JP7064176B2 - 半導体装置密着層形成用エポキシ樹脂組成物 - Google Patents

半導体装置密着層形成用エポキシ樹脂組成物 Download PDF

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Publication number
JP7064176B2
JP7064176B2 JP2019517721A JP2019517721A JP7064176B2 JP 7064176 B2 JP7064176 B2 JP 7064176B2 JP 2019517721 A JP2019517721 A JP 2019517721A JP 2019517721 A JP2019517721 A JP 2019517721A JP 7064176 B2 JP7064176 B2 JP 7064176B2
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Japan
Prior art keywords
epoxy resin
resin composition
semiconductor element
resin
group
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JP2019517721A
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English (en)
Japanese (ja)
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JPWO2018207920A1 (ja
Inventor
剛史 諏訪
祐揮 上田
泰之 小出
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Nissan Chemical Corp
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Nissan Chemical Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2019517721A 2017-05-12 2018-05-11 半導体装置密着層形成用エポキシ樹脂組成物 Active JP7064176B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017095784 2017-05-12
JP2017095784 2017-05-12
PCT/JP2018/018377 WO2018207920A1 (fr) 2017-05-12 2018-05-11 Composition de résine époxyde destinée à former une couche adhésive de dispositif à semi-conducteur

Publications (2)

Publication Number Publication Date
JPWO2018207920A1 JPWO2018207920A1 (ja) 2020-03-12
JP7064176B2 true JP7064176B2 (ja) 2022-05-10

Family

ID=64104552

Family Applications (1)

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JP2019517721A Active JP7064176B2 (ja) 2017-05-12 2018-05-11 半導体装置密着層形成用エポキシ樹脂組成物

Country Status (3)

Country Link
JP (1) JP7064176B2 (fr)
TW (1) TWI821184B (fr)
WO (1) WO2018207920A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277486A (ja) 2002-03-26 2003-10-02 Matsushita Electric Works Ltd 片面封止用エポキシ樹脂組成物及び片面封止型半導体装置
JP2007091814A (ja) 2005-09-27 2007-04-12 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2007092002A (ja) 2005-09-30 2007-04-12 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた半導体装置用中空パッケージ、並び半導体部品装置
JP2010195997A (ja) 2009-02-27 2010-09-09 Panasonic Electric Works Co Ltd 高誘電性エポキシ樹脂組成物及び高周波デバイス
WO2015046333A1 (fr) 2013-09-27 2015-04-02 株式会社ダイセル Composition d'agent adhésif pour stratifiés semi-conducteurs
JP2015227390A (ja) 2014-05-30 2015-12-17 京セラケミカル株式会社 光半導体封止用樹脂組成物および光半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02187421A (ja) * 1988-08-19 1990-07-23 Haisoole Japan Kk 紫外線感光又は透過素子用の紫外線透過性保護又は支持材料
JP2005026447A (ja) * 2003-07-02 2005-01-27 Sumitomo Bakelite Co Ltd 半導体装置および半導体装置の製造方法
JP6074357B2 (ja) * 2013-12-24 2017-02-01 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277486A (ja) 2002-03-26 2003-10-02 Matsushita Electric Works Ltd 片面封止用エポキシ樹脂組成物及び片面封止型半導体装置
JP2007091814A (ja) 2005-09-27 2007-04-12 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2007092002A (ja) 2005-09-30 2007-04-12 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた半導体装置用中空パッケージ、並び半導体部品装置
JP2010195997A (ja) 2009-02-27 2010-09-09 Panasonic Electric Works Co Ltd 高誘電性エポキシ樹脂組成物及び高周波デバイス
WO2015046333A1 (fr) 2013-09-27 2015-04-02 株式会社ダイセル Composition d'agent adhésif pour stratifiés semi-conducteurs
JP2015227390A (ja) 2014-05-30 2015-12-17 京セラケミカル株式会社 光半導体封止用樹脂組成物および光半導体装置

Also Published As

Publication number Publication date
JPWO2018207920A1 (ja) 2020-03-12
WO2018207920A1 (fr) 2018-11-15
TWI821184B (zh) 2023-11-11
TW201902976A (zh) 2019-01-16

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