JP7106469B2 - 多結晶シリコン製造装置 - Google Patents
多結晶シリコン製造装置 Download PDFInfo
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- JP7106469B2 JP7106469B2 JP2019027952A JP2019027952A JP7106469B2 JP 7106469 B2 JP7106469 B2 JP 7106469B2 JP 2019027952 A JP2019027952 A JP 2019027952A JP 2019027952 A JP2019027952 A JP 2019027952A JP 7106469 B2 JP7106469 B2 JP 7106469B2
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- electrode
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- straight body
- insulating member
- polycrystalline silicon
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/03—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition of silicon halides or halosilanes or reduction thereof with hydrogen as the only reducing agent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J19/087—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J19/088—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
- B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
- B01J2219/0815—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes involving stationary electrodes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
- B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
- B01J2219/0824—Details relating to the shape of the electrodes
- B01J2219/0826—Details relating to the shape of the electrodes essentially linear
- B01J2219/0828—Wires
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
- B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
- B01J2219/0837—Details relating to the material of the electrodes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0871—Heating or cooling of the reactor
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Silicon Compounds (AREA)
- Furnace Details (AREA)
Description
トリクロロシランを原料とし、シーメンス法により逆U字型の多結晶シリコン棒を育成した。直径は約120mm~160mmでの成長を行った。反応炉内で各実施形態を6本ずつの電極にセットし、これを1年間継続した。表1に各実施形態の仕様と結果を示す。
2 底板
3 底板冷却材流路
4 電極冷却材供給部
5 一体型絶縁性スリーブ
6A、6B シール部材
Claims (2)
- シーメンス法による多結晶シリコンの製造装置であって、
シリコン芯線に電力供給するための電極と底板部の間に一体型スリーブ構造の絶縁部材を備えており、
前記絶縁部材は直胴部の上部に鍔部が設けられた形状を有し、
該絶縁部材の鍔部の少なくとも一部が前記電極の鍔部の下面と前記底板部の上面との間に嵌め込まれるとともに、前記絶縁部材の直胴部の少なくとも一部が前記電極の直胴部と前記底板部に設けられた貫通孔部の側面との間に嵌め込まれており、
前記絶縁部材の少なくとも2箇所にシール部材が配され、
鍔部と一体になった直胴部が底板部の下方側まで延在し、
前記絶縁部材の直胴部の少なくとも一部の2箇所以上に前記シール部材が配され、
前記シール部材の一つは前記直胴部と前記底板部との間に設けられ、前記シール部材の別の一つは前記直胴部と前記電極との間に設けられる、多結晶シリコン製造装置。 - 前記直胴部と前記底板部との間に設けられる前記シール部材の一つと、前記直胴部と前記電極との間に設けられる前記シール部材の別の一つは、同じ高さ位置に設けられる、請求項1に記載の多結晶シリコン製造装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019027952A JP7106469B2 (ja) | 2019-02-20 | 2019-02-20 | 多結晶シリコン製造装置 |
CN201911370744.1A CN111591998B (zh) | 2019-02-20 | 2019-12-27 | 多晶硅制造装置 |
EP20151206.8A EP3712110A1 (en) | 2019-02-20 | 2020-01-10 | Polycrystalline silicon manufacturing apparatus |
US16/795,039 US11326257B2 (en) | 2019-02-20 | 2020-02-19 | Polycrystalline silicon manufacturing apparatus |
Applications Claiming Priority (1)
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JP2019027952A JP7106469B2 (ja) | 2019-02-20 | 2019-02-20 | 多結晶シリコン製造装置 |
Publications (2)
Publication Number | Publication Date |
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JP2020132472A JP2020132472A (ja) | 2020-08-31 |
JP7106469B2 true JP7106469B2 (ja) | 2022-07-26 |
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JP2019027952A Active JP7106469B2 (ja) | 2019-02-20 | 2019-02-20 | 多結晶シリコン製造装置 |
Country Status (4)
Country | Link |
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US (1) | US11326257B2 (ja) |
EP (1) | EP3712110A1 (ja) |
JP (1) | JP7106469B2 (ja) |
CN (1) | CN111591998B (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010030878A (ja) | 2008-06-24 | 2010-02-12 | Mitsubishi Materials Corp | 多結晶シリコン製造装置 |
CN201424378Y (zh) | 2009-06-16 | 2010-03-17 | 重庆大全新能源有限公司 | 多晶硅还原炉高压启动绝缘电极 |
CN101565184B (zh) | 2009-05-22 | 2011-12-07 | 宜昌南玻硅材料有限公司 | 一种多晶硅生产用氢化炉装置内电极密封的方法及装置 |
JP2013018675A (ja) | 2011-07-11 | 2013-01-31 | Shin-Etsu Chemical Co Ltd | 多結晶シリコン製造装置 |
JP2018502031A (ja) | 2014-11-17 | 2018-01-25 | ワッカー ケミー アクチエンゲゼルシャフトWacker Chemie AG | Cvdリアクタ内の電極ホルダーを絶縁およびシールするための装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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DE1155759B (de) * | 1959-06-11 | 1963-10-17 | Siemens Ag | Vorrichtung zur Gewinnung reinsten kristallinen Halbleitermaterials fuer elektrotechnische Zwecke |
US7081597B2 (en) * | 2004-09-03 | 2006-07-25 | The Esab Group, Inc. | Electrode and electrode holder with threaded connection |
JP5266817B2 (ja) * | 2008-03-17 | 2013-08-21 | 三菱マテリアル株式会社 | 多結晶シリコン製造装置 |
US20100122657A1 (en) * | 2008-11-14 | 2010-05-20 | Jui Hai Hsieh | Electrode, Chemical Vapor Deposition Apparatus Including the Electrode and Method of Making |
DE102011078727A1 (de) * | 2011-07-06 | 2013-01-10 | Wacker Chemie Ag | Schutzvorrichtung für Elektrodenhalterungen in CVD Reaktoren |
CN203034093U (zh) * | 2013-01-25 | 2013-07-03 | 六九硅业有限公司 | 一种cvd反应器电极与底座的密封结构 |
CN203498097U (zh) * | 2013-09-02 | 2014-03-26 | 上海森松新能源设备有限公司 | 高纯多晶硅生产用还原炉电极 |
KR101590607B1 (ko) * | 2013-11-20 | 2016-02-01 | 한화케미칼 주식회사 | 폴리실리콘 제조 장치 |
DE102015220127A1 (de) * | 2015-10-15 | 2017-04-20 | Wacker Chemie Ag | Vorrichtung zur Isolierung und Abdichtung von Elektrodenhalterungen in CVD Reaktoren |
JP7029718B2 (ja) | 2017-07-31 | 2022-03-04 | 国立研究開発法人量子科学技術研究開発機構 | リン酸化タウタンパク質の測定方法 |
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2019
- 2019-02-20 JP JP2019027952A patent/JP7106469B2/ja active Active
- 2019-12-27 CN CN201911370744.1A patent/CN111591998B/zh active Active
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2020
- 2020-01-10 EP EP20151206.8A patent/EP3712110A1/en active Pending
- 2020-02-19 US US16/795,039 patent/US11326257B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010030878A (ja) | 2008-06-24 | 2010-02-12 | Mitsubishi Materials Corp | 多結晶シリコン製造装置 |
CN101565184B (zh) | 2009-05-22 | 2011-12-07 | 宜昌南玻硅材料有限公司 | 一种多晶硅生产用氢化炉装置内电极密封的方法及装置 |
CN201424378Y (zh) | 2009-06-16 | 2010-03-17 | 重庆大全新能源有限公司 | 多晶硅还原炉高压启动绝缘电极 |
JP2013018675A (ja) | 2011-07-11 | 2013-01-31 | Shin-Etsu Chemical Co Ltd | 多結晶シリコン製造装置 |
JP2018502031A (ja) | 2014-11-17 | 2018-01-25 | ワッカー ケミー アクチエンゲゼルシャフトWacker Chemie AG | Cvdリアクタ内の電極ホルダーを絶縁およびシールするための装置 |
Also Published As
Publication number | Publication date |
---|---|
CN111591998B (zh) | 2024-06-14 |
US11326257B2 (en) | 2022-05-10 |
US20200263304A1 (en) | 2020-08-20 |
EP3712110A1 (en) | 2020-09-23 |
JP2020132472A (ja) | 2020-08-31 |
CN111591998A (zh) | 2020-08-28 |
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