JP7044900B2 - 真空加熱装置、リフレクタ装置 - Google Patents

真空加熱装置、リフレクタ装置 Download PDF

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Publication number
JP7044900B2
JP7044900B2 JP2020556616A JP2020556616A JP7044900B2 JP 7044900 B2 JP7044900 B2 JP 7044900B2 JP 2020556616 A JP2020556616 A JP 2020556616A JP 2020556616 A JP2020556616 A JP 2020556616A JP 7044900 B2 JP7044900 B2 JP 7044900B2
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JP
Japan
Prior art keywords
fixed
reflector
unit
mounting surface
holding
Prior art date
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Active
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JP2020556616A
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English (en)
Japanese (ja)
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JPWO2020100376A1 (ja
Inventor
弘敏 阪上
哲宏 大野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
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Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of JPWO2020100376A1 publication Critical patent/JPWO2020100376A1/ja
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Publication of JP7044900B2 publication Critical patent/JP7044900B2/ja
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D11/00—Arrangement of elements for electric heating in or on furnaces
    • F27D11/02—Ohmic resistance heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
    • F27D2007/066—Vacuum

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Control Of Resistance Heating (AREA)
  • Furnace Details (AREA)
JP2020556616A 2018-11-14 2019-08-26 真空加熱装置、リフレクタ装置 Active JP7044900B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018213953 2018-11-14
JP2018213953 2018-11-14
PCT/JP2019/033320 WO2020100376A1 (ja) 2018-11-14 2019-08-26 真空加熱装置、リフレクタ装置

Publications (2)

Publication Number Publication Date
JPWO2020100376A1 JPWO2020100376A1 (ja) 2021-06-10
JP7044900B2 true JP7044900B2 (ja) 2022-03-30

Family

ID=70731092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020556616A Active JP7044900B2 (ja) 2018-11-14 2019-08-26 真空加熱装置、リフレクタ装置

Country Status (5)

Country Link
JP (1) JP7044900B2 (ko)
KR (1) KR102476865B1 (ko)
CN (1) CN112041627B (ko)
TW (1) TWI749366B (ko)
WO (1) WO2020100376A1 (ko)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017180865A (ja) 2016-03-28 2017-10-05 日本碍子株式会社 焼成炉
JP2018037482A (ja) 2016-08-30 2018-03-08 東京応化工業株式会社 基板加熱装置及び基板加熱方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164222A (ja) * 1982-03-25 1983-09-29 Matsushita Electric Ind Co Ltd 加熱処理装置
JP3155844B2 (ja) * 1992-10-20 2001-04-16 日本真空技術株式会社 真空処理装置の高周波電極
JP3682340B2 (ja) 1996-06-28 2005-08-10 リンナイ株式会社 遮熱板
US7126087B2 (en) * 2003-08-07 2006-10-24 Canon Kabushiki Kaisha Method of effecting heating and cooling in reduced pressure atmosphere
JP4769532B2 (ja) * 2005-09-30 2011-09-07 パナソニック環境エンジニアリング株式会社 高温処理装置
KR101895398B1 (ko) 2011-04-28 2018-10-25 삼성전자 주식회사 산화물 층의 형성 방법 및 이를 포함하는 반도체 소자의 제조 방법
JP6056854B2 (ja) * 2012-05-14 2017-01-11 コニカミノルタ株式会社 ガスバリア性フィルム、ガスバリア性フィルムの製造方法及び電子デバイス
CN104779179A (zh) * 2014-01-13 2015-07-15 马悦 一种对半导体器件衬底进行热处理的装置
US10221483B2 (en) * 2014-05-16 2019-03-05 Applied Materials, Inc. Showerhead design
JP7018713B2 (ja) * 2017-03-29 2022-02-14 東京応化工業株式会社 基板加熱装置、基板処理システム及び基板加熱方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017180865A (ja) 2016-03-28 2017-10-05 日本碍子株式会社 焼成炉
JP2018037482A (ja) 2016-08-30 2018-03-08 東京応化工業株式会社 基板加熱装置及び基板加熱方法

Also Published As

Publication number Publication date
TWI749366B (zh) 2021-12-11
JPWO2020100376A1 (ja) 2021-06-10
TW202018237A (zh) 2020-05-16
KR20200139792A (ko) 2020-12-14
CN112041627A (zh) 2020-12-04
WO2020100376A1 (ja) 2020-05-22
CN112041627B (zh) 2022-07-05
KR102476865B1 (ko) 2022-12-12

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