JP7064176B2 - 半導体装置密着層形成用エポキシ樹脂組成物 - Google Patents
半導体装置密着層形成用エポキシ樹脂組成物 Download PDFInfo
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- JP7064176B2 JP7064176B2 JP2019517721A JP2019517721A JP7064176B2 JP 7064176 B2 JP7064176 B2 JP 7064176B2 JP 2019517721 A JP2019517721 A JP 2019517721A JP 2019517721 A JP2019517721 A JP 2019517721A JP 7064176 B2 JP7064176 B2 JP 7064176B2
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- YTUFRRBSSNRYID-UHFFFAOYSA-N propyl 3-propoxypropanoate Chemical compound CCCOCCC(=O)OCCC YTUFRRBSSNRYID-UHFFFAOYSA-N 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- HBCQSNAFLVXVAY-UHFFFAOYSA-N pyrimidine-2-thiol Chemical compound SC1=NC=CC=N1 HBCQSNAFLVXVAY-UHFFFAOYSA-N 0.000 description 1
- 239000002151 riboflavin Substances 0.000 description 1
- 238000006798 ring closing metathesis reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- SRNNCPHVRPJTDS-UHFFFAOYSA-N spiro[1,3-dioxane-5,4'-7-oxabicyclo[4.1.0]heptane] Chemical compound C1C2OC2CCC21COCOC2 SRNNCPHVRPJTDS-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- ZEMGGZBWXRYJHK-UHFFFAOYSA-N thiouracil Chemical compound O=C1C=CNC(=S)N1 ZEMGGZBWXRYJHK-UHFFFAOYSA-N 0.000 description 1
- 229950000329 thiouracil Drugs 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- GAMLUOSQYHLFCT-UHFFFAOYSA-N triethoxy-[3-[(3-ethyloxetan-3-yl)methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1(CC)COC1 GAMLUOSQYHLFCT-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000005951 trifluoromethanesulfonyloxy group Chemical group 0.000 description 1
- PUFJKMYZVNKQCV-UHFFFAOYSA-N trimethoxy(3-piperidin-1-ylpropyl)silane Chemical compound CO[Si](OC)(OC)CCCN1CCCCC1 PUFJKMYZVNKQCV-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- AATYKEFFPLPLST-UHFFFAOYSA-N trimethylsilylurea Chemical compound C[Si](C)(C)NC(N)=O AATYKEFFPLPLST-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
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JP2017095784 | 2017-05-12 | ||
JP2017095784 | 2017-05-12 | ||
PCT/JP2018/018377 WO2018207920A1 (fr) | 2017-05-12 | 2018-05-11 | Composition de résine époxyde destinée à former une couche adhésive de dispositif à semi-conducteur |
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JPWO2018207920A1 JPWO2018207920A1 (ja) | 2020-03-12 |
JP7064176B2 true JP7064176B2 (ja) | 2022-05-10 |
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JP (1) | JP7064176B2 (fr) |
TW (1) | TWI821184B (fr) |
WO (1) | WO2018207920A1 (fr) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003277486A (ja) | 2002-03-26 | 2003-10-02 | Matsushita Electric Works Ltd | 片面封止用エポキシ樹脂組成物及び片面封止型半導体装置 |
JP2007091814A (ja) | 2005-09-27 | 2007-04-12 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP2007092002A (ja) | 2005-09-30 | 2007-04-12 | Hitachi Chem Co Ltd | エポキシ樹脂組成物及びそれを用いた半導体装置用中空パッケージ、並び半導体部品装置 |
JP2010195997A (ja) | 2009-02-27 | 2010-09-09 | Panasonic Electric Works Co Ltd | 高誘電性エポキシ樹脂組成物及び高周波デバイス |
WO2015046333A1 (fr) | 2013-09-27 | 2015-04-02 | 株式会社ダイセル | Composition d'agent adhésif pour stratifiés semi-conducteurs |
JP2015227390A (ja) | 2014-05-30 | 2015-12-17 | 京セラケミカル株式会社 | 光半導体封止用樹脂組成物および光半導体装置 |
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JPH02187421A (ja) * | 1988-08-19 | 1990-07-23 | Haisoole Japan Kk | 紫外線感光又は透過素子用の紫外線透過性保護又は支持材料 |
JP2005026447A (ja) * | 2003-07-02 | 2005-01-27 | Sumitomo Bakelite Co Ltd | 半導体装置および半導体装置の製造方法 |
JP6074357B2 (ja) * | 2013-12-24 | 2017-02-01 | 日東電工株式会社 | 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 |
-
2018
- 2018-05-11 WO PCT/JP2018/018377 patent/WO2018207920A1/fr active Application Filing
- 2018-05-11 JP JP2019517721A patent/JP7064176B2/ja active Active
- 2018-05-14 TW TW107116294A patent/TWI821184B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003277486A (ja) | 2002-03-26 | 2003-10-02 | Matsushita Electric Works Ltd | 片面封止用エポキシ樹脂組成物及び片面封止型半導体装置 |
JP2007091814A (ja) | 2005-09-27 | 2007-04-12 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP2007092002A (ja) | 2005-09-30 | 2007-04-12 | Hitachi Chem Co Ltd | エポキシ樹脂組成物及びそれを用いた半導体装置用中空パッケージ、並び半導体部品装置 |
JP2010195997A (ja) | 2009-02-27 | 2010-09-09 | Panasonic Electric Works Co Ltd | 高誘電性エポキシ樹脂組成物及び高周波デバイス |
WO2015046333A1 (fr) | 2013-09-27 | 2015-04-02 | 株式会社ダイセル | Composition d'agent adhésif pour stratifiés semi-conducteurs |
JP2015227390A (ja) | 2014-05-30 | 2015-12-17 | 京セラケミカル株式会社 | 光半導体封止用樹脂組成物および光半導体装置 |
Also Published As
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JPWO2018207920A1 (ja) | 2020-03-12 |
WO2018207920A1 (fr) | 2018-11-15 |
TWI821184B (zh) | 2023-11-11 |
TW201902976A (zh) | 2019-01-16 |
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