JP7054587B2 - ドリル加工装置及びドリル加工方法 - Google Patents

ドリル加工装置及びドリル加工方法 Download PDF

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JP7054587B2
JP7054587B2 JP2016228477A JP2016228477A JP7054587B2 JP 7054587 B2 JP7054587 B2 JP 7054587B2 JP 2016228477 A JP2016228477 A JP 2016228477A JP 2016228477 A JP2016228477 A JP 2016228477A JP 7054587 B2 JP7054587 B2 JP 7054587B2
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drill
drilling
printed circuit
circuit board
feed rate
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JP2018083264A (ja
JP2018083264A5 (enExample
Inventor
秀幸 高光
裕次郎 荒木
健太郎 山上
幸宏 山田
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Via Mechanics Ltd
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Via Mechanics Ltd
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  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP2016228477A 2016-11-25 2016-11-25 ドリル加工装置及びドリル加工方法 Active JP7054587B2 (ja)

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JP2018083264A5 JP2018083264A5 (enExample) 2019-11-07
JP7054587B2 true JP7054587B2 (ja) 2022-04-14

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI825238B (zh) * 2018-12-11 2023-12-11 日商維亞機械股份有限公司 鑽孔加工裝置及鑽孔加工方法
JP7386034B2 (ja) * 2018-12-11 2023-11-24 ビアメカニクス株式会社 ドリル加工装置及びドリル加工方法
CN113518505B (zh) * 2020-04-10 2022-10-28 苏州维嘉科技股份有限公司 一种电路板钻孔加工方法
CN112372739B (zh) * 2020-10-22 2022-04-05 广东鼎泰高科技术股份有限公司 一种钻头的使用方法及制备方法
CN112917583A (zh) * 2020-12-29 2021-06-08 吴思 一种聚氨酯保温板加工方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004063771A (ja) 2002-07-29 2004-02-26 Hitachi Via Mechanics Ltd 多層回路基板の止まり穴加工方法および多層回路基板並びに測定用プローブ
JP2006095656A (ja) 2004-09-30 2006-04-13 Doshisha プリント基板用穴あけ加工機およびそれを用いたプリント基板の穴あけ加工条件決定方法
JP2008055536A (ja) 2006-08-30 2008-03-13 Daihatsu Motor Co Ltd 深穴切削加工方法およびこの方法に用いられる加工装置
JP2012016793A (ja) 2010-07-09 2012-01-26 Sugino Machine Ltd 穴あけ加工制御方法および穴あけ加工装置
US20140093321A1 (en) 2012-09-28 2014-04-03 Huawei Technologies Co., Ltd. Printed circuit board, and method and apparatus for drilling printed circuit board
JP2014226764A (ja) 2013-05-25 2014-12-08 大船企業日本株式会社 スピンドル下降距離情報検出機構及びスピンドル下降距離情報検出機構を組み込んだ基板加工装置
US20150078848A1 (en) 2013-08-28 2015-03-19 Huawei Technologies Co., Ltd. Method for Implementing High-Precision Backdrilling Stub Length Control
JP2015223685A (ja) 2014-05-30 2015-12-14 ビアメカニクス株式会社 加工方法および加工装置
JP2016122825A (ja) 2014-02-21 2016-07-07 ビアメカニクス株式会社 バックドリル加工方法及びバックドリル加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3220219B2 (ja) * 1992-03-17 2001-10-22 株式会社オーエム製作所 プリント基板の穴あけ方法
JPH05337895A (ja) * 1992-06-10 1993-12-21 Hitachi Seiko Ltd プリント基板穴明機
JPH07223198A (ja) * 1994-02-08 1995-08-22 Hitachi Ltd 穴あけ加工方法及び穴あけ加工装置
JPH09207099A (ja) * 1996-02-05 1997-08-12 Ibiden Co Ltd 穴明けドリル指令装置
JP3286522B2 (ja) * 1996-03-14 2002-05-27 日立ビアメカニクス株式会社 プリント基板加工装置
JPH10135647A (ja) * 1996-10-30 1998-05-22 Hitachi Ltd パターンカット装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004063771A (ja) 2002-07-29 2004-02-26 Hitachi Via Mechanics Ltd 多層回路基板の止まり穴加工方法および多層回路基板並びに測定用プローブ
JP2006095656A (ja) 2004-09-30 2006-04-13 Doshisha プリント基板用穴あけ加工機およびそれを用いたプリント基板の穴あけ加工条件決定方法
JP2008055536A (ja) 2006-08-30 2008-03-13 Daihatsu Motor Co Ltd 深穴切削加工方法およびこの方法に用いられる加工装置
JP2012016793A (ja) 2010-07-09 2012-01-26 Sugino Machine Ltd 穴あけ加工制御方法および穴あけ加工装置
US20140093321A1 (en) 2012-09-28 2014-04-03 Huawei Technologies Co., Ltd. Printed circuit board, and method and apparatus for drilling printed circuit board
JP2014226764A (ja) 2013-05-25 2014-12-08 大船企業日本株式会社 スピンドル下降距離情報検出機構及びスピンドル下降距離情報検出機構を組み込んだ基板加工装置
US20150078848A1 (en) 2013-08-28 2015-03-19 Huawei Technologies Co., Ltd. Method for Implementing High-Precision Backdrilling Stub Length Control
JP2016122825A (ja) 2014-02-21 2016-07-07 ビアメカニクス株式会社 バックドリル加工方法及びバックドリル加工装置
JP2015223685A (ja) 2014-05-30 2015-12-14 ビアメカニクス株式会社 加工方法および加工装置

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