja) 2007-04-17 2008-11-06 Toyota Central R&D Labs Inc パワー半導体モジュール
JP2009108394A (ja) 2007-10-31 2009-05-21 Meltex Inc ニッケルで形成された被めっき表面の前処理に用いる活性化処理液及びその活性化処理液を用いた前処理方法
JP2010040691A (ja) 2008-08-04 2010-02-18 Ebara Corp 鉛フリーバンプ形成方法
WO2010032780A1 (ja) 2008-09-18 2010-03-25 古河電気工業株式会社 金属張積層体、回路基板及び電子部品
JP2011134925A (ja) 2009-12-25 2011-07-07 Sanken Electric Co Ltd 電極構造
JP2013057127A (ja) 2012-11-05 2013-03-28 Jcu Corp 酸性電解銅めっき液
JP2016092064A (ja) 2014-10-30 2016-05-23 トヨタ自動車株式会社 半導体装置とその製造方法
JP2016146402A (ja) 2015-02-06 2016-08-12 凸版印刷株式会社 配線基板、半導体装置及び半導体装置の製造方法

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