JP7071209B2 - 処理液吐出装置、処理液吐出方法、および基板処理装置 - Google Patents

処理液吐出装置、処理液吐出方法、および基板処理装置 Download PDF

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Publication number
JP7071209B2
JP7071209B2 JP2018092028A JP2018092028A JP7071209B2 JP 7071209 B2 JP7071209 B2 JP 7071209B2 JP 2018092028 A JP2018092028 A JP 2018092028A JP 2018092028 A JP2018092028 A JP 2018092028A JP 7071209 B2 JP7071209 B2 JP 7071209B2
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Prior art keywords
valve
image
nozzle
closing speed
processing liquid
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JP2018092028A
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English (en)
Japanese (ja)
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JP2019197846A (ja
JP2019197846A5 (ja
Inventor
正史 井上
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2018092028A priority Critical patent/JP7071209B2/ja
Priority to KR1020207030610A priority patent/KR102393694B1/ko
Priority to CN201980031376.XA priority patent/CN112106174A/zh
Priority to PCT/JP2019/018246 priority patent/WO2019216310A1/ja
Priority to TW108116119A priority patent/TWI721417B/zh
Publication of JP2019197846A publication Critical patent/JP2019197846A/ja
Publication of JP2019197846A5 publication Critical patent/JP2019197846A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2018092028A 2018-05-11 2018-05-11 処理液吐出装置、処理液吐出方法、および基板処理装置 Active JP7071209B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018092028A JP7071209B2 (ja) 2018-05-11 2018-05-11 処理液吐出装置、処理液吐出方法、および基板処理装置
KR1020207030610A KR102393694B1 (ko) 2018-05-11 2019-05-07 처리액 토출 장치, 처리액 토출 방법, 기판 처리 장치, 및 폐쇄 밸브 조정 방법
CN201980031376.XA CN112106174A (zh) 2018-05-11 2019-05-07 处理液喷出装置、判定装置、处理液喷出方法以及判定方法
PCT/JP2019/018246 WO2019216310A1 (ja) 2018-05-11 2019-05-07 処理液吐出装置、および判定装置、処理液吐出方法、および判定方法
TW108116119A TWI721417B (zh) 2018-05-11 2019-05-10 處理液噴出裝置、處理液噴出方法、基板處理裝置以及開閉閥調整方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018092028A JP7071209B2 (ja) 2018-05-11 2018-05-11 処理液吐出装置、処理液吐出方法、および基板処理装置

Publications (3)

Publication Number Publication Date
JP2019197846A JP2019197846A (ja) 2019-11-14
JP2019197846A5 JP2019197846A5 (ja) 2021-02-12
JP7071209B2 true JP7071209B2 (ja) 2022-05-18

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JP2018092028A Active JP7071209B2 (ja) 2018-05-11 2018-05-11 処理液吐出装置、処理液吐出方法、および基板処理装置

Country Status (5)

Country Link
JP (1) JP7071209B2 (zh)
KR (1) KR102393694B1 (zh)
CN (1) CN112106174A (zh)
TW (1) TWI721417B (zh)
WO (1) WO2019216310A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023127856A (ja) * 2022-03-02 2023-09-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、及び基板処理装置
JP2023127945A (ja) * 2022-03-02 2023-09-14 株式会社Ｓｃｒｅｅｎホールディングス 制御支援装置および制御支援方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000082646A (ja) 1998-09-04 2000-03-21 Dainippon Screen Mfg Co Ltd 塗布液塗布方法及びその装置
JP2016134566A (ja) 2015-01-21 2016-07-25 東京エレクトロン株式会社 液処理方法、液処理装置及び記憶媒体
JP2016178238A (ja) 2015-03-20 2016-10-06 東京エレクトロン株式会社 薬液供給装置の調整方法、記憶媒体及び薬液供給装置
JP2016192550A (ja) 2015-03-30 2016-11-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11176734A (ja) * 1997-12-16 1999-07-02 Sony Corp レジスト塗布装置
JP2000070834A (ja) * 1998-09-04 2000-03-07 Dainippon Screen Mfg Co Ltd 異常検出方法及びこれを用いた基板塗布装置
JP2006324677A (ja) * 2006-05-29 2006-11-30 Tokyo Electron Ltd 液処理装置の自動設定装置
JP5045218B2 (ja) * 2006-10-25 2012-10-10 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP5613636B2 (ja) * 2011-07-27 2014-10-29 東京エレクトロン株式会社 液処理装置、液処理装置の制御方法、コンピュータプログラム、及びコンピュータ可読記憶媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000082646A (ja) 1998-09-04 2000-03-21 Dainippon Screen Mfg Co Ltd 塗布液塗布方法及びその装置
JP2016134566A (ja) 2015-01-21 2016-07-25 東京エレクトロン株式会社 液処理方法、液処理装置及び記憶媒体
JP2016178238A (ja) 2015-03-20 2016-10-06 東京エレクトロン株式会社 薬液供給装置の調整方法、記憶媒体及び薬液供給装置
JP2016192550A (ja) 2015-03-30 2016-11-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JP2019197846A (ja) 2019-11-14
CN112106174A (zh) 2020-12-18
WO2019216310A1 (ja) 2019-11-14
TW202003117A (zh) 2020-01-16
KR102393694B1 (ko) 2022-05-02
TWI721417B (zh) 2021-03-11
KR20200136450A (ko) 2020-12-07

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