JP7091618B2 - 静電容量型センサ封止用樹脂組成物および静電容量型センサ - Google Patents

静電容量型センサ封止用樹脂組成物および静電容量型センサ Download PDF

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JP7091618B2
JP7091618B2 JP2017159319A JP2017159319A JP7091618B2 JP 7091618 B2 JP7091618 B2 JP 7091618B2 JP 2017159319 A JP2017159319 A JP 2017159319A JP 2017159319 A JP2017159319 A JP 2017159319A JP 7091618 B2 JP7091618 B2 JP 7091618B2
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resin composition
encapsulating
capacitive sensor
capacitance type
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JP2018053240A (ja
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純一 田部井
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Multimedia (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)
  • Epoxy Resins (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
JP2017159319A 2016-09-27 2017-08-22 静電容量型センサ封止用樹脂組成物および静電容量型センサ Active JP7091618B2 (ja)

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JP2016188338 2016-09-27
JP2016188338 2016-09-27

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JP2018053240A JP2018053240A (ja) 2018-04-05
JP7091618B2 true JP7091618B2 (ja) 2022-06-28

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JP (1) JP7091618B2 (ko)
KR (1) KR102436208B1 (ko)
CN (1) CN107868406B (ko)
TW (1) TWI796301B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI701685B (zh) 2018-08-10 2020-08-11 台燿科技股份有限公司 介電複合物及其應用
WO2020066856A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
EP3876273B1 (en) * 2018-11-01 2024-04-03 Sumitomo Bakelite Co., Ltd. Encapsulating resin composition for power device and power device
JP7188043B2 (ja) * 2018-12-13 2022-12-13 住友ベークライト株式会社 フローマークの改善方法およびそれを用いた電子装置の製造方法
JP7243186B2 (ja) * 2018-12-27 2023-03-22 住友ベークライト株式会社 封止用樹脂組成物、中空パッケージおよびその製造方法
JP7151940B1 (ja) * 2021-02-03 2022-10-12 住友ベークライト株式会社 封止用樹脂組成物および半導体装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015146816A1 (ja) 2014-03-25 2015-10-01 住友ベークライト株式会社 エポキシ樹脂組成物および静電容量型指紋センサー
JP2016014121A (ja) 2014-07-03 2016-01-28 京セラケミカル株式会社 射出成形用エポキシ樹脂組成物およびセンサ部品
JP2016016760A (ja) 2014-07-09 2016-02-01 本田技研工業株式会社 サスペンション装置
WO2016139985A1 (ja) 2015-03-05 2016-09-09 住友ベークライト株式会社 封止用樹脂組成物、車載用電子制御ユニットの製造方法、および車載用電子制御ユニット
JP2016169367A (ja) 2015-03-10 2016-09-23 住友ベークライト株式会社 封止用樹脂組成物、電子部品の製造方法、および電子部品
WO2017043405A1 (ja) 2015-09-10 2017-03-16 ナミックス株式会社 樹脂組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004234245A (ja) 2003-01-29 2004-08-19 Sony Corp 指紋照合装置
JP2006233149A (ja) * 2005-02-28 2006-09-07 Shin Etsu Chem Co Ltd 低誘電膜形成素子封止用樹脂組成物及び半導体装置
US20110089549A1 (en) * 2008-10-10 2011-04-21 Sumitomo Bakelite Co., Ltd Semiconductor device
JP5920219B2 (ja) * 2010-10-19 2016-05-18 住友ベークライト株式会社 封止用樹脂組成物及び電子部品装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015146816A1 (ja) 2014-03-25 2015-10-01 住友ベークライト株式会社 エポキシ樹脂組成物および静電容量型指紋センサー
JP2016014121A (ja) 2014-07-03 2016-01-28 京セラケミカル株式会社 射出成形用エポキシ樹脂組成物およびセンサ部品
JP2016016760A (ja) 2014-07-09 2016-02-01 本田技研工業株式会社 サスペンション装置
WO2016139985A1 (ja) 2015-03-05 2016-09-09 住友ベークライト株式会社 封止用樹脂組成物、車載用電子制御ユニットの製造方法、および車載用電子制御ユニット
JP2016169367A (ja) 2015-03-10 2016-09-23 住友ベークライト株式会社 封止用樹脂組成物、電子部品の製造方法、および電子部品
WO2017043405A1 (ja) 2015-09-10 2017-03-16 ナミックス株式会社 樹脂組成物

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TWI796301B (zh) 2023-03-21
TW201823961A (zh) 2018-07-01
JP2018053240A (ja) 2018-04-05
CN107868406B (zh) 2022-03-11
KR102436208B1 (ko) 2022-08-26
CN107868406A (zh) 2018-04-03
KR20180034246A (ko) 2018-04-04

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