JP7092041B2 - 薄膜トランジスタアレイおよびその製造方法 - Google Patents
薄膜トランジスタアレイおよびその製造方法 Download PDFInfo
- Publication number
- JP7092041B2 JP7092041B2 JP2018568112A JP2018568112A JP7092041B2 JP 7092041 B2 JP7092041 B2 JP 7092041B2 JP 2018568112 A JP2018568112 A JP 2018568112A JP 2018568112 A JP2018568112 A JP 2018568112A JP 7092041 B2 JP7092041 B2 JP 7092041B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film transistor
- pattern
- disconnection
- transistor array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010409 thin film Substances 0.000 title claims description 84
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 68
- 238000007639 printing Methods 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 46
- 239000010408 film Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 23
- 239000011810 insulating material Substances 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 description 32
- 239000000976 ink Substances 0.000 description 29
- 239000010410 layer Substances 0.000 description 25
- 238000007644 letterpress printing Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000007774 anilox coating Methods 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 239000005871 repellent Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XBDYBAVJXHJMNQ-UHFFFAOYSA-N Tetrahydroanthracene Natural products C1=CC=C2C=C(CCCC3)C3=CC2=C1 XBDYBAVJXHJMNQ-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000083 poly(allylamine) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- IFLREYGFSNHWGE-UHFFFAOYSA-N tetracene Chemical compound C1=CC=CC2=CC3=CC4=CC=CC=C4C=C3C=C21 IFLREYGFSNHWGE-UHFFFAOYSA-N 0.000 description 1
- FMZQNTNMBORAJM-UHFFFAOYSA-N tri(propan-2-yl)-[2-[13-[2-tri(propan-2-yl)silylethynyl]pentacen-6-yl]ethynyl]silane Chemical compound C1=CC=C2C=C3C(C#C[Si](C(C)C)(C(C)C)C(C)C)=C(C=C4C(C=CC=C4)=C4)C4=C(C#C[Si](C(C)C)(C(C)C)C(C)C)C3=CC2=C1 FMZQNTNMBORAJM-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
- H10K19/10—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00 comprising field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
Description
絶縁基板11としてガラスを用いた薄膜トランジスタアレイ301を作成した。薄膜トランジスタアレイ301には、縦100個、横100個の薄膜トランジスタ素子300が等間隔に配置されている。
断線用パターン17の膜厚が1500nmになるよう印刷したこと以外は、実施例1と同様とした。
断線用パターン17の膜厚が200nmになるよう印刷したこと以外は、実施例1と同様とした。
断線用パターン17形成工程を行わなかったこと以外は、実施例1と同様とした。
断線用パターン17の膜厚が3300nmであること以外は、実施例1と同様とした。
断線用パターン17の膜厚が150nmであること以外は、実施例1と同様とした。
断線用パターン17に用いたエポキシ樹脂材料の表面エネルギーが、28.5mN/mのものを用いたこと以外は、実施例1と同様とした。
こうして作製した実施例1~3及び比較例1~4に係る薄膜トランジスタアレイ201、301内の薄膜トランジスタ素子200、300を無作為に100個選び、トランジスタ特性を測定した。測定されたオン電流値、オンオフ比について、それぞれ比較を行った。
2 基板
3 インキチャンバー
4 ドクター
5 インキ
6 アニロックスロール
7 版胴
8 凸版
9 印刷物
10 凸部
100、200、300 薄膜トランジスタ素子
101、201、301 薄膜トランジスタアレイ
11 絶縁基板
12 ゲート絶縁膜
13 ゲート電極
14 ソース電極
15 ドレイン電極
16 半導体層、半導体パターン
17 断線用パターン
18 断線用パターンに隠されたドレイン電極
19 頂部
20 変曲点
Claims (6)
- 絶縁基板と、ゲート電極と、ゲート絶縁膜と、ソース電極と、ドレイン電極と、前記ソース電極及び前記ドレイン電極間に形成されたチャネル領域とを含む薄膜トランジスタ素子をマトリクス状に並べた薄膜トランジスタアレイであって、
絶縁性材料を用いて、複数の前記薄膜トランジスタ素子にわたって形成されたストライプ形状の断線用パターンと、
前記断線用パターンに直交するとともに、複数の前記薄膜トランジスタ素子の前記チャネル領域にわたって形成され、前記断線用パターンとの交点において断線したストライプ形状の半導体パターンとをさらに含み、
前記断線用パターンは、最大膜厚が200nm以上かつ3000nm以下であり、
前記断線用パターンに用いられる絶縁性材料は、表面エネルギーが30mN/m以上である、薄膜トランジスタアレイ。 - 前記断線用パターンは、前記断線用パターンの延伸方向に直交する断面において、1つ以上の頂部を有する、請求項1に記載の薄膜トランジスタアレイ。
- 前記断線用パターンは、前記断線用パターンの延伸方向に直交する断面において、2つの頂部を有する、請求項2に記載の薄膜トランジスタアレイ。
- 前記断線用パターンは、前記断線用パターンの延伸方向に直交する断面において、前記断線用パターンの幅方向中央以外に1つの頂部を有する、請求項2に記載の薄膜トランジスタアレイ。
- 前記断線用パターンは、前記断線用パターンの延伸方向に直交する断面において、前記頂部の、その両端側の最も近い2つの変曲点に対する角度が100°以下である、請求項2から4のいずれかに記載の薄膜トランジスタアレイ。
- 請求項1から5のいずれかに記載の薄膜トランジスタアレイの製造方法であって、
絶縁基板上に、少なくともゲート電極、ゲート絶縁膜、ソース電極、及びドレイン電極を形成する工程と、
前記ゲート絶縁膜、ソース電極、及びドレイン電極上に、絶縁性材料を用いた印刷によってストライプ形状の断線用パターンを複数形成する工程と、
印刷によって、前記断線用パターンに直交するストライプ形状の半導体パターンを複数形成する工程とを含み、
前記半導体パターンを複数形成する工程において、前記半導体パターンは、前記断線用パターンと直交する部分において断線する、薄膜トランジスタアレイの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017026005 | 2017-02-15 | ||
JP2017026005 | 2017-02-15 | ||
PCT/JP2018/003676 WO2018150916A1 (ja) | 2017-02-15 | 2018-02-02 | 薄膜トランジスタアレイおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018150916A1 JPWO2018150916A1 (ja) | 2019-12-12 |
JP7092041B2 true JP7092041B2 (ja) | 2022-06-28 |
Family
ID=63169323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018568112A Active JP7092041B2 (ja) | 2017-02-15 | 2018-02-02 | 薄膜トランジスタアレイおよびその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10847549B2 (ja) |
JP (1) | JP7092041B2 (ja) |
WO (1) | WO2018150916A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005340771A (ja) | 2004-05-22 | 2005-12-08 | Samsung Sdi Co Ltd | 薄膜トランジスタ、該薄膜トランジスタの製造方法、該薄膜トランジスタを具備した平板表示装置、及び該平板表示装置の製造方法 |
JP2015065390A (ja) | 2013-09-26 | 2015-04-09 | 凸版印刷株式会社 | 薄膜トランジスタアレイおよび画像表示装置 |
JP2015207704A (ja) | 2014-04-22 | 2015-11-19 | 凸版印刷株式会社 | 薄膜トランジスタアレイおよびその製造方法 |
WO2016067591A1 (ja) | 2014-10-28 | 2016-05-06 | 凸版印刷株式会社 | 薄膜トランジスタアレイおよびその製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4836446B2 (ja) | 2003-12-26 | 2011-12-14 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP2006063334A (ja) | 2004-07-30 | 2006-03-09 | Sumitomo Chemical Co Ltd | 高分子化合物、高分子薄膜およびそれを用いた高分子薄膜素子 |
JP5521270B2 (ja) | 2007-02-21 | 2014-06-11 | 凸版印刷株式会社 | 薄膜トランジスタアレイ、薄膜トランジスタアレイの製造方法、および薄膜トランジスタアレイを用いたアクティブマトリクス型ディスプレイ |
EP2299492A1 (en) * | 2009-09-22 | 2011-03-23 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Integrated circuit |
FR2959867B1 (fr) * | 2010-05-05 | 2013-08-16 | Commissariat Energie Atomique | Dispositif microelectronique a portions disjointes de semi-conducteur et procede de realisation d'un tel dispositif |
CN103503153B (zh) * | 2011-06-21 | 2016-09-21 | 松下电器产业株式会社 | 薄膜晶体管元件及其制造方法、有机el显示元件和有机el显示装置 |
CN104662646B (zh) * | 2012-09-21 | 2018-01-09 | 凸版印刷株式会社 | 薄膜晶体管及其制造方法、图像显示装置 |
-
2018
- 2018-02-02 JP JP2018568112A patent/JP7092041B2/ja active Active
- 2018-02-02 WO PCT/JP2018/003676 patent/WO2018150916A1/ja active Application Filing
-
2019
- 2019-08-01 US US16/529,003 patent/US10847549B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005340771A (ja) | 2004-05-22 | 2005-12-08 | Samsung Sdi Co Ltd | 薄膜トランジスタ、該薄膜トランジスタの製造方法、該薄膜トランジスタを具備した平板表示装置、及び該平板表示装置の製造方法 |
JP2015065390A (ja) | 2013-09-26 | 2015-04-09 | 凸版印刷株式会社 | 薄膜トランジスタアレイおよび画像表示装置 |
JP2015207704A (ja) | 2014-04-22 | 2015-11-19 | 凸版印刷株式会社 | 薄膜トランジスタアレイおよびその製造方法 |
WO2016067591A1 (ja) | 2014-10-28 | 2016-05-06 | 凸版印刷株式会社 | 薄膜トランジスタアレイおよびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20190363105A1 (en) | 2019-11-28 |
US10847549B2 (en) | 2020-11-24 |
JPWO2018150916A1 (ja) | 2019-12-12 |
WO2018150916A1 (ja) | 2018-08-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101154712B (zh) | 有机半导体元件及其制造方法、有机晶体管阵列及显示器 | |
JP2006352083A (ja) | 有機薄膜トランジスタ及びアクティブマトリックス表示装置 | |
JP2008258608A (ja) | 両極性トランジスタ設計 | |
JPWO2017170715A1 (ja) | 印刷方法 | |
JP6393936B2 (ja) | 薄膜トランジスタ、トランジスタアレイ、薄膜トランジスタの製造方法及びトランジスタアレイの製造方法 | |
CN101263602B (zh) | 电子电路及其制造方法 | |
JP6070073B2 (ja) | 薄膜トランジスタアレイ | |
JP5406421B2 (ja) | リバースプリンティング | |
US20170221968A1 (en) | Thin-film transistor array and method of manufacturing the same | |
WO2008138914A1 (en) | Reducing defects in electronic switching devices | |
JP7092041B2 (ja) | 薄膜トランジスタアレイおよびその製造方法 | |
KR101811099B1 (ko) | 유기 전자 장치의 제조 방법 및 유기 전자 장치 | |
US10193068B2 (en) | Method of manufacturing a specifically dimensioned thin film transistor, thin film transistor, and transistor array | |
KR101288622B1 (ko) | 유기 박막 트랜지스터의 유기 반도체층 형성 방법, 이에 의해 형성된 유기 박막 트랜지스터, 이를 포함하는 표시 소자 및 그 표시 소자로 형성된 표시용 전자기기 | |
US10629654B2 (en) | Thin film transistor array formed substrate, image display device substrate and manufacturing method of thin film transistor array formed substrate | |
JP5098159B2 (ja) | 薄膜トランジスタの製造方法 | |
JP7167662B2 (ja) | 薄膜トランジスタアレイおよびその製造方法 | |
WO2019203200A1 (ja) | 薄膜トランジスタアレイ、薄膜トランジスタアレイ多面付け基板、およびそれらの製造方法 | |
EP1727219B1 (en) | Organic thin film transistor and method for producing the same | |
JP6331644B2 (ja) | 薄膜トランジスタアレイおよびその製造方法 | |
WO2009096525A1 (ja) | 薄膜トランジスタ | |
US20100200838A1 (en) | Switching element | |
JP6197306B2 (ja) | 薄膜トランジスタの製造方法 | |
JP2016076547A (ja) | 電界効果トランジスタの作製方法 | |
JP2018186131A (ja) | 電極パターン、電極パターンの形成方法、薄膜トランジスタ、薄膜トランジスタの製造方法、及び画像表示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210120 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220308 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220427 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220517 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220530 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7092041 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |