JP7140342B2 - ポリイミド前駆体組成物、その製造方法及びそれを用いたポリイミドフィルム - Google Patents
ポリイミド前駆体組成物、その製造方法及びそれを用いたポリイミドフィルム Download PDFInfo
- Publication number
- JP7140342B2 JP7140342B2 JP2020545682A JP2020545682A JP7140342B2 JP 7140342 B2 JP7140342 B2 JP 7140342B2 JP 2020545682 A JP2020545682 A JP 2020545682A JP 2020545682 A JP2020545682 A JP 2020545682A JP 7140342 B2 JP7140342 B2 JP 7140342B2
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- precursor composition
- organic solvent
- polyimide precursor
- partition coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
- C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
DMAc:N,N-ジメチルアセトアミド(N,N-Dimethylacetamide)
DEAc:N,N-ジエチルアセトアミド(N,N-Diethylacetamide)
DEF:N,N-ジエチルホルムアミド(N,N-diethyl formamide)
DMF:N,N-ジメチルホルムアミド(N,N-dimethyl formamide)
NMP:N-メチルピロリドン(N-methylpyrrolidone)
NEP:N-エチルピロリドン(N-ethylpyrrolidone)
DMPA:ジメチルプロピオンアミド
DEPA:ジエチルプロピオンアミド
Claims (13)
- 下記化学式1の構造を有するジアミンと
アミン末端メチルフェニルシロキサンオリゴマーと
を含む
ジアミン成分と、
2種以上のテトラカルボン酸二無水物を含む
二無水物成分と、
を含む
重合成分の重合生成物と、
有機溶媒と、
を含み、
前記有機溶媒は、
有機溶媒総重量を基準に
25℃分配係数LogPが正数である有機溶媒50~80重量%と
25℃分配係数LogPが負数である有機溶媒20~50重量%と
を含み、
前記分配係数LogPが正数である有機溶媒が、N,N-ジエチルアセトアミド(DEAc)、N,N-ジエチルホルムアミド(DEF)、N-エチルピロリドン(NEP)、ジメチルプロピオンアミド(DMPA)、及びジエチルプロピオンアミド(DEPA)のうちから選択される1つ以上であり、
前記分配係数LogPが負数である有機溶媒が、ジメチルアセトアミド(DMAc)、ジメチルホルムアミド(DMF)、N-メチルピロリドン(NMP)、N,N-ジメチルメトキシアセトアミド、ジメチルスルホキシド、ピリジン、ジメチルスルホン、3-メトキシ-N,N-ジメチルプロピオンアミド、及び、3-ブトキシ-N,N-ジメチルプロピオンアミドのうちから選択される1つ以上である、
ポリイミド前駆体組成物:
[化学式1]
- 前記テトラカルボン酸二無水物が、
ビフェニルテトラカルボン酸二無水物(BPDA)及び
ピロメリット酸二無水物(PMDA)を含む
請求項1または2に記載のポリイミド前駆体組成物。 - 前記アミン末端メチルフェニルシロキサンオリゴマーを全体重合成分の総重量に対して5~30重量%含む
請求項1から3のいずれか1項に記載のポリイミド前駆体組成物。 - 前記アミン末端メチルフェニルシロキサンオリゴマーが、全体ジアミン成分のうち、1~20mol%である
請求項1から4のいずれか1項に記載のポリイミド前駆体組成物。 - 前記分配係数LogPが正数である有機溶媒の分配係数LogPは、0.01~3であり、
前記分配係数LogPが負数である有機溶媒の分配係数LogPは、-3~-0.01である
請求項1から5いずれか1項に記載のポリイミド前駆体組成物。 - 化学式1の構造を有するジアミンと両末端アミン変性メチルフェニルシリコンアミン末端メチルフェニルシロキサンオリゴマーとを含むジアミン成分と、2種以上のテトラカルボン酸二無水物を含む二無水物成分と、を含む重合成分を25℃分配係数LogPが正数である有機溶媒中で1次重合する段階と、
前記1次重合した溶液に25℃分配係数LogPが負数である有機溶媒を有機溶媒総重量を基準に20~50重量%になるように添加して2次重合する段階と、
を含む
請求項1から6のいずれか1項に記載のポリイミド前駆体組成物の製造方法。 - 請求項1から6のうち何れか一項に記載のポリイミド前駆体組成物のイミド化物を含む
ポリイミドフィルム。 - 前記ポリイミドフィルムは、
350℃で60分間保持した後の重量減少率が0.032%以下であり、
380℃で60分間保持した後の重量減少率が0.1%以下である
請求項8に記載のポリイミドフィルム。 - 前記ポリイミドフィルムの厚さ方向位相差(Rth)が、-60~60nmである
請求項8または9に記載のポリイミドフィルム。 - 請求項8から10のいずれか1項に記載のポリイミドフィルムを基板として含む
フレキシブルデバイス。 - 請求項1から6のいずれか1項に記載のポリイミド前駆体組成物をキャリア基板上に塗布する段階と、
前記ポリイミド前駆体組成物を加熱してイミド化することにより、ポリイミドフィルムを形成する段階と、
前記ポリイミドフィルム上に素子を形成する段階と、
前記素子が形成されたポリイミドフィルムを前記キャリア基板から剥離する段階と、
を含む
フレキシブルデバイスの製造方法。 - 前記製造方法が、LTPS薄膜製造工程、ITO薄膜製造工程及びOxide薄膜製造工程からなるグループから選択される1つ以上の工程を含む
請求項12に記載のフレキシブルデバイスの製造方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20180096805 | 2018-08-20 | ||
KR10-2018-0096805 | 2018-08-20 | ||
KR10-2019-0100201 | 2019-08-16 | ||
KR1020190100201A KR102264423B1 (ko) | 2018-08-20 | 2019-08-16 | 폴리이미드 전구체 조성물, 그 제조 방법 및 이를 이용한 폴리이미드 필름 |
PCT/KR2019/010460 WO2020040495A1 (ko) | 2018-08-20 | 2019-08-19 | 폴리이미드 전구체 조성물, 그 제조 방법 및 이를 이용한 폴리이미드 필름 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021516277A JP2021516277A (ja) | 2021-07-01 |
JP7140342B2 true JP7140342B2 (ja) | 2022-09-21 |
Family
ID=69638551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020545682A Active JP7140342B2 (ja) | 2018-08-20 | 2019-08-19 | ポリイミド前駆体組成物、その製造方法及びそれを用いたポリイミドフィルム |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7140342B2 (ja) |
KR (1) | KR102264423B1 (ja) |
CN (1) | CN111886279B (ja) |
TW (1) | TWI809173B (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150299513A1 (en) | 2014-04-17 | 2015-10-22 | Carissa M. Kelly | Low toxicity solvent system for polyamideimide and polyamide amic acid resin coating |
KR101840977B1 (ko) | 2017-09-14 | 2018-03-21 | 주식회사 엘지화학 | 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름 |
KR101840978B1 (ko) | 2017-09-14 | 2018-03-21 | 주식회사 엘지화학 | 폴리이미드 공중합체 및 이를 이용한 폴리이미드 필름 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008111489A1 (ja) * | 2007-03-08 | 2008-09-18 | Nippon Steel Chemical Co., Ltd. | 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム |
JP6501312B2 (ja) * | 2015-03-05 | 2019-04-17 | エルジー・ケム・リミテッド | 光電素子のフレキシブル基板用ポリイミドフィルム用組成物 |
KR102463845B1 (ko) * | 2015-12-24 | 2022-11-04 | 주식회사 두산 | 접착력이 향상된 폴리아믹산 조성물 및 이를 포함하는 폴리이미드 필름 |
KR101898455B1 (ko) * | 2016-03-31 | 2018-09-13 | 가부시키가이샤 아이.에스.티 | 폴리이미드 섬유 및 폴리이미드 섬유의 제조 방법 |
-
2019
- 2019-08-16 KR KR1020190100201A patent/KR102264423B1/ko active IP Right Grant
- 2019-08-19 JP JP2020545682A patent/JP7140342B2/ja active Active
- 2019-08-19 CN CN201980020221.6A patent/CN111886279B/zh active Active
- 2019-08-19 TW TW108129483A patent/TWI809173B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150299513A1 (en) | 2014-04-17 | 2015-10-22 | Carissa M. Kelly | Low toxicity solvent system for polyamideimide and polyamide amic acid resin coating |
JP2017516886A (ja) | 2014-04-17 | 2017-06-22 | フジフィルム・ハント・ケミカルズ・ユーエスエイ,インコーポレイテッド | ポリアミドイミド用の低毒性溶媒系およびポリアミドアミック酸樹脂コーティング |
KR101840977B1 (ko) | 2017-09-14 | 2018-03-21 | 주식회사 엘지화학 | 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름 |
KR101840978B1 (ko) | 2017-09-14 | 2018-03-21 | 주식회사 엘지화학 | 폴리이미드 공중합체 및 이를 이용한 폴리이미드 필름 |
JP2020502313A (ja) | 2017-09-14 | 2020-01-23 | エルジー・ケム・リミテッド | ポリイミド共重合体及びそれを利用したポリイミドフィルム |
JP2020504198A (ja) | 2017-09-14 | 2020-02-06 | エルジー・ケム・リミテッド | ポリイミド前駆体組成物及びそれを利用したポリイミドフィルム |
Also Published As
Publication number | Publication date |
---|---|
CN111886279A (zh) | 2020-11-03 |
KR102264423B1 (ko) | 2021-06-14 |
KR20200021412A (ko) | 2020-02-28 |
TW202009257A (zh) | 2020-03-01 |
TWI809173B (zh) | 2023-07-21 |
CN111886279B (zh) | 2023-03-14 |
JP2021516277A (ja) | 2021-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3266808B1 (en) | Composition for polyimide film for flexible substrate of optoelectronic device | |
JP6950143B2 (ja) | シロキサン化合物及びそれを含むポリイミド前駆体組成物 | |
KR102641764B1 (ko) | 디아민 화합물, 이를 이용한 폴리이미드 전구체 및 폴리이미드 필름 | |
KR102188949B1 (ko) | 폴리이미드 전구체 및 이를 이용하는 폴리이미드 필름 | |
JP7078316B2 (ja) | ポリイミド前駆体組成物、それを用いて製造されたポリイミドフィルム及びフレキシブルデバイス | |
CN112566963B (zh) | 聚酰亚胺膜和使用其的柔性器件 | |
JP7140342B2 (ja) | ポリイミド前駆体組成物、その製造方法及びそれを用いたポリイミドフィルム | |
KR102268861B1 (ko) | 폴리이미드 전구체 조성물 및 이를 이용하는 폴리이미드 필름 | |
JP7167414B2 (ja) | ジアミン化合物、それを用いたポリイミド前駆体及びポリイミドフィルム | |
TWI750497B (zh) | 聚醯亞胺膜、使用其的可撓性裝置以及其製備製程 | |
JP7160459B2 (ja) | ジアミン化合物、それを用いたポリイミド前駆体及びポリイミドフィルム | |
KR102247318B1 (ko) | 디아민 화합물, 이를 이용한 폴리이미드 전구체 및 폴리이미드 필름 | |
EP3567046B1 (en) | Polyimide copolymer produced using a compound for enhancing adhesion properties of polyimide resin | |
KR102273077B1 (ko) | 폴리이미드 전구체 및 이를 이용하는 폴리이미드 필름 | |
KR102224986B1 (ko) | 디아민 화합물, 이를 이용한 폴리이미드 전구체 및 폴리이미드 필름 | |
KR102224984B1 (ko) | 디아민 화합물 및 이를 이용한 폴리이미드 전구체와 폴리이미드 필름 | |
KR102258056B1 (ko) | 폴리이미드 전구체 조성물 및 이를 이용하는 폴리이미드 필름 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200908 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210803 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211029 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220315 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220603 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220809 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220825 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7140342 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |