JP7114182B2 - 被着体に光学薄膜を貼り付けて形成する方法 - Google Patents
被着体に光学薄膜を貼り付けて形成する方法 Download PDFInfo
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- JP7114182B2 JP7114182B2 JP2018179103A JP2018179103A JP7114182B2 JP 7114182 B2 JP7114182 B2 JP 7114182B2 JP 2018179103 A JP2018179103 A JP 2018179103A JP 2018179103 A JP2018179103 A JP 2018179103A JP 7114182 B2 JP7114182 B2 JP 7114182B2
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- 239000010409 thin film Substances 0.000 title claims description 86
- 230000003287 optical effect Effects 0.000 title claims description 77
- 238000000034 method Methods 0.000 title claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 67
- 239000000758 substrate Substances 0.000 claims description 51
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 238000002360 preparation method Methods 0.000 claims description 9
- 238000000926 separation method Methods 0.000 claims description 9
- 238000002679 ablation Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 description 14
- 238000003384 imaging method Methods 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000010931 gold Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
- B32B37/025—Transfer laminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/04—Prisms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0808—Mirrors having a single reflecting layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Description
繰り返し周波数 :50kHzから200kHz
平均出力 :0.1Wから2W
パルス幅 :1psから20ps
パルスエネルギー:0.5μJから10μJ
スポット径 :10μmから50μm
加工送り速度 :50mm/sから100mm/s
4 基台
6 基部
8 壁部
10 チャックテーブル
10a 保持面
11、11-1、11-2、11-3、 プリズム(被着体)
11a 一面
11b、11b1、11b2、11b3 一辺
11c、11c1、11c2、11c3 一辺
12 レーザービーム照射ユニット
12a 加工ヘッド
13 積層体
13a 光学薄膜
13b 接着層
13c 基板
13d 面
14 撮像ユニット
14a 撮像ヘッド
15 プリズムユニット
16 Y軸移動ユニット
18 Y軸ガイドレール
20 Y軸移動テーブル
22 Y軸ボールネジ
24 Y軸パルスモータ
26 X軸移動ユニット
28 X軸ガイドレール
30 X軸移動テーブル
32 X軸ボールネジ
34 X軸パルスモータ
36 支持台
40 支持アーム
42 保持治具
42a 表面
42b 裏面
42c、42c1、42c2、42c3 凹部
L レーザービーム
S 集光点
Claims (2)
- 被着体に光学薄膜を貼り付けて形成する方法であって、
接着層を介して該光学薄膜が形成された基板を準備する基板準備ステップと、
該基板準備ステップの後、該基板の光学薄膜側に石英ガラスに比べて耐熱性の低い該被着体の一面を貼り付ける貼り付けステップと、
該貼り付けステップの後、該基板の該光学薄膜が形成された面とは反対側の面から、該基板に対しては透過性を有し、且つ、該接着層に対しては吸収性を有する波長のレーザービームを、該接着層において該一面に対応する領域よりも大きい面積の範囲に照射し、該接着層をアブレーションにより破壊する接着層破壊ステップと、
該接着層破壊ステップの後、該光学薄膜が貼り付けられた該被着体と該基板とを分離する分離ステップと、を備えることを特徴とする被着体に光学薄膜を貼り付けて形成する方法。 - 該被着体は樹脂で形成されていることを特徴とする、請求項1に記載の被着体に光学薄膜を貼り付けて形成する方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018179103A JP7114182B2 (ja) | 2018-09-25 | 2018-09-25 | 被着体に光学薄膜を貼り付けて形成する方法 |
US16/567,083 US20200095670A1 (en) | 2018-09-25 | 2019-09-11 | Method for forming adherend with optical thin film |
TW108134144A TWI802753B (zh) | 2018-09-25 | 2019-09-23 | 將光學薄膜貼附形成於被黏著物的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018179103A JP7114182B2 (ja) | 2018-09-25 | 2018-09-25 | 被着体に光学薄膜を貼り付けて形成する方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020049698A JP2020049698A (ja) | 2020-04-02 |
JP7114182B2 true JP7114182B2 (ja) | 2022-08-08 |
Family
ID=69884045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018179103A Active JP7114182B2 (ja) | 2018-09-25 | 2018-09-25 | 被着体に光学薄膜を貼り付けて形成する方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20200095670A1 (ja) |
JP (1) | JP7114182B2 (ja) |
TW (1) | TWI802753B (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004140380A (ja) | 1996-08-27 | 2004-05-13 | Seiko Epson Corp | 薄膜デバイスの転写方法、及びデバイスの製造方法 |
JP2005081299A (ja) | 2003-09-10 | 2005-03-31 | Seiko Epson Corp | 成膜方法、配線パターンの形成方法、半導体装置の製造方法、電気光学装置、及び電子機器 |
JP2007286600A (ja) | 2006-03-22 | 2007-11-01 | Nippon Denki Kagaku Co Ltd | 薄膜素子の転写方法、転写体、転写生成物、回路基板及び表示装置 |
US20110018203A1 (en) | 2006-07-21 | 2011-01-27 | Lutnick Howard W | Card game |
JP2011216293A (ja) | 2010-03-31 | 2011-10-27 | Fujifilm Corp | 低屈折率層転写シート、並びに有機電界発光装置及びその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5334907B2 (ja) * | 1974-06-28 | 1978-09-22 | ||
US4500382A (en) * | 1983-06-10 | 1985-02-19 | Transilwrap Company, Inc. | Method of manufacture of resin film precision biomedical article |
JP4619462B2 (ja) * | 1996-08-27 | 2011-01-26 | セイコーエプソン株式会社 | 薄膜素子の転写方法 |
KR100579191B1 (ko) * | 2004-02-24 | 2006-05-11 | 삼성에스디아이 주식회사 | 열전사 소자 |
JP2012028754A (ja) * | 2010-06-21 | 2012-02-09 | Toshiba Corp | 薄膜シリコン太陽電池およびその製造方法 |
TWI411842B (zh) * | 2010-12-29 | 2013-10-11 | Au Optronics Corp | 觸控面板及其製造方法 |
US8482713B2 (en) * | 2011-02-04 | 2013-07-09 | Apple Inc. | Laser processing of display components for electronic devices |
JP6088701B1 (ja) * | 2016-10-06 | 2017-03-01 | 株式会社きもと | レーザーダイシング用補助シート |
JP6939809B2 (ja) * | 2016-10-25 | 2021-09-22 | ダイキン工業株式会社 | 機能性膜 |
-
2018
- 2018-09-25 JP JP2018179103A patent/JP7114182B2/ja active Active
-
2019
- 2019-09-11 US US16/567,083 patent/US20200095670A1/en not_active Abandoned
- 2019-09-23 TW TW108134144A patent/TWI802753B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004140380A (ja) | 1996-08-27 | 2004-05-13 | Seiko Epson Corp | 薄膜デバイスの転写方法、及びデバイスの製造方法 |
JP2005081299A (ja) | 2003-09-10 | 2005-03-31 | Seiko Epson Corp | 成膜方法、配線パターンの形成方法、半導体装置の製造方法、電気光学装置、及び電子機器 |
JP2007286600A (ja) | 2006-03-22 | 2007-11-01 | Nippon Denki Kagaku Co Ltd | 薄膜素子の転写方法、転写体、転写生成物、回路基板及び表示装置 |
US20110018203A1 (en) | 2006-07-21 | 2011-01-27 | Lutnick Howard W | Card game |
JP2011216293A (ja) | 2010-03-31 | 2011-10-27 | Fujifilm Corp | 低屈折率層転写シート、並びに有機電界発光装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20200095670A1 (en) | 2020-03-26 |
TWI802753B (zh) | 2023-05-21 |
TW202012965A (zh) | 2020-04-01 |
JP2020049698A (ja) | 2020-04-02 |
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