JP7078316B2 - ポリイミド前駆体組成物、それを用いて製造されたポリイミドフィルム及びフレキシブルデバイス - Google Patents
ポリイミド前駆体組成物、それを用いて製造されたポリイミドフィルム及びフレキシブルデバイス Download PDFInfo
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- JP7078316B2 JP7078316B2 JP2020545677A JP2020545677A JP7078316B2 JP 7078316 B2 JP7078316 B2 JP 7078316B2 JP 2020545677 A JP2020545677 A JP 2020545677A JP 2020545677 A JP2020545677 A JP 2020545677A JP 7078316 B2 JP7078316 B2 JP 7078316B2
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- polyimide
- polyimide film
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
Claims (12)
- 前記アミン末端メチルフェニルシロキサンオリゴマーを前記重合成分の総重量を基準に5~30重量%含む
請求項1または2に記載のポリイミド前駆体組成物。 - 前記ポリイミド前駆体組成物の粘度が2000cP以上である
請求項1から3のいずれか1項に記載のポリイミド前駆体組成物。 - 請求項1から請求項4のいずれか1項に記載のポリイミド前駆体組成物のイミド化物を含む
ポリイミドフィルム。 - 前記ポリイミドフィルムのヘイズが、1以下である
請求項5に記載のポリイミドフィルム。 - 前記ポリイミドフィルムの
モジュラスが2.2GPa以下、
引張強度が80MPa以下、
延伸率が28%以上である
請求項5または6に記載のポリイミドフィルム。 - 前記ポリイミドフィルムのガラス転移温度は、380~410℃であり、
350℃で60分間保持した後の重量減少率は、0.037%以下であり、
380℃で60分間保持した後の重量減少率は、0.12%以下である
請求項5から7のいずれか1項に記載のポリイミドフィルム。 - 前記ポリイミドフィルムの
残留応力が25MPa以下であり、
反り度が25μm以下である
請求項5から8のいずれか1項に記載のポリイミドフィルム。 - 請求項5から9のいずれか1項に記載のポリイミドフィルムを基板として含む
フレキシブルデバイス。 - 請求項1から4のいずれか1項に記載のポリイミド前駆体組成物をキャリア基板上に塗布する段階と、
前記ポリイミド前駆体組成物をイミド化することにより、ポリイミドフィルムを形成する段階と、
前記ポリイミドフィルム上に素子を形成する段階と、
前記素子が形成されたポリイミドフィルムを前記キャリア基板から剥離する段階と、
を含む
フレキシブルデバイスの製造方法。 - 前記フレキシブルデバイスの製造方法が、LTPS(low temperature polysilicon)薄膜製造工程、ITO薄膜製造工程及びOxide薄膜製造工程からなるグループから選択される1つ以上の工程を含む
請求項11に記載のフレキシブルデバイスの製造方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2018-0096804 | 2018-08-20 | ||
KR20180096804 | 2018-08-20 | ||
KR1020190100200A KR102289812B1 (ko) | 2018-08-20 | 2019-08-16 | 폴리이미드 전구체 조성물, 이를 이용하여 제조된 폴리이미드 필름 및 플렉서블 디바이스 |
KR10-2019-0100200 | 2019-08-16 | ||
PCT/KR2019/010459 WO2020040494A1 (ko) | 2018-08-20 | 2019-08-19 | 폴리이미드 전구체 조성물, 이를 이용하여 제조된 폴리이미드 필름 및 플렉서블 디바이스 |
Publications (2)
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JP2021516276A JP2021516276A (ja) | 2021-07-01 |
JP7078316B2 true JP7078316B2 (ja) | 2022-05-31 |
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JP2020545677A Active JP7078316B2 (ja) | 2018-08-20 | 2019-08-19 | ポリイミド前駆体組成物、それを用いて製造されたポリイミドフィルム及びフレキシブルデバイス |
Country Status (4)
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JP (1) | JP7078316B2 (ja) |
KR (1) | KR102289812B1 (ja) |
CN (1) | CN111918902A (ja) |
TW (1) | TWI809172B (ja) |
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CN111662451B (zh) * | 2020-06-22 | 2023-04-18 | 武汉依麦德新材料科技有限责任公司 | 具有低相位延迟作用的透明聚酰亚胺薄膜及其制备方法和应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011122198A1 (ja) | 2010-03-31 | 2011-10-06 | Jsr株式会社 | ポリイミド前駆体、該前駆体を含む樹脂組成物および樹脂組成物を用いた膜形成方法 |
WO2014148441A1 (ja) | 2013-03-18 | 2014-09-25 | 旭化成イーマテリアルズ株式会社 | 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法 |
WO2018080222A2 (ko) | 2016-10-31 | 2018-05-03 | 주식회사 엘지화학 | 폴리이미드 필름 형성용 조성물 및 이를 이용하여 제조된 폴리이미드 필름 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2008111489A1 (ja) * | 2007-03-08 | 2008-09-18 | Nippon Steel Chemical Co., Ltd. | 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム |
US9725617B2 (en) * | 2014-04-17 | 2017-08-08 | Fujifilm Hunt Chemicals U.S.A., Inc. | Low toxicity solvent system for polyamideimide and polyamide amic acid resin coating |
KR102463845B1 (ko) * | 2015-12-24 | 2022-11-04 | 주식회사 두산 | 접착력이 향상된 폴리아믹산 조성물 및 이를 포함하는 폴리이미드 필름 |
KR101840978B1 (ko) * | 2017-09-14 | 2018-03-21 | 주식회사 엘지화학 | 폴리이미드 공중합체 및 이를 이용한 폴리이미드 필름 |
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2019
- 2019-08-16 KR KR1020190100200A patent/KR102289812B1/ko active IP Right Grant
- 2019-08-19 JP JP2020545677A patent/JP7078316B2/ja active Active
- 2019-08-19 CN CN201980020045.6A patent/CN111918902A/zh active Pending
- 2019-08-19 TW TW108129468A patent/TWI809172B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011122198A1 (ja) | 2010-03-31 | 2011-10-06 | Jsr株式会社 | ポリイミド前駆体、該前駆体を含む樹脂組成物および樹脂組成物を用いた膜形成方法 |
WO2014148441A1 (ja) | 2013-03-18 | 2014-09-25 | 旭化成イーマテリアルズ株式会社 | 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法 |
WO2018080222A2 (ko) | 2016-10-31 | 2018-05-03 | 주식회사 엘지화학 | 폴리이미드 필름 형성용 조성물 및 이를 이용하여 제조된 폴리이미드 필름 |
Also Published As
Publication number | Publication date |
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TW202017974A (zh) | 2020-05-16 |
JP2021516276A (ja) | 2021-07-01 |
TWI809172B (zh) | 2023-07-21 |
KR20200021411A (ko) | 2020-02-28 |
CN111918902A (zh) | 2020-11-10 |
KR102289812B1 (ko) | 2021-08-13 |
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