JP7070848B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP7070848B2 JP7070848B2 JP2018140011A JP2018140011A JP7070848B2 JP 7070848 B2 JP7070848 B2 JP 7070848B2 JP 2018140011 A JP2018140011 A JP 2018140011A JP 2018140011 A JP2018140011 A JP 2018140011A JP 7070848 B2 JP7070848 B2 JP 7070848B2
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- 239000004065 semiconductor Substances 0.000 title claims description 88
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 238000005530 etching Methods 0.000 claims description 86
- 239000000758 substrate Substances 0.000 claims description 79
- 150000004767 nitrides Chemical class 0.000 claims description 66
- 229910052751 metal Inorganic materials 0.000 claims description 50
- 239000002184 metal Substances 0.000 claims description 50
- 239000012495 reaction gas Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 31
- 239000007789 gas Substances 0.000 claims description 30
- 229910052731 fluorine Inorganic materials 0.000 claims description 23
- 239000011737 fluorine Substances 0.000 claims description 23
- 238000001020 plasma etching Methods 0.000 claims description 16
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- 238000005275 alloying Methods 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- IRPGOXJVTQTAAN-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropanal Chemical compound FC(F)(F)C(F)(F)C=O IRPGOXJVTQTAAN-UHFFFAOYSA-N 0.000 claims description 2
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminum fluoride Inorganic materials F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 28
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 18
- 230000004048 modification Effects 0.000 description 17
- 238000012986 modification Methods 0.000 description 17
- 239000000460 chlorine Substances 0.000 description 13
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 11
- 229910052801 chlorine Inorganic materials 0.000 description 11
- 239000010931 gold Substances 0.000 description 10
- 239000010936 titanium Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910002704 AlGaN Inorganic materials 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000003486 chemical etching Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910003923 SiC 4 Inorganic materials 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- XOYLJNJLGBYDTH-UHFFFAOYSA-M chlorogallium Chemical compound [Ga]Cl XOYLJNJLGBYDTH-UHFFFAOYSA-M 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- UPWPDUACHOATKO-UHFFFAOYSA-K gallium trichloride Chemical compound Cl[Ga](Cl)Cl UPWPDUACHOATKO-UHFFFAOYSA-K 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000005533 two-dimensional electron gas Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Description
図8は、上記実施形態の第1変形例に係る製造工程を示す断面図である。本変形例では、まず、図8の(a)に示されるように、エッチングマスク43の開口43aを介して、ビアホール形成予定領域2aの基板3を裏面3b側から選択的にエッチングする。そして、基板3が僅かに残存する段階で(すなわち、基板3が完全に除去される直前で)エッチングを終了する。この工程は、上記実施形態の図4の(c)に示された工程と同様である。
図9は、上記実施形態の第2変形例に係る半導体装置としてのトランジスタ1Bを示す平面図である。図10は、図9に示されたトランジスタ1BのX-X線に沿った断面図である。なお、説明のため、図9においては絶縁膜31、32の図示が省略されている。
Claims (9)
- 基板と、前記基板上に設けられた窒化物半導体層とを含む基板生産物の前記窒化物半導体層側の表面上に、ビアホール形成予定領域を覆いAlを含む金属膜を形成する工程と、
前記基板生産物の前記基板側の裏面上に、前記ビアホール形成予定領域を露出させる開口を有するエッチングマスクを形成する工程と、
反応性イオンエッチングにより、前記裏面から前記表面に達し前記金属膜を露出させるビアホールを前記基板生産物に形成する工程と、
前記金属膜の露出表面に、アルミニウムのフッ化物及びアルミニウムの酸化物を含むエッチングストッパ膜が生成する工程と、
前記金属膜上の前記エッチングストッパ膜を除去する工程と、
を含み、
前記ビアホールを形成する工程では、少なくともエッチング終了時を含む期間においてフッ素及び酸素を含む反応ガスを用いる、半導体装置の製造方法。 - 前記基板はSiC基板であり、
前記ビアホールを形成する工程では、前記ビアホール形成予定領域の前記SiC基板の少なくとも一部を、フッ素及び酸素を含む反応ガスを用いてエッチングする、請求項1に記載の半導体装置の製造方法。 - 前記エッチングマスクがNi及びCuの少なくとも一方を含む、請求項1または2に記載の半導体装置の製造方法。
- 前記フッ素及び酸素を含む反応ガスは、SF6とO2との混合ガスである、請求項1~3のいずれか1項に記載の半導体装置の製造方法。
- 前記ビアホールを形成する工程では、前記ビアホール形成予定領域の前記窒化物半導体層をフッ素及び酸素を含む反応ガスを用いてエッチングする、請求項1~4のいずれか1項に記載の半導体装置の製造方法。
- 前記ビアホールを形成する工程では、前記ビアホール形成予定領域の前記窒化物半導体層の一部を塩素を含む反応ガスを用いてエッチングし、その後、前記ビアホール形成予定領域の前記窒化物半導体層の残部をフッ素及び酸素を含む反応ガスを用いてエッチングする、請求項1~4のいずれか1項に記載の半導体装置の製造方法。
- 前記エッチングストッパ膜を除去する工程では、前記ビアホール内において形成された前記エッチングストッパ膜を不活性ガスを含むプラズマに晒す、請求項1~6のいずれか1項に記載の半導体装置の製造方法。
- 前記金属膜を形成する工程は、
前記基板生産物の表面上にTi若しくはTaからなる第1層を形成する工程と、
Alからなる第2層を前記第1層上に形成する工程と、
前記第1層及び前記第2層を合金化する工程と、
を含む、請求項1~7のいずれか1項に記載の半導体装置の製造方法。 - 前記不活性ガスはアルゴンガスを含む、請求項7に記載の半導体装置の製造方法。
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