JP7066348B2 - 表示装置の作製方法 - Google Patents
表示装置の作製方法 Download PDFInfo
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- JP7066348B2 JP7066348B2 JP2017148806A JP2017148806A JP7066348B2 JP 7066348 B2 JP7066348 B2 JP 7066348B2 JP 2017148806 A JP2017148806 A JP 2017148806A JP 2017148806 A JP2017148806 A JP 2017148806A JP 7066348 B2 JP7066348 B2 JP 7066348B2
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- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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Description
本実施の形態では、本発明の一態様の表示装置の構成例、および表示装置の作製方法例について説明する。
図1(A)は、本発明の一態様の表示装置10の斜視概略図である。表示装置10は、基板41aと基板41bとが貼り合わされた構成を有する。図1(A)では、基板41bを破線で明示している。
図1(B)に、図1(A)中の切断線A1-A2に対応する断面の一例を示す。図1(B)には、隣接する2つの画素(副画素)を含む領域の断面を示している。またここでは、表示素子として、反射型の液晶素子40を適用した場合の例を示している。図1(B)において、基板41b側が表示面側となる。
続いて、図1(B)に示した表示装置10の作製方法の一例について説明する。図2~図6に示す各図は、表示装置10の作製方法に係る、工程の各段階における断面概略図である。
まず、支持基板44a上に、剥離層43a及び絶縁層82を形成する(図2(A))。
続いて、絶縁層82上に導電層71を形成する。導電層71は、導電膜を成膜した後、レジストマスクを形成し、当該導電膜をエッチングした後にレジストマスクを除去することにより形成できる。
続いて、絶縁層81を形成する。絶縁層81に感光性の材料を用いることで、フォトリソグラフィ法等により開口を形成することができる。なお絶縁層81として、絶縁膜を成膜した後に、レジストマスクを用いて絶縁膜の一部をエッチングして開口を形成してもよい。絶縁層81は、有機絶縁材料を用いると、その上面の平坦性を高めることができるため好ましい。
続いて、絶縁層81上に導電層23を形成する。導電層23は、導電層71と同様の方法により形成できる。
続いて、支持基板44b上に遮光層15を形成する。遮光層15は、導電膜を加工して、導電層71等と同様の方法により形成することが好ましい。なお、後に樹脂層16との間で剥離可能であれば、遮光層15に金属材料、顔料または染料を含む樹脂材料を用いて、絶縁層81等と同様の方法により形成してもよい。
続いて、遮光層15及び支持基板44bを覆って、層16aを形成する(図3(B))。層16aは、後の加熱処理を経て樹脂層16となる層である。
続いて、層16aに対して加熱処理を行い、樹脂層16を形成する(図3(C))。
続いて、樹脂層16上に絶縁層62を形成する(図3(D))。
続いて、絶縁層62上に、着色層51a、着色層51b等を形成し、これらを覆って絶縁層61を形成する。さらに、絶縁層61上に導電層25を形成する。導電層25は、導電層71等と同様の方法により形成することができる。または、遮蔽マスクを用いた成膜方法により、島状の導電層25を形成してもよい。
続いて、支持基板44aと支持基板44bのいずれか一方、または両方に、これらを接着する接着層(図示しない)を形成する。接着層は、画素が配置されている領域を囲むように形成する。接着層は、例えばスクリーン印刷法や、ディスペンス法等により形成することができる。接着層としては、熱硬化性樹脂や紫外線硬化樹脂等を用いることができる。また、紫外線により仮硬化した後に、熱を加えることにより硬化する樹脂などを用いてもよい。または、接着層として、紫外線硬化性と熱硬化性の両方を有する樹脂などを用いてもよい。
続いて、支持基板44b側から光20を照射する(図4(B))。
続いて、支持基板44bと樹脂層16の間、及び遮光層15と樹脂層16の間で剥離することにより、支持基板44b及び遮光層15を除去する(図6(A))。
ここで、樹脂層16を除去することが好ましい。
続いて、絶縁層62と基板41bとを接着層42bによって接着する(図6(C))。接着層42bとしては、熱硬化性樹脂や紫外線硬化樹脂等を用いることができる。
続いて、絶縁層82と剥離層43aとの間で剥離することにより、支持基板44a及び剥離層43aを除去する(図7(A))。
以下では、上記作製方法例1-1とは、一部の異なる作製方法の一例について説明する。なお以下では、上記と重複する部分については説明を省略する場合がある。
図9(A)に示す構成は、樹脂層16を除去しない場合の例である。
図10(A)に、以下で例示する表示装置の断面概略図を示す。図10(A)に示す構成は主に、構造体14を有する点で、図1(B)に示す構成と相違している。
図10(B)に、以下で例示する表示装置の断面概略図を示す。図10(B)に示す構成は主に、構造体14を有する点、及び絶縁層81に凹部が設けられている点で、図1(B)に示す構成と相違している。
図11に、以下で例示する表示装置の断面概略図を示す。図11に示す表示装置は、透過型の液晶素子が適用された表示装置である。
以下では、本発明の一態様の表示装置の例として、反射型の液晶素子と、発光素子の両方を有し、透過モード、反射モード、及びこれらを同時に行うハイブリッドモードの表示を行うことのできる、表示装置(表示パネル)の例を説明する。このような表示パネルを、TR-Hybrid Display(Transmissive OLED and Reflective LC Hybrid Display)とも呼ぶことができる。
図12(A)に、以下で例示する表示装置の断面概略図を示す。図12(A)に示す構成は、液晶素子40と、発光素子90が絶縁層83を介して重ねて配置されている。図12(A)に示す構成では、基板41b側が表示面側に相当する。
以下では、図12(A)に示した表示装置の作製方法の例について説明する。
図12(B)に、以下で例示する表示装置の断面概略図を示す。図12(B)に示す構成は、図12(A)で例示した構成と比較し、トランジスタ70a及びトランジスタ70bが、絶縁層83よりも基板41b側に設けられている点で主に相違している。
以下では、図12(B)に示した表示装置の作製方法の例について説明する。
図18(A)に、以下で例示する表示装置の断面概略図を示す。図18(A)に示す構成は、主にトランジスタ70bがトランジスタ70aとは異なる絶縁層上に設けられている点、また、トランジスタ70aとトランジスタ70bとの間に接着層99を有する点で、図12(A)に示す構成と相違している。
以下では、断面構成例2-3で例示した表示装置の作製方法の例について説明する。
図18(B)に、以下で例示する表示装置の断面概略図を示す。図18(B)に示す構成は、主に発光素子90がトップエミッション型の発光素子である点、絶縁層87から発光素子90までの積層構造の向きが上下逆転している点などで、図18(A)に示す構成と相違している。
以下では、断面構成例2-4で例示した表示装置の作製方法例について説明する。なおここでは、作製方法例2-3と相違する部分について説明する。
以下では、上記に示す各構成要素について説明する。
トランジスタは、ゲート電極として機能する導電層と、半導体層と、ソース電極として機能する導電層と、ドレイン電極として機能する導電層と、ゲート絶縁層として機能する絶縁層と、を有する。上記では、ボトムゲート構造のトランジスタを適用した場合を示している。
以下では、本発明の一態様で開示されるトランジスタに用いることができるCAC(Cloud-Aligned Composite)-OSの構成について説明する。
トランジスタのゲート、ソースおよびドレインのほか、表示装置を構成する各種配線および電極などの導電層に用いることのできる材料としては、アルミニウム、チタン、クロム、ニッケル、銅、イットリウム、ジルコニウム、モリブデン、銀、タンタル、またはタングステンなどの金属、またはこれを主成分とする合金などが挙げられる。またこれらの材料を含む膜を単層で、または積層構造として用いることができる。例えば、シリコンを含むアルミニウム膜の単層構造、チタン膜上にアルミニウム膜を積層する二層構造、タングステン膜上にアルミニウム膜を積層する二層構造、銅-マグネシウム-アルミニウム合金膜上に銅膜を積層する二層構造、チタン膜上に銅膜を積層する二層構造、タングステン膜上に銅膜を積層する二層構造、チタン膜または窒化チタン膜と、その上に重ねてアルミニウム膜または銅膜を積層し、さらにその上にチタン膜または窒化チタン膜を形成する三層構造、モリブデン膜または窒化モリブデン膜と、その上に重ねてアルミニウム膜または銅膜を積層し、さらにその上にモリブデン膜または窒化モリブデン膜を形成する三層構造等がある。なお、酸化インジウム、酸化錫または酸化亜鉛等の酸化物を用いてもよい。また、マンガンを含む銅を用いると、エッチングによる形状の制御性が高まるため好ましい。
各絶縁層に用いることのできる絶縁材料としては、例えば、アクリル、エポキシなどの樹脂、シロキサン結合を有する樹脂の他、酸化シリコン、酸化窒化シリコン、窒化酸化シリコン、窒化シリコン、酸化アルミニウムなどの無機絶縁材料を用いることもできる。
液晶素子としては、例えば垂直配向(VA:Vertical Alignment)モードが適用された液晶素子を用いることができる。垂直配向モードとしては、MVA(Multi-Domain Vertical Alignment)モード、PVA(Patterned Vertical Alignment)モード、ASV(Advanced Super View)モードなどを用いることができる。
発光素子としては、自発光が可能な素子を用いることができ、電流又は電圧によって輝度が制御される素子をその範疇に含んでいる。例えば、発光ダイオード(LED)、有機EL素子、無機EL素子等を用いることができる。
接着層としては、紫外線硬化型等の光硬化型接着剤、反応硬化型接着剤、熱硬化型接着剤、嫌気型接着剤などの各種硬化型接着剤を用いることができる。これら接着剤としてはエポキシ樹脂、アクリル樹脂、シリコーン樹脂、フェノール樹脂、ポリイミド樹脂、イミド樹脂、PVC(ポリビニルクロライド)樹脂、PVB(ポリビニルブチラル)樹脂、EVA(エチレンビニルアセテート)樹脂等が挙げられる。特に、エポキシ樹脂等の透湿性が低い材料が好ましい。また、二液混合型の樹脂を用いてもよい。また、接着シート等を用いてもよい。
接続層としては、異方性導電フィルム(ACF:Anisotropic Conductive Film)や、異方性導電ペースト(ACP:Anisotropic Conductive Paste)などを用いることができる。
着色層に用いることのできる材料としては、金属材料、樹脂材料、顔料または染料が含まれた樹脂材料などが挙げられる。
遮光層として用いることのできる材料としては、カーボンブラック、チタンブラック、金属、金属酸化物、複数の金属酸化物の固溶体を含む複合酸化物等が挙げられる。遮光層は、樹脂材料を含む膜であってもよいし、金属などの無機材料の薄膜であってもよい。また、遮光層に、着色層の材料を含む膜の積層膜を用いることもできる。例えば、ある色の光を透過する着色層に用いる材料を含む膜と、他の色の光を透過する着色層に用いる材料を含む膜との積層構造を用いることができる。着色層と遮光層の材料を共通化することで、装置を共通化できるほか工程を簡略化できるため好ましい。
ここでは、可撓性を有する基板を用いた表示装置の作製方法の例について説明する。
以下では、本発明の一態様の表示装置のより具体的な構成例について、図面を参照して説明する。
図23は、以下で例示する表示装置の断面概略図である。図1(A)におけるFPC36を含む領域、回路34を含む領域、表示部32を含む領域などの断面の一例を示している。
以下では、本発明の一態様の表示装置の例として、タッチセンサを備えるタッチパネルの構成例について説明する。
以下では、構成例2で例示した、反射型の液晶素子と、発光素子の両方を有し、発光モードと反射モードの両方の表示を行うことのできる、表示装置のより具体的な断面構成例について説明する。
図25に、以下で例示する表示装置の断面概略図を示す。図25に示す表示装置は、図12(A)で例示した表示装置に対応する。
図26に、以下で例示する表示装置の断面概略図を示す。図26に示す表示装置は、図12(B)で例示した表示装置に対応する。
図27に、以下で例示する表示装置の断面概略図を示す。図27に示す表示装置は、図18(A)で例示した表示装置に対応する。
以下では、上記表示装置に適用可能なトランジスタの構成例について説明する。
本実施の形態では、本発明の一態様の表示装置のより具体的な例について説明する。以下で例示する表示装置は、反射型の液晶素子と、発光素子の両方を有し、発光モードと反射モードの両方の表示を行うことのできる、表示装置である。
図29(A)は、表示装置400の構成の一例を示すブロック図である。表示装置400は、表示部362にマトリクス状に配列した複数の画素410を有する。また表示装置400は、回路GDと、回路SDを有する。また方向Rに配列した複数の画素410、及び回路GDと電気的に接続する複数の配線G1、複数の配線G2、複数の配線ANO、及び複数の配線CSCOMを有する。また方向Cに配列した複数の画素410、及び回路SDと電気的に接続する複数の配線S1及び複数の配線S2を有する。
図30は、画素410の構成例を示す回路図である。図30では、隣接する2つの画素410を示している。
本実施の形態では、本発明の一態様を用いて作製することができる表示モジュールについて説明する。
本実施の形態では、本発明の一態様の電子機器及び照明装置について、図面を用いて説明する。
11 隔壁
12 液晶
13 モノマー
14 構造体
15 遮光層
16 樹脂層
16a 層
16b 樹脂層
20 光
23 導電層
23a 導電層
23b 導電層
24 液晶層
25 導電層
30 照射領域
32 表示部
34 回路
35 配線
35a 配線
35b 配線
36 FPC
36a FPC
36b FPC
37 IC
40 液晶素子
40a 液晶素子
41a 基板
41b 基板
42a 接着層
42b 接着層
43a 剥離層
43b 剥離層
43c 剥離層
43d 剥離層
44a 支持基板
44b 支持基板
44c 支持基板
44e 支持基板
44f 支持基板
44g 支持基板
46a 接着層
46b 接着層
48 バッファ層
50 凹部
51a 着色層
51b 着色層
53a 配向膜
53b 配向膜
54a 着色層
60 発光素子
61 絶縁層
62 絶縁層
70 トランジスタ
70a トランジスタ
70b トランジスタ
71 導電層
72 半導体層
73 絶縁層
74a 導電層
74b 導電層
79 絶縁層
80 接続部
81 絶縁層
82 絶縁層
83 絶縁層
84 絶縁層
86 絶縁層
87 絶縁層
88 絶縁層
89 接着層
90 発光素子
91 導電層
92 EL層
93 導電層
94 絶縁層
99 接着層
111 導電層
111a 導電層
111b 導電層
112 液晶
113 導電層
121 絶縁層
130 偏光板
131 着色層
133a 配向膜
133b 配向膜
134 着色層
136 絶縁層
141 接着層
142 接着層
143 接着層
151 導電層
152 導電層
153 導電層
163 絶縁層
165 接着層
170 基板
191 導電層
192 EL層
193 導電層
201 トランジスタ
201a トランジスタ
201b トランジスタ
202 トランジスタ
203 容量素子
204 接続部
205 トランジスタ
206 トランジスタ
207 接続部
210 絶縁層
211 絶縁層
212 絶縁層
213 絶縁層
214 絶縁層
216 絶縁層
217 絶縁層
220 絶縁層
221 導電層
222 導電層
224 導電層
231 半導体層
242 接続層
242a 接続層
242b 接続層
243 接続体
251 開口
252 接続部
261 絶縁層
262 絶縁層
263 絶縁層
264 絶縁層
265 絶縁層
310 トランジスタ
310a トランジスタ
310b トランジスタ
310c トランジスタ
310d トランジスタ
311 導電層
311b 導電層
312 半導体層
312a 半導体層
313a 導電層
313b 導電層
313c 導電層
313d 導電層
314 導電層
314a 導電層
315 導電層
320 発光素子
321 導電層
331 絶縁層
332 絶縁層
333 絶縁層
334 絶縁層
335 絶縁層
336 絶縁層
337 絶縁層
340 液晶素子
360 発光素子
360b 発光素子
360g 発光素子
360r 発光素子
360w 発光素子
362 表示部
400 表示装置
410 画素
451 開口
6000 表示モジュール
6001 上部カバー
6002 下部カバー
6003 FPC
6004 タッチパネル
6005 FPC
6006 表示パネル
6009 フレーム
6010 プリント基板
6011 バッテリ
7000 表示部
7001 表示部
7100 携帯電話機
7101 筐体
7103 操作ボタン
7104 外部接続ポート
7105 スピーカ
7106 マイク
7107 カメラ
7110 携帯電話機
7200 携帯情報端末
7201 筐体
7202 操作ボタン
7203 情報
7210 携帯情報端末
7300 テレビジョン装置
7301 筐体
7303 スタンド
7311 リモコン操作機
7400 照明装置
7401 台部
7403 操作スイッチ
7411 発光部
7500 携帯情報端末
7501 筐体
7502 部材
7503 操作ボタン
7600 携帯情報端末
7601 筐体
7602 ヒンジ
7650 携帯情報端末
7651 非表示部
7700 携帯情報端末
7701 筐体
7703a ボタン
7703b ボタン
7704a スピーカ
7704b スピーカ
7705 外部接続ポート
7706 マイク
7709 バッテリ
7800 携帯情報端末
7801 バンド
7802 入出力端子
7803 操作ボタン
7804 アイコン
7805 バッテリ
7900 自動車
7901 車体
7902 車輪
7903 フロントガラス
7904 ライト
7905 フォグランプ
7910 表示部
7911 表示部
7912 表示部
7913 表示部
7914 表示部
7915 表示部
7916 表示部
7917 表示部
8000 筐体
8001 表示部
8003 スピーカ
8101 筐体
8102 筐体
8103 表示部
8104 表示部
8105 マイクロフォン
8106 スピーカ
8107 操作キー
8108 スタイラス
8111 筐体
8112 表示部
8113 キーボード
8114 ポインティングデバイス
Claims (3)
- 基板上に第1の電極及び第2の電極を離間して形成する第1の工程と、
支持基板上に遮光層と、前記遮光層を覆う樹脂層と、前記樹脂層上に第1の着色層及び第2の着色層と、を順に形成する第2の工程と、
前記基板と前記支持基板を、液晶、モノマー及び重合開始剤を含む液晶層を挟んで貼り合せる第3の工程と、
前記支持基板側から光を照射し、前記遮光層に遮光されない領域において、前記液晶層中の前記モノマーを重合させる第4の工程と、
前記支持基板と前記樹脂層の間、及び前記遮光層と前記樹脂層の間で剥離し、前記支持基板と前記遮光層を除去する第5の工程と、を有する、
表示装置の作製方法。 - 第1の支持基板上に第1の絶縁層を形成し、前記第1の絶縁層上に第1の電極及び第2の電極を離間して形成する第1の工程と、
第2の支持基板上に、遮光層と、前記遮光層を覆う樹脂層と、前記樹脂層上に第1の着色層及び第2の着色層と、を順に形成する第2の工程と、
前記第1の支持基板と前記第2の支持基板を、液晶、モノマー及び重合開始剤を含む液晶層を挟んで貼り合せる第3の工程と、
前記第2の支持基板側から光を照射し、前記遮光層に遮光されない領域において、前記液晶層中の前記モノマーを重合させる第4の工程と、
前記第2の支持基板と前記樹脂層の間、及び前記遮光層と前記樹脂層の間で剥離する第5の工程と、
前記樹脂層の露出した一部をエッチングにより除去し、前記第1の着色層及び前記第2の着色層と、第2の基板とを、第1の接着層により貼り合せる第6の工程と、
前記第1の支持基板と前記第1の絶縁層との間で剥離する第7の工程と、
前記第1の絶縁層の露出した面と、第1の基板とを、第2の接着層により貼り合せる第8の工程と、を有する、
表示装置の作製方法。 - 請求項2において、
前記第1の基板及び前記第2の基板に、可撓性を有する基板を用いる、
表示装置の作製方法。
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