JP7093221B2 - 光学装置の調整方法、光学装置の製造方法、および、物品製造方法 - Google Patents
光学装置の調整方法、光学装置の製造方法、および、物品製造方法 Download PDFInfo
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Description
Claims (13)
- 支持機構および操作機構を使って光学装置の光学部品を調整する調整方法であって、
前記光学部品の状態を、前記操作機構が前記光学部品を支持することなく前記支持機構が前記光学部品を支持する第1状態に設定する設定工程と、
前記光学部品の状態を、前記操作機構が前記光学部品を支持する第2状態に変更する第1変更工程と、
前記光学部品の状態を、前記操作機構が前記光学部品を支持することなく前記支持機構が前記光学部品を支持する前記第1状態に変更する第2変更工程と、
を含み、
前記設定工程、前記第1変更工程および前記第2変更工程は、前記光学装置の出荷前に、予め決められた仕様に従って実施され、前記光学装置の出荷後に、前記出荷前における前記仕様と同じ仕様に従って更に実施される、
ことを特徴とする調整方法。 - 前記第1変更工程および前記第2変更工程は、前記光学部品の応力を緩和するように実施される、
ことを特徴とする請求項1に記載の調整方法。 - 前記第2状態は、前記支持機構が前記光学部品を支持することなく前記操作機構が前記光学部品を支持する状態を含む、
ことを特徴とする請求項1又は2に記載の調整方法。 - 前記第2状態は、前記支持機構および前記操作機構の双方が前記光学部品を支持する状態を含む、
ことを特徴とする請求項1又は2に記載の調整方法。 - 前記第2状態は、前記支持機構および前記操作機構の双方が前記光学部品を支持する第3状態、および、前記支持機構が前記光学部品を支持することなく前記操作機構が前記光学部品を支持する第4状態を含み、
前記第1変更工程は、前記光学部品の状態を前記第1状態から前記第3状態に変更し、その後、前記光学部品の状態を前記第4状態に変更し、その後、前記光学部品の状態を前記第3状態に変更することを含み、
前記第2変更工程は、前記光学部品の状態を前記第3状態から前記第1状態に変更する、
ことを特徴とする請求項1又は2に記載の調整方法。 - 前記光学装置は、前記光学部品を収容する収容部材を更に備え、
前記操作機構は、前記収容部材の中に配置された前記光学部品の状態を変更する、
ことを特徴とする請求項1乃至5のいずれか1項に記載の調整方法。 - 前記操作機構は、前記光学部品を駆動する駆動機構を含む、
ことを特徴とする請求項1乃至6のいずれか1項に記載の調整方法。 - 前記第1変更工程は、前記光学部品の変位または形状を計測するセンサによる計測に基づいて実施される、
ことを特徴とする請求項1乃至7のいずれか1項に記載の調整方法。 - 前記第2変更工程の後に、前記光学部品の変位または形状を計測する計測する計測工程と、
前記計測工程の後に、前記光学部品の状態を前記第1状態から前記第2状態に変更する第3変更工程と、
前記第3変更工程の後に、前記光学部品の状態を前記第1状態に変更する第4変更工程と、
を更に含むことを特徴とする請求項1乃至8のいずれか1項に記載の調整方法。 - 前記光学部品は、前記光学部品を使って基板を露光する露光装置の光学部品である、
ことを特徴とする請求項1乃至9のいずれか1項に記載の調整方法。 - 光学部品と、前記光学部品を支持する支持機構と、前記光学部品の状態を変更するように前記光学部品を操作するための操作機構とを有する光学装置を製造する製造方法であって、
前記光学部品の状態を、前記支持機構が前記光学部品を支持する第1状態に設定する第1設定工程と、
前記第1設定工程の後に、前記光学部品の状態を、前記操作機構が前記光学部品を支持する第2状態に変更する第1変更工程と、
前記第1変更工程の後に、前記光学部品の状態を、前記支持機構が前記光学部品を支持する前記第1状態に変更する第2変更工程と、
前記第2変更工程の後に、前記光学装置の光学特性を調整する第1調整工程と、
前記第1調整工程の後に、前記光学装置を輸送する輸送工程と、
前記輸送工程の後に、前記光学部品の状態を、前記支持機構が前記光学部品を支持する前記第1状態に設定する第2設定工程と、
前記第2設定工程の後に、前記光学部品の状態を、前記操作機構が前記光学部品を支持する前記第2状態に変更する第3変更工程と、
前記第3変更工程の後に、前記光学部品の状態を、前記支持機構が前記光学部品を支持する前記第1状態に変更する第4変更工程と、
を含むことを特徴とする光学装置の製造方法。 - 前記第4変更工程の後に、前記光学装置の光学特性を調整する第2調整工程を更に含む、
ことを特徴とする請求項11に記載の光学装置の製造方法。 - 光学部品を使って基板を露光する露光装置を用いて物品を製造する物品製造方法であって、
前記光学部品の状態を、操作機構が前記光学部品を支持することなく支持機構が前記光学部品を支持する第1状態に設定する設定工程と、
前記光学部品の状態を、前記操作機構が前記光学部品を支持する第2状態に変更する第1変更工程と、
前記光学部品の状態を、前記操作機構が前記光学部品を支持することなく前記支持機構が前記光学部品を支持する前記第1状態に変更する第2変更工程と、
前記露光装置を用いて、感光剤が塗布された基板を露光する工程と、
前記感光剤を現像してパターンを形成する工程と、
前記パターンを使って前記基板を処理して前記物品を得る工程と、
を含み、
前記設定工程、前記第1変更工程および前記第2変更工程は、前記露光装置の出荷前に、予め決められた仕様に従って実施され、前記露光装置の出荷後に、前記出荷前における前記仕様と同じ仕様に従って更に実施される、
ことを特徴とする物品製造方法。
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JP2018085720A JP7093221B2 (ja) | 2018-04-26 | 2018-04-26 | 光学装置の調整方法、光学装置の製造方法、および、物品製造方法 |
TW108113371A TWI701524B (zh) | 2018-04-26 | 2019-04-17 | 光學裝置、曝光裝置、製造光學裝置的方法及製造物品的方法 |
US16/390,262 US10539879B2 (en) | 2018-04-26 | 2019-04-22 | Optical apparatus, exposure apparatus, method of manufacturing optical apparatus, and method of manufacturing article |
KR1020190048441A KR102497481B1 (ko) | 2018-04-26 | 2019-04-25 | 광학 장치, 노광 장치, 광학 장치의 제조 방법, 및 물품 제조 방법 |
CN201910341356.4A CN110412704B (zh) | 2018-04-26 | 2019-04-26 | 光学装置、曝光装置、光学装置制造方法和物品制造方法 |
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US (1) | US10539879B2 (ja) |
JP (1) | JP7093221B2 (ja) |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006113414A (ja) | 2004-10-18 | 2006-04-27 | Canon Inc | 光学素子保持装置、鏡筒、露光装置及びマイクロデバイスの製造方法 |
JP2016503519A (ja) | 2012-11-29 | 2016-02-04 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 光学系の少なくとも1つの光学素子を作動させる機構 |
JP2016080906A (ja) | 2014-10-17 | 2016-05-16 | キヤノン株式会社 | 支持装置および方法、計測装置、並びに物品の製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4875765A (en) * | 1988-07-29 | 1989-10-24 | Eastman Kodak Company | Method for correction of distortions of a mirror |
JP2001242364A (ja) | 2000-03-01 | 2001-09-07 | Canon Inc | 光学素子の保持機構、および該保持機構によって構成された投影光学系を備える露光装置 |
EP1533832A1 (en) | 2002-06-25 | 2005-05-25 | Nikon Corporation | Optical unit and x-ray exposure system |
US8064044B2 (en) * | 2004-01-05 | 2011-11-22 | Nikon Corporation | Exposure apparatus, exposure method, and device producing method |
JP2008244395A (ja) * | 2007-03-29 | 2008-10-09 | Canon Inc | 露光装置 |
KR20100018581A (ko) * | 2007-05-25 | 2010-02-17 | 가부시키가이샤 니콘 | 광학 소자 유지 장치, 경통 및 노광 장치 및 디바이스의 제조 방법 |
WO2010098474A1 (ja) * | 2009-02-27 | 2010-09-02 | 株式会社 ニコン | 光学素子保持装置、光学系、露光装置、デバイスの製造方法及び光学素子の交換方法 |
JP2011165991A (ja) | 2010-02-12 | 2011-08-25 | Nikon Corp | 露光装置の製造方法 |
KR102162035B1 (ko) * | 2013-09-30 | 2020-10-07 | 칼 짜이스 에스엠테 게엠베하 | 간단화된 제조를 갖는 광학 영상화 장치 |
TWI597536B (zh) * | 2016-10-27 | 2017-09-01 | 財團法人國家實驗硏究院 | 用於支撐鏡片的支撐裝置與方法及用於支 撐功能元件的支撐組件 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006113414A (ja) | 2004-10-18 | 2006-04-27 | Canon Inc | 光学素子保持装置、鏡筒、露光装置及びマイクロデバイスの製造方法 |
JP2016503519A (ja) | 2012-11-29 | 2016-02-04 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 光学系の少なくとも1つの光学素子を作動させる機構 |
JP2016080906A (ja) | 2014-10-17 | 2016-05-16 | キヤノン株式会社 | 支持装置および方法、計測装置、並びに物品の製造方法 |
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TW202001435A (zh) | 2020-01-01 |
CN110412704A (zh) | 2019-11-05 |
US10539879B2 (en) | 2020-01-21 |
TWI701524B (zh) | 2020-08-11 |
JP2019191422A (ja) | 2019-10-31 |
KR102497481B1 (ko) | 2023-02-08 |
US20190332016A1 (en) | 2019-10-31 |
CN110412704B (zh) | 2022-03-29 |
KR20190124657A (ko) | 2019-11-05 |
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