JP7114214B2 - 接着フィルム - Google Patents

接着フィルム Download PDF

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Publication number
JP7114214B2
JP7114214B2 JP2016103479A JP2016103479A JP7114214B2 JP 7114214 B2 JP7114214 B2 JP 7114214B2 JP 2016103479 A JP2016103479 A JP 2016103479A JP 2016103479 A JP2016103479 A JP 2016103479A JP 7114214 B2 JP7114214 B2 JP 7114214B2
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JP
Japan
Prior art keywords
resin composition
resin
mass
epoxy resin
layer
Prior art date
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Active
Application number
JP2016103479A
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English (en)
Japanese (ja)
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JP2017210527A (ja
Inventor
祥平 藤島
賢司 川合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
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Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2016103479A priority Critical patent/JP7114214B2/ja
Priority to TW106114827A priority patent/TWI774674B/zh
Priority to CN201710367965.8A priority patent/CN107418144B/zh
Priority to KR1020170063402A priority patent/KR20170132680A/ko
Publication of JP2017210527A publication Critical patent/JP2017210527A/ja
Application granted granted Critical
Publication of JP7114214B2 publication Critical patent/JP7114214B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
JP2016103479A 2016-05-24 2016-05-24 接着フィルム Active JP7114214B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016103479A JP7114214B2 (ja) 2016-05-24 2016-05-24 接着フィルム
TW106114827A TWI774674B (zh) 2016-05-24 2017-05-04 接著薄膜、樹脂組成物、預浸體、印刷配線板及半導體裝置
CN201710367965.8A CN107418144B (zh) 2016-05-24 2017-05-23 树脂组合物
KR1020170063402A KR20170132680A (ko) 2016-05-24 2017-05-23 수지 조성물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016103479A JP7114214B2 (ja) 2016-05-24 2016-05-24 接着フィルム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020127321A Division JP7176551B2 (ja) 2020-07-28 2020-07-28 樹脂組成物、接着フィルム、プリプレグ、プリント配線板及び半導体装置

Publications (2)

Publication Number Publication Date
JP2017210527A JP2017210527A (ja) 2017-11-30
JP7114214B2 true JP7114214B2 (ja) 2022-08-08

Family

ID=60428328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016103479A Active JP7114214B2 (ja) 2016-05-24 2016-05-24 接着フィルム

Country Status (4)

Country Link
JP (1) JP7114214B2 (zh)
KR (1) KR20170132680A (zh)
CN (1) CN107418144B (zh)
TW (1) TWI774674B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6391851B2 (ja) * 2016-09-29 2018-09-19 積水化学工業株式会社 層間絶縁材料及び多層プリント配線板
KR102214641B1 (ko) * 2018-07-16 2021-02-10 삼성전기주식회사 인쇄회로기판
JP7239608B2 (ja) * 2018-11-05 2023-03-14 日本化学工業株式会社 改質リン酸タングステン酸ジルコニウム、負熱膨張フィラー及び高分子組成物
JP2020090570A (ja) * 2018-12-03 2020-06-11 味の素株式会社 樹脂組成物
JP7249162B2 (ja) * 2019-02-01 2023-03-30 積水化学工業株式会社 樹脂組成物、硬化物、及び、ビルドアップフィルム
JP7447459B2 (ja) 2019-12-16 2024-03-12 株式会社レゾナック 積層フィルム、配線基板を製造する方法、及び半導体装置を製造する方法
US11639410B2 (en) 2019-12-18 2023-05-02 Shin-Etsu Chemical Co., Ltd. Heat-curable resin composition and uses thereof
JP7452204B2 (ja) * 2020-04-01 2024-03-19 味の素株式会社 樹脂組成物
JP6881664B1 (ja) * 2020-10-15 2021-06-02 荒川化学工業株式会社 ポリイミド樹脂組成物、接着剤組成物、フィルム状接着材、接着シート、樹脂付銅箔、銅張積層板、プリント配線板及びポリイミドフィルム
CN112795011B (zh) * 2020-12-31 2022-08-09 常州市尚科新材料有限公司 可溶性的热塑性聚酰亚胺超细粉及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007224242A (ja) 2006-02-27 2007-09-06 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、ｂステージ化した樹脂フィルムおよび多層ビルドアップ基板
JP2013077590A (ja) 2011-09-29 2013-04-25 Tamura Seisakusho Co Ltd 層間絶縁用の樹脂フィルムおよびビルドアップ配線基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4455114B2 (ja) * 2004-03-25 2010-04-21 タムラ化研株式会社 ビルドアップ基板層間絶縁材料用の熱硬化性樹脂組成物、樹脂フィルム、製品およびビルドアップ基板の層間絶縁材料
KR101807901B1 (ko) * 2010-08-10 2017-12-11 히타치가세이가부시끼가이샤 수지 조성물, 수지 경화물, 배선판 및 배선판의 제조 방법
JP6044139B2 (ja) * 2012-07-06 2016-12-14 味の素株式会社 絶縁樹脂シート
JP6205692B2 (ja) * 2012-09-03 2017-10-04 味の素株式会社 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板
JP2014058592A (ja) * 2012-09-14 2014-04-03 Tamura Seisakusho Co Ltd 熱硬化性樹脂組成物、ｂステージ化した樹脂フィルム、金属箔、銅張板および多層ビルドアップ基板
JP5915610B2 (ja) * 2013-09-18 2016-05-11 味の素株式会社 樹脂組成物
JP6258770B2 (ja) * 2014-04-24 2018-01-10 Ｊｆｅケミカル株式会社 電子基板およびカバーレイフィルム
JP6269294B2 (ja) * 2014-04-24 2018-01-31 味の素株式会社 プリント配線板の絶縁層用樹脂組成物
KR101884256B1 (ko) * 2014-05-30 2018-08-01 후지필름 가부시키가이샤 가접착막, 적층체, 가접착용 조성물, 디바이스의 제조 방법 및 키트
JP6413444B2 (ja) * 2014-07-31 2018-10-31 味の素株式会社 樹脂シート、積層シート、積層板及び半導体装置
JP2017185743A (ja) * 2016-04-08 2017-10-12 コニカミノルタ株式会社 ポリイミドフィルムの製造方法、及び製造装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007224242A (ja) 2006-02-27 2007-09-06 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、ｂステージ化した樹脂フィルムおよび多層ビルドアップ基板
JP2013077590A (ja) 2011-09-29 2013-04-25 Tamura Seisakusho Co Ltd 層間絶縁用の樹脂フィルムおよびビルドアップ配線基板

Also Published As

Publication number Publication date
TW201815967A (zh) 2018-05-01
JP2017210527A (ja) 2017-11-30
CN107418144A (zh) 2017-12-01
CN107418144B (zh) 2022-06-03
TWI774674B (zh) 2022-08-21
KR20170132680A (ko) 2017-12-04

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