JP7044900B2 - Vacuum heating device, reflector device - Google Patents

Vacuum heating device, reflector device Download PDF

Info

Publication number
JP7044900B2
JP7044900B2 JP2020556616A JP2020556616A JP7044900B2 JP 7044900 B2 JP7044900 B2 JP 7044900B2 JP 2020556616 A JP2020556616 A JP 2020556616A JP 2020556616 A JP2020556616 A JP 2020556616A JP 7044900 B2 JP7044900 B2 JP 7044900B2
Authority
JP
Japan
Prior art keywords
fixed
reflector
unit
mounting surface
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020556616A
Other languages
Japanese (ja)
Other versions
JPWO2020100376A1 (en
Inventor
弘敏 阪上
哲宏 大野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of JPWO2020100376A1 publication Critical patent/JPWO2020100376A1/en
Application granted granted Critical
Publication of JP7044900B2 publication Critical patent/JP7044900B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27BFURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00Furnaces of a kind not covered by any preceding group
    • F27B17/0016Chamber type furnaces
    • F27B17/0025Especially adapted for treating semiconductor wafers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27BFURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00Furnaces of a kind not covered by any preceding group
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D11/00Arrangement of elements for electric heating in or on furnaces
    • F27D11/02Ohmic resistance heating
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/06Forming or maintaining special atmospheres or vacuum within heating chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/06Forming or maintaining special atmospheres or vacuum within heating chambers
    • F27D2007/066Vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Control Of Resistance Heating (AREA)
  • Furnace Details (AREA)

Description

本発明は真空雰囲気中で加熱対象物を赤外線で加熱する技術に係り、特に、赤外線を反射するリフレクタ装置と、そのリフレクタ装置を有する真空加熱装置に関する。 The present invention relates to a technique for heating an object to be heated with infrared rays in a vacuum atmosphere, and more particularly to a reflector device that reflects infrared rays and a vacuum heating device having the reflector device.

半導体基板やガラス基板等を処理対象物として、真空雰囲気中で処理対象物の表面に薄膜を形成したり、また、形成されている薄膜を真空雰囲気中でエッチング処理する真空処理は広く行われており、真空処理をする直前には、処理対象物を所定温度に昇温させ、真空処理の反応性を向上させる加熱前処理工程が置かれている。 Vacuum processing is widely performed in which a semiconductor substrate, a glass substrate, or the like is used as a processing object to form a thin film on the surface of the processing object in a vacuum atmosphere, or the formed thin film is etched in a vacuum atmosphere. Immediately before the vacuum treatment is performed, a heating pretreatment step of raising the temperature of the object to be treated to a predetermined temperature and improving the reactivity of the vacuum treatment is provided.

また、真空雰囲気中で処理対象物を加熱すると、処理対象物に付着した有機物や水分が真空雰囲気中で蒸発し、処理対象物のクリーニングが行われる。 Further, when the object to be treated is heated in a vacuum atmosphere, the organic substances and moisture adhering to the object to be treated evaporate in the vacuum atmosphere, and the object to be treated is cleaned.

温度制御性のよさから、このような処理対象物の加熱が赤外線照射によって行われる場合が多く、真空槽への赤外線照射を遮断させるために、真空槽の壁面と赤外線照射装置との間にリフレクタが配置され、真空槽が昇温しないようにされている。 Due to the good temperature controllability, such heating of the object to be processed is often performed by infrared irradiation, and in order to block infrared irradiation to the vacuum chamber, a reflector is provided between the wall surface of the vacuum chamber and the infrared irradiation device. Is arranged so that the temperature of the vacuum chamber does not rise.

ところで、製造コストを低下させるために、処理対象物はますます大型化しており、それに伴って真空槽も大型化するが、リフレクタが大型化すると熱による線膨張量が大きくなり、リフレクタやリフレクタ取付部等に変形が生じたり、取付不良が発生するなどの弊害が大きくなる。 By the way, in order to reduce the manufacturing cost, the object to be processed is getting larger and larger, and the vacuum tank is also getting bigger. The harmful effects such as deformation of parts and improper mounting will increase.

近年では複数の単位反射板を行列配置して一台のリフレクタを構成するリフレクタ装置の開発が試みられているが、単位反射板を一箇所だけ固定して変形せずに熱膨張できるようにすると、単位反射板の縁付近での垂れ下がり量が大きくなり、単位反射板の間に熱漏れが発生する。 In recent years, attempts have been made to develop a reflector device in which a plurality of unit reflectors are arranged in a matrix to form a single reflector. , The amount of sagging near the edge of the unit reflector becomes large, and heat leakage occurs between the unit reflectors.

また、熱漏れを防止するために単位反射板の縁付近を重ねると、熱膨張の際に垂れ下がった縁付近同士が摺動し、ダストが多量に発生する。 Further, when the vicinity of the edge of the unit reflector is overlapped in order to prevent heat leakage, the vicinity of the edge that hangs down during thermal expansion slides with each other, and a large amount of dust is generated.

特開平10-19386号公報Japanese Unexamined Patent Publication No. 10-19386

本発明は上記従来技術の不都合を解決するために創作された発明であり、その解決しようとする課題は、リフレクタ板に変形や垂れ下がりの無いリフレクタ装置と、そのリフレクタ装置が設けられた真空加熱装置を提供することにある。 The present invention is an invention created to solve the above-mentioned inconveniences of the prior art, and the problem to be solved is a reflector device in which the reflector plate is not deformed or hung down, and a vacuum heating device provided with the reflector device. Is to provide.

本発明は、真空排気される真空槽と、前記真空槽の内部に配置され、赤外線を放射して加熱対象物を加熱する加熱源と、前記真空槽の内部に配置され、前記加熱源から放射されて前記真空槽の内壁面のうちの取付面に向かう赤外線を遮蔽する複数個の単位反射板を有するリフレクタ装置と、を有し、前記単位反射板は前記取付面に沿って配置された真空加熱装置であって、前記リフレクタ装置は、一端が前記真空槽の前記取付面に固定され、他端が前記単位反射板に固定された複数個の固定装置と、一端が前記真空槽の前記取付面に固定され、他端が前記単位反射板に固定された複数個の保持装置と、を有し、前記固定装置が前記取付面に固定された場所と前記単位反射板に固定された場所との間の相対的な位置は前記固定装置によって固定され、前記保持装置は変形可能な変形部を有し、前記保持装置が前記取付面に固定された場所と、前記単位反射板に固定された場所との間の相対的な位置関係は、前記変形部の変形によって変更されるようにされた真空加熱装置である。
また、本発明は、前記単位反射板が加熱されて熱伸びする際には、前記変形部は変形されて、前記保持装置が前記取付面に固定された場所と、前記単位反射板に固定された場所との間の相対的な位置関係が変更される真空加熱装置である。
また、本発明は、前記変形部は板バネであり、前記単位反射板の熱伸びによって前記板バネの表面に垂直な方向の力が印加される向きに前記板バネが配置された真空加熱装置である。
また、本発明は、前記単位反射板には遊び孔が設けられ、前記保持装置は、前記遊び孔に挿通された第一のねじ止め装置によって前記取付面にねじ止め固定され、前記遊び孔の縁と前記第一のねじ止め装置とは、前記単位反射板が前記取付面に沿って熱伸びしても、前記単位反射板が室温以上で上限温度よりも低温の温度範囲では非接触になるようにされた真空加熱装置である。
また、本発明は、前記固定装置と前記保持装置とは、前記単位反射板に溶接固定された真空加熱装置である。
また、本発明は、前記固定装置は前記単位反射板に溶接固定され、前記保持装置は第二のねじ止め装置によって前記単位反射板にねじ止め固定された真空加熱装置である。
また、本発明は、一枚の前記単位反射板に固定された前記固定装置は、同じ前記単位反射板に固定された前記保持装置と前記保持装置の間に配置された真空加熱装置である。
また、本発明は、一枚の前記単位反射板に固定された前記固定装置を中心にして、同じ前記単位反射板に固定された複数の前記保持装置が配置された真空加熱装置である。
また、本発明は、真空槽の内部で前記真空槽の内壁面のうちの取付面に沿って配置され、加熱源から放射されて前記取付面に向かう赤外線を遮蔽する複数個の単位反射板と、一端が前記真空槽の前記取付面に固定され、他端が前記単位反射板に固定される複数個の固定装置と、一端が前記真空槽の前記取付面に固定され、他端が前記単位反射板に固定される複数個の保持装置と、を有し、前記固定装置が前記取付面に固定された場所と前記単位反射板に固定された場所との間の相対的な位置は前記固定装置によって固定され、前記保持装置は変形可能な変形部を有し、前記保持装置が前記取付面に固定された場所と、前記単位反射板に固定された場所との間の相対的な位置関係は、前記変形部の変形によって変更されるようにされたリフレクタ装置である。
また、本発明は、前記単位反射板が加熱されて熱伸びする際には、前記変形部は変形されて、前記保持装置が前記取付面に固定された場所と、前記単位反射板に固定された場所との間の相対的な位置関係が変更されるリフレクタ装置である。
また、本発明は、前記変形部は板バネであり、前記単位反射板の熱伸びによって前記板バネの表面に垂直な方向の力が印加される向きに前記板バネが配置されたリフレクタ装置である。
また、本発明は、前記単位反射板には遊び孔が設けられ、前記保持装置は、前記遊び孔に挿通された第一のねじ止め装置によって前記取付面にねじ止め固定され、前記遊び孔の縁と前記第一のねじ止め装置とは、前記単位反射板が前記取付面に沿って熱伸びしても、前記単位反射板が室温以上で上限温度よりも低温の温度範囲では非接触になるようにされたリフレクタ装置である。
また、本発明は、前記固定装置と前記保持装置とは、前記単位反射板に溶接固定されたリフレクタ装置である。
また、本発明は、前記固定装置は前記単位反射板に溶接固定され、前記保持装置は第二のねじ止め装置によって前記単位反射板にねじ止め固定されたリフレクタ装置である。
また、本発明は、一枚の前記単位反射板に固定された前記固定装置は、同じ前記単位反射板に固定された前記保持装置と前記保持装置の間に配置されたリフレクタ装置である。
また、本発明は、一枚の前記単位反射板に固定された前記固定装置を中心にして、同じ前記単位反射板に固定された複数の前記保持装置が配置されたリフレクタ装置である。
The present invention is a vacuum chamber to be evacuated, a heating source arranged inside the vacuum chamber to radiate infrared rays to heat an object to be heated, and a heating source arranged inside the vacuum chamber and radiated from the heating source. It has a reflector device having a plurality of unit reflectors that shield infrared rays toward the mounting surface of the inner wall surface of the vacuum chamber, and the unit reflectors are vacuum arranged along the mounting surface. The reflector device is a heating device having a plurality of fixing devices having one end fixed to the mounting surface of the vacuum chamber and the other end fixed to the unit reflector, and one end of the mounting of the vacuum chamber. It has a plurality of holding devices fixed to a surface and the other end fixed to the unit reflector, and a place where the fixing device is fixed to the mounting surface and a place where the fixing device is fixed to the unit reflector. The relative position between was fixed by the fixing device, the holding device having a deformable portion, fixed to the place where the holding device was fixed to the mounting surface and to the unit reflector. The relative positional relationship with the place is a vacuum heating device adapted to be changed by the deformation of the deformed portion.
Further, in the present invention, when the unit reflector is heated and stretched, the deformed portion is deformed and fixed to the place where the holding device is fixed to the mounting surface and to the unit reflector. It is a vacuum heating device whose relative positional relationship with the place is changed.
Further, in the present invention, the deformed portion is a leaf spring, and the vacuum heating device is arranged in a direction in which a force in a direction perpendicular to the surface of the leaf spring is applied by thermal elongation of the unit reflector. Is.
Further, in the present invention, the unit reflector is provided with a play hole, and the holding device is screwed and fixed to the mounting surface by a first screwing device inserted into the play hole, and the play hole is formed. Even if the unit reflector heats up along the mounting surface, the edge and the first screwing device become non-contact in a temperature range where the unit reflector is at room temperature or higher and lower than the upper limit temperature. It is a vacuum heating device made up of the above.
Further, in the present invention, the fixing device and the holding device are vacuum heating devices welded and fixed to the unit reflector.
Further, the present invention is a vacuum heating device in which the fixing device is welded and fixed to the unit reflector, and the holding device is screwed and fixed to the unit reflector by a second screwing device.
Further, in the present invention, the fixing device fixed to one unit reflector is a vacuum heating device arranged between the holding device fixed to the same unit reflector and the holding device.
Further, the present invention is a vacuum heating device in which a plurality of holding devices fixed to the same unit reflector are arranged around the fixing device fixed to one unit reflector.
Further, the present invention comprises a plurality of unit reflectors which are arranged inside the vacuum chamber along the mounting surface of the inner wall surface of the vacuum chamber and shield the infrared rays radiated from the heating source toward the mounting surface. One end is fixed to the mounting surface of the vacuum chamber and the other end is fixed to the unit reflector, and one end is fixed to the mounting surface of the vacuum chamber and the other end is the unit. It has a plurality of holding devices fixed to the reflector, and the relative position between the place where the fixing device is fixed to the mounting surface and the place where the fixing device is fixed to the unit reflector is the fixing. Fixed by the device, the holding device has a deformable portion, and the relative positional relationship between the place where the holding device is fixed to the mounting surface and the place where the holding device is fixed to the unit reflector. Is a reflector device that is modified by the deformation of the deformed portion.
Further, in the present invention, when the unit reflector is heated and stretched, the deformed portion is deformed and fixed to the place where the holding device is fixed to the mounting surface and to the unit reflector. It is a reflector device that changes the relative positional relationship with the place.
Further, the present invention is a reflector device in which the deformed portion is a leaf spring, and the leaf spring is arranged in a direction in which a force in a direction perpendicular to the surface of the leaf spring is applied by thermal elongation of the unit reflector. be.
Further, in the present invention, the unit reflector is provided with a play hole, and the holding device is screwed and fixed to the mounting surface by a first screwing device inserted into the play hole, and the play hole is formed. Even if the unit reflector heats up along the mounting surface, the edge and the first screwing device become non-contact in a temperature range where the unit reflector is at room temperature or higher and lower than the upper limit temperature. It is a reflector device.
Further, in the present invention, the fixing device and the holding device are reflector devices welded and fixed to the unit reflector.
Further, the present invention is a reflector device in which the fixing device is welded and fixed to the unit reflector, and the holding device is screwed and fixed to the unit reflector by a second screwing device.
Further, in the present invention, the fixing device fixed to the single unit reflector is a reflector device arranged between the holding device fixed to the same unit reflecting plate and the holding device.
Further, the present invention is a reflector device in which a plurality of holding devices fixed to the same unit reflecting plate are arranged around the fixing device fixed to one unit reflecting plate.

単位反射板は固定装置と保持装置とで真空槽に固定されるので、熱による大きな垂れ下がりは発生しない。 Since the unit reflector is fixed to the vacuum chamber by the fixing device and the holding device, a large sagging due to heat does not occur.

取付部材と単位反射板との間や、単位反射板同士の間は摺動しないので、ダストの発生はない。 Since it does not slide between the mounting member and the unit reflectors or between the unit reflectors, no dust is generated.

本発明の真空加熱装置の一例An example of the vacuum heating device of the present invention 第一例のリフレクタ装置を説明するための平面図Top view for explaining the reflector device of the first example (a):組み立て前の第一例のリフレクタ装置の単位反射装置 (b):組み立て後の第一例のリフレクタ装置の単位反射装置(a): Unit reflecting device of the first example reflector device before assembly (b): Unit reflecting device of the first example reflector device after assembly 保持装置の(a):平面図 (b):左側面図 (c):正面図 (d):背面図 (e):断面図Holding device (a): plan view (b): left side view (c): front view (d): rear view (e): cross-sectional view 第二例のリフレクタ装置を説明するための平面図Top view for explaining the reflector device of the second example 第三例のリフレクタ装置を説明するための平面図Top view for explaining the reflector device of the third example 第四例のリフレクタ装置を説明するための平面図Top view for explaining the reflector device of the fourth example (a)、(b):保持装置と固定装置の取付方法が異なる単位反射装置の例(a), (b): Example of a unit reflecting device in which the mounting method of the holding device and the fixing device is different. (a)、(b):保持装置と固定装置の取付方法が異なる単位反射装置の他の例(a), (b): Another example of a unit reflecting device in which the holding device and the fixing device are attached differently. 保持装置の他の例の(a):平面図 (b):左側面図 (c):正面図 (d):背面図 (e):断面図Other examples of the holding device (a): plan view (b): left side view (c): front view (d): rear view (e): cross-sectional view 保持装置の更に他の例の(a):平面図 (b):左側面図 (c):正面図 (d):背面図 (e):断面図Still another example of the holding device (a): plan view (b): left side view (c): front view (d): rear view (e): cross-sectional view

<真空加熱装置>
図1の符号2は、本発明の一例の真空加熱装置であり、真空槽17を有している。
<Vacuum heating device>
Reference numeral 2 in FIG. 1 is a vacuum heating device according to an example of the present invention, and has a vacuum chamber 17.

真空槽17の内部には、加熱源88が配置されており、真空槽17は複数の内壁面を有している。複数の内壁面のうちの一内壁面である取付面19と加熱源88との間にはリフレクタ装置110が設けられている。その取付面19と対向する他の内壁面18と加熱源88との間には、基板配置装置85が設けられている。ここでは、真空槽17の内壁面のうちの取付面19は天井の表面であり、取付面19と平行に対向する内壁面18は底面である。 A heating source 88 is arranged inside the vacuum chamber 17, and the vacuum chamber 17 has a plurality of inner wall surfaces. A reflector device 110 is provided between the mounting surface 19 which is one of the inner wall surfaces of the plurality of inner wall surfaces and the heating source 88. A substrate arranging device 85 is provided between the other inner wall surface 18 facing the mounting surface 19 and the heating source 88. Here, the mounting surface 19 of the inner wall surface of the vacuum chamber 17 is the surface of the ceiling, and the inner wall surface 18 facing parallel to the mounting surface 19 is the bottom surface.

真空槽17には真空排気装置78が接続されており、真空排気装置78が動作すると真空槽17の内部は真空排気され、真空雰囲気が形成される。 A vacuum exhaust device 78 is connected to the vacuum tank 17, and when the vacuum exhaust device 78 operates, the inside of the vacuum tank 17 is evacuated to form a vacuum atmosphere.

基板配置装置85にはピン86が設けられており、ピン86が基板配置装置85の表面よりも上方に上昇した状態で加熱対象物である基板87が真空槽17の内部に搬入され、ピン86の上に乗せられる。図1はその状態を示している。 A pin 86 is provided in the substrate arranging device 85, and the substrate 87, which is an object to be heated, is carried into the vacuum chamber 17 with the pin 86 raised above the surface of the substrate arranging device 85, and the pin 86 is provided. Can be placed on top. FIG. 1 shows the state.

次いで、ピン86が降下し、基板87が基板配置装置85上に水平に配置され、次いで加熱源88に通電され、加熱源88が昇温して赤外線が放射される。
加熱源88から放射された赤外線のうち、基板配置装置85に向かって放射された赤外線は基板87に照射され基板87が加熱される。
Next, the pin 86 is lowered, the substrate 87 is horizontally arranged on the substrate arranging device 85, then the heating source 88 is energized, the heating source 88 is heated, and infrared rays are radiated.
Of the infrared rays radiated from the heating source 88, the infrared rays radiated toward the substrate arranging device 85 irradiate the substrate 87 to heat the substrate 87.

加熱源88から放射された赤外線のうち、基板87とは反対側に位置する取付面19に向かって放射された赤外線は、加熱源88と取付面19との間に位置するリフレクタ装置110に照射される。 Of the infrared rays radiated from the heating source 88, the infrared rays radiated toward the mounting surface 19 located on the opposite side of the substrate 87 irradiate the reflector device 110 located between the heating source 88 and the mounting surface 19. Will be done.

従って、取付面19側では、リフレクタ装置110によって赤外線は遮蔽され、取付面19には照射されず、真空槽17が昇温しないようにされている。 Therefore, on the mounting surface 19 side, infrared rays are shielded by the reflector device 110 so that the mounting surface 19 is not irradiated and the vacuum chamber 17 is prevented from rising in temperature.

リフレクタ装置110に照射された赤外線は加熱源88が位置する方向に反射され、基板87に照射される。 The infrared rays emitted to the reflector device 110 are reflected in the direction in which the heating source 88 is located, and are applied to the substrate 87.

基板87は、真空槽17の内部が真空排気されて形成された真空雰囲気に配置された状態で加熱され、所定温度に昇温すると加熱源88への通電は停止され、基板87は真空加熱装置2の内部から、真空加熱装置2に接続された真空処理装置に搬送される。 The substrate 87 is heated in a state of being arranged in a vacuum atmosphere formed by vacuum exhausting the inside of the vacuum chamber 17, and when the temperature rises to a predetermined temperature, the energization to the heating source 88 is stopped, and the substrate 87 is a vacuum heating device. It is conveyed from the inside of 2 to a vacuum processing device connected to the vacuum heating device 2.

<リフレクタ装置>
リフレクタ装置110の構造を説明する。リフレクタ装置110は、図2に示すように、複数の単位反射装置111~113、121~123、131~133を有している。各単位反射装置111~113、121~123、131~133は、四角形状の単位反射板31を有しており、各単位反射装置111~113、121~123、131~133の単位反射板31が、ここでは横方向に3個で縦方向に3個の3×3個の行列状に配置されている。単位反射板31は水平に配置されている。
<Reflector device>
The structure of the reflector device 110 will be described. As shown in FIG. 2, the reflector device 110 has a plurality of unit reflectors 111 to 113, 121 to 123, and 131 to 133. Each unit reflector 111 to 113, 121 to 123, 131 to 133 has a rectangular unit reflector 31, and the unit reflector 31 of each unit reflector 111 to 113, 121 to 123, 131 to 133. However, here, they are arranged in a matrix of 3 in the horizontal direction and 3 in the vertical direction. The unit reflector 31 is arranged horizontally.

各単位反射板31には、一個の固定装置21と、一乃至複数個(ここでは4個)の保持装置11a~11dとがそれぞれ同じ表面に取り付けられている。 On each unit reflector 31, one fixing device 21 and one or more (here, four) holding devices 11a to 11d are attached to the same surface.

各単位反射装置111~113、121~123、131~133の構造は同じであり、図3(a)、(b)には、それらの単位反射装置111~113、121~123、131~133のうちの一台の単位反射装置122の構造が示されている。 The structures of the unit reflectors 111 to 113, 121 to 123, 131 to 133 are the same, and FIGS. 3 (a) and 3 (b) show the unit reflectors 111 to 113, 121 to 123, 131 to 133. The structure of one of the unit reflectors 122 is shown.

各単位反射装置111~113、121~123、131~133は固定装置21と保持装置11a~11dとによって、後述するように真空槽17の複数の内壁面のうちの取付面19にそれぞれ取り付けられる。 Each unit reflecting device 111 to 113, 121 to 123, 131 to 133 is attached to the mounting surface 19 of the plurality of inner wall surfaces of the vacuum chamber 17 by the fixing device 21 and the holding devices 11a to 11d, respectively, as described later. ..

図3(a)は、単位反射板31が取付面19から分離された状態が示されており、同図(b)は単位反射板31が取付面19に取り付けられた状態が示されている。 FIG. 3A shows a state in which the unit reflector 31 is separated from the mounting surface 19, and FIG. 3B shows a state in which the unit reflector 31 is mounted on the mounting surface 19. ..

固定装置21は、中心に挿通孔53が設けられた筒形形状の本体52を有している。 The fixing device 21 has a tubular main body 52 having an insertion hole 53 in the center.

単位反射板31の中央には、貫通孔である第一の板側固定孔47が形成されており、固定装置21は、挿通孔53と第一の板側固定孔47とが連通するように単位反射板31に固定されている。ここでは固定装置21は挿通孔53と第一の板側固定孔47とが連通された状態で単位反射板31に溶接固定されている。 A first plate-side fixing hole 47, which is a through hole, is formed in the center of the unit reflector 31, and the fixing device 21 communicates the insertion hole 53 with the first plate-side fixing hole 47. It is fixed to the unit reflector 31. Here, the fixing device 21 is welded and fixed to the unit reflector 31 in a state where the insertion hole 53 and the first plate side fixing hole 47 are communicated with each other.

各保持装置11a~11dは、単位反射板31と取付面19との間に位置しており、単位反射板31と接触する板側接続部62と、取付面19と接触する槽側接続部63と、一端が板側接続部62に固定され他端が槽側接続部63に固定された変形部64とを有している。 Each of the holding devices 11a to 11d is located between the unit reflector 31 and the mounting surface 19, and has a plate-side connecting portion 62 in contact with the unit reflector 31 and a tank-side connecting portion 63 in contact with the mounting surface 19. And a deformed portion 64 having one end fixed to the plate-side connecting portion 62 and the other end fixed to the tank-side connecting portion 63.

図4(a)は、保持装置11a~11dの平面図、同図(b)は左側面図、同図(c)は正面図、同図(d)は背面図であり、同図(e)は、保持装置11a~11dを、板側接続部62と変形部64と槽側接続部63とを通る平面で截断した截断断面図である。 4 (a) is a plan view of the holding devices 11a to 11d, FIG. 4 (b) is a left side view, FIG. 4 (c) is a front view, and FIG. 4 (d) is a rear view. ) Is a cross-sectional view of the holding devices 11a to 11d cut along a plane passing through the plate-side connecting portion 62, the deforming portion 64, and the tank-side connecting portion 63.

取付面19と、槽側接続部63と固定装置21との接続を説明すると、槽側接続部63には第一の保持側固定孔60が設けられており、単位反射板31のうち、第一の保持側固定孔60と対面する部分には、遊び孔46a~46d(図3(a)、(b)には符号46c、46dで特定される遊び孔と、符号11c、11dで特定される保持装置と、下記の符号26c、26dで特定される第一のねじ止め装置と、下記の符号58c、58dで特定される第二の槽側固定孔とは示されていない。)が設けられている。 Explaining the connection between the mounting surface 19, the tank-side connecting portion 63, and the fixing device 21, the tank-side connecting portion 63 is provided with the first holding-side fixing hole 60, and is the first of the unit reflectors 31. The play holes 46a to 46d (in FIGS. 3 (a) and 3 (b), the play holes specified by the reference numerals 46c and 46d and the play holes specified by the reference numerals 11c and 11d are specified in the portion facing the holding side fixing hole 60. The holding device, the first screwing device specified by the following reference numerals 26c and 26d, and the second tank-side fixing hole specified by the following reference numerals 58c and 58d are not shown). Has been done.

取付面19には、挿通孔53と対面する位置に第一の槽側固定孔57が設けられており、また、第一の保持側固定孔60と対面する位置に第二の槽側固定孔58a~58dがそれぞれ設けられている。 The mounting surface 19 is provided with a first tank-side fixing hole 57 at a position facing the insertion hole 53, and a second tank-side fixing hole at a position facing the first holding-side fixing hole 60. 58a to 58d are provided respectively.

板側接続部62は単位反射板31に溶接固定されており、第一の槽側固定孔57と挿通孔53とを連通させると共に、第二の槽側固定孔58a~58dと各保持装置11a~11dの第一の保持側固定孔60とをそれぞれ連通させた状態で、固定装置21のうちの取付面19側に向けられた一端と、各保持装置11a~11dの槽側接続部63とを取付面19に接触させ、第一の板側固定孔47と挿通孔53とに固定ねじ止め装置27の胴部66を挿通し、固定ねじ止め装置27を回転させて第一の槽側固定孔57の内周面に設けられたねじ部分と胴部66の先端の部分の外周面とにそれぞれ設けられたねじ部分とを螺合させ、その回転によって胴部66の先端を第一の槽側固定孔57の底面に向けて進行させる。 The plate-side connecting portion 62 is welded and fixed to the unit reflector 31, and the first tank-side fixing hole 57 and the insertion hole 53 are communicated with each other, and the second tank-side fixing holes 58a to 58d and each holding device 11a are connected. With the first holding side fixing holes 60 of ~ 11d communicating with each other, one end of the fixing device 21 facing the mounting surface 19 and the tank side connecting portion 63 of each holding device 11a to 11d. Is in contact with the mounting surface 19, the body portion 66 of the fixing screw fixing device 27 is inserted into the first plate side fixing hole 47 and the insertion hole 53, and the fixing screw fixing device 27 is rotated to fix the first tank side. The screw portion provided on the inner peripheral surface of the hole 57 and the screw portion provided on the outer peripheral surface of the tip portion of the body portion 66 are screwed together, and the tip of the body portion 66 is turned into the first tank by the rotation thereof. Advance toward the bottom surface of the side fixing hole 57.

各固定ねじ止め装置27の胴部66から張り出した頭部67は第一の板側固定孔47よりも大きく形成されており、固定ねじ止め装置27の進行により、頭部67の座面は単位反射板31にそれぞれ接触し、固定ねじ止め装置27の回転によって、頭部67は、単位反射板31と固定装置21とを取付面19に向けて押圧する。 The head 67 protruding from the body portion 66 of each fixing screw fixing device 27 is formed larger than the first plate-side fixing hole 47, and the seating surface of the head 67 is united by the progress of the fixing screw fixing device 27. The head 67 presses the unit reflector 31 and the fixing device 21 toward the mounting surface 19 by contacting each of the reflectors 31 and rotating the fixing screw fixing device 27.

他方、第一のねじ止め装置26a~26dの胴部37が、胴部37の先端に設けられた先端部38から遊び孔46a~46dに挿通され、先端部38が各保持装置11a~11dの第一の保持側固定孔60と、第二の槽側固定孔58a~58dとにそれぞれ挿入される。符号39は頭部であり、単位反射板31とは非接触である。 On the other hand, the body 37 of the first screwing devices 26a to 26d is inserted into the play holes 46a to 46d from the tip 38 provided at the tip of the body 37, and the tip 38 is the holding device 11a to 11d. It is inserted into the first holding-side fixing hole 60 and the second tank-side fixing hole 58a to 58d, respectively. Reference numeral 39 is a head and is not in contact with the unit reflector 31.

遊び孔46a~46dは第一のねじ止め装置26a~26dの胴部37よりも大きく形成されており、遊び孔46a~46dの縁と、遊び孔46a~46dに挿通された胴部37の外周側面との間は、常温(ここでは20℃±15℃の温度範囲を常温というものとする。)や室温(ここでは300K)では所定距離離間するようにされており、リフレクタ装置110が所定の上限温度よりも低温の場合も離間するようにされている。上限温度は例えば600℃である。 The play holes 46a to 46d are formed larger than the body portion 37 of the first screwing devices 26a to 26d, and the edges of the play holes 46a to 46d and the outer periphery of the body portion 37 inserted through the play holes 46a to 46d. It is designed to be separated from the side surface by a predetermined distance at room temperature (here, the temperature range of 20 ° C. ± 15 ° C. is referred to as normal temperature) or at room temperature (here, 300 K), and the reflector device 110 is specified. It is designed to be separated even when the temperature is lower than the upper limit temperature. The upper limit temperature is, for example, 600 ° C.

第二の槽側固定孔58a~58dの内周面と先端部38の外周面とには、それぞれねじが形成されており、先端部38が第一の保持側固定孔60と第二の槽側固定孔58a~58dに挿通され、第一のねじ止め装置26a~26dが回転されると先端部38と第二の槽側固定孔58a~58dとが螺合しながら先端部38が第二の槽側固定孔58a~58dの底面に向けて進行する。 Screws are formed on the inner peripheral surface of the second tank-side fixing holes 58a to 58d and the outer peripheral surface of the tip 38, respectively, and the tip 38 is the first holding-side fixing hole 60 and the second tank. When the first screwing device 26a to 26d is rotated by being inserted into the side fixing holes 58a to 58d, the tip 38 is screwed into the second tank side fixing holes 58a to 58d and the tip 38 is second. Proceed toward the bottom surface of the tank-side fixing holes 58a to 58d.

ここで、胴部37の径は第一の保持側固定孔60の径と先端部38の径よりも大きく形成されており、先端部38が第二の槽側固定孔58a~58dの底面に向けて進行して胴部37のうちの先端部38側の端部が槽側接続部63に当接され、更に先端部38が進行すると、槽側接続部63は、胴部37の端部によって真空槽17の取付面19に押圧される。 Here, the diameter of the body portion 37 is formed to be larger than the diameter of the first holding side fixing hole 60 and the diameter of the tip portion 38, and the tip portion 38 is formed on the bottom surface of the second tank side fixing holes 58a to 58d. The end portion of the body portion 37 on the tip 38 side is brought into contact with the tank side connection portion 63, and when the tip portion 38 further advances, the tank side connection portion 63 becomes the end portion of the body portion 37. Is pressed against the mounting surface 19 of the vacuum chamber 17.

従って、単位反射板31は、固定装置21が設けられた部分が固定ねじ止め装置27によって取付面19に固定され、保持装置11a~11dが設けられた部分が、第一のねじ止め装置26a~26dによって取付面19に固定される。その結果、固定装置21が取付面19に固定された場所と、固定装置21が単位反射板31に固定された場所との間の相対的な位置は固定装置21によって固定される。 Therefore, in the unit reflector 31, the portion provided with the fixing device 21 is fixed to the mounting surface 19 by the fixing screw fixing device 27, and the portion provided with the holding devices 11a to 11d is the first screw fixing device 26a to. It is fixed to the mounting surface 19 by 26d. As a result, the relative position between the place where the fixing device 21 is fixed to the mounting surface 19 and the place where the fixing device 21 is fixed to the unit reflector 31 is fixed by the fixing device 21.

<加熱工程>
真空槽17の内部は真空排気装置78によって真空排気され、真空雰囲気にされており、真空排気されながら基板配置装置85上に基板87が配置された後、加熱源88に通電して発熱させ、赤外線を放射させると、放射された赤外線は基板87とリフレクタ装置110の単位反射板31とに照射され、基板87と単位反射板31とが加熱される。
<Heating process>
The inside of the vacuum chamber 17 is evacuated by the vacuum exhaust device 78 to create a vacuum atmosphere. After the substrate 87 is placed on the substrate arranging device 85 while being evacuated, the heating source 88 is energized to generate heat. When the infrared rays are radiated, the emitted infrared rays are applied to the substrate 87 and the unit reflector 31 of the reflector device 110, and the substrate 87 and the unit reflector 31 are heated.

固定装置21は、各単位反射板31の中央に位置しており、一枚の単位反射板31に固定された保持装置11a~11dは、同じ単位反射板31に固定された固定装置21を中心にした円周上に配置されている。 The fixing device 21 is located in the center of each unit reflector 31, and the holding devices 11a to 11d fixed to one unit reflector 31 are centered on the fixing device 21 fixed to the same unit reflector 31. It is placed on the circumference of the circle.

各保持装置11a~11dの変形部64は平板形形状であり、各変形部64の面積が大きい面は固定装置21に向けられている。 The deformed portions 64 of the holding devices 11a to 11d have a flat plate shape, and the surface of each deformed portion 64 having a large area is directed to the fixing device 21.

単位反射板31には赤外線が照射され、真空槽17の取付面19には赤外線の照射は遮蔽されるため、赤外線が放射されても真空槽17の内壁面の昇温は小さいが、単位反射板31の温度は真空槽17の取付面19の温度よりも大きく昇温する。 Since the unit reflector 31 is irradiated with infrared rays and the mounting surface 19 of the vacuum chamber 17 is shielded from the irradiation of infrared rays, the temperature rise of the inner wall surface of the vacuum chamber 17 is small even if the infrared rays are emitted, but the unit reflection is performed. The temperature of the plate 31 rises higher than the temperature of the mounting surface 19 of the vacuum chamber 17.

従って、真空槽17の取付面19は熱伸び(膨張とも言う)はしないのに対し、単位反射板31は熱伸びする。その場合、固定装置21が取り付けられた部分は取付面19に固定されているため、単位反射板31は、固定装置21が固定された部分を中心とした放射方向に熱伸びしようとする。 Therefore, the mounting surface 19 of the vacuum chamber 17 does not thermally expand (also referred to as expansion), whereas the unit reflector 31 thermally expands. In that case, since the portion to which the fixing device 21 is attached is fixed to the attachment surface 19, the unit reflector 31 tends to thermally expand in the radial direction centering on the portion to which the fixing device 21 is fixed.

各保持装置11a~11dの槽側接続部63は第一のねじ止め装置26a~26dによって取付面19に固定されているため移動しないが、板側接続部62側は単位反射板31の熱伸びと共に移動しようとする。そのため、変形部64には放射方向に向く力が板側接続部62から印加される。 The tank-side connecting portions 63 of the holding devices 11a to 11d do not move because they are fixed to the mounting surface 19 by the first screwing devices 26a to 26d, but the plate-side connecting portions 62 side are thermally expanded by the unit reflector 31. Try to move with. Therefore, a force directed in the radial direction is applied to the deformed portion 64 from the plate side connecting portion 62.

保持装置11a~11d(及び後述の保持装置12、13a、13b、14a~14c、15a~15d、16a~16d)は、変形部64に印加される力が、矩形形状の変形部64の面積が大きい面に対して垂直な方向になるように配置されており、変形部64の変形を伴って、一個の保持装置11a~11d(及び後述の保持装置12、13a、13b、14a~14c、15a~15d、16a~16d)の中では、板側接続部62が槽側接続部63に対して移動しようとする。 In the holding devices 11a to 11d (and the holding devices 12, 13a, 13b, 14a to 14c, 15a to 15d, 16a to 16d described later), the force applied to the deforming portion 64 is the area of the rectangular deformed portion 64. It is arranged so as to be perpendicular to the large surface, and one holding device 11a to 11d (and the holding devices 12, 13a, 13b, 14a to 14c, 15a described later) are arranged with the deformation of the deformation portion 64. ~ 15d, 16a ~ 16d), the plate-side connecting portion 62 tends to move with respect to the tank-side connecting portion 63.

このとき、遊び孔46a~46dの縁と第一のねじ止め装置26a~26dの胴部37の外周側面との間に隙間が形成されており、非接触な状態にされているから、単位反射板31が加熱されて変形部64の変形を伴って熱伸びする際に、単位反射板31の温度が所定温度以下であれば遊び孔46a~46dの縁と胴部37の外周側面とは接触せずに非接触の状態が維持されるようになっている。 At this time, a gap is formed between the edges of the play holes 46a to 46d and the outer peripheral side surface of the body portion 37 of the first screwing devices 26a to 26d, and the unit is reflected because it is in a non-contact state. When the plate 31 is heated and thermally stretched with the deformation of the deformed portion 64, if the temperature of the unit reflector plate 31 is equal to or lower than a predetermined temperature, the edges of the play holes 46a to 46d come into contact with the outer peripheral side surface of the body portion 37. It is designed to maintain a non-contact state without any contact.

従って、各保持装置11a~11dの板側接続部62は、単位反射板31の熱伸びにより、保持装置11a~11dが取付面19に固定された場所と、単位反射板31に固定された場所との間の相対的な位置関係が、変形部64の変形によって変更され、その結果、固定装置21が単位反射板31に固定された部分を中心として放射方向に移動する。 Therefore, the plate-side connecting portions 62 of the holding devices 11a to 11d are the places where the holding devices 11a to 11d are fixed to the mounting surface 19 and the places where the holding devices 11a to 11d are fixed to the unit reflector 31 due to the thermal expansion of the unit reflector 31. The relative positional relationship with and to is changed by the deformation of the deformed portion 64, and as a result, the fixing device 21 moves in the radial direction around the portion fixed to the unit reflector 31.

このように、変形部64の変形を伴って、一個の保持装置11a~11dの中で、単位反射板31に固定された板側接続部62が取付面19に固定された槽側接続部63に対して相対的に移動することで、板側接続部62と槽側接続部63とに印加される力は緩和されるので保持装置11a~11dは破壊されない。 As described above, with the deformation of the deformed portion 64, the plate-side connecting portion 62 fixed to the unit reflector 31 is fixed to the mounting surface 19 in the single holding devices 11a to 11d. By moving relative to the plate side connection portion 62, the force applied to the plate side connection portion 62 and the tank side connection portion 63 is relaxed, so that the holding devices 11a to 11d are not destroyed.

加熱された単位反射板31の温度が低下したときには、熱伸びした単位反射板31は収縮し、変形部64の変形は元の形状に戻り、各保持装置11a~11dの一枚の単位反射板31の中では、板側接続部62が槽側接続部63に対して単位反射板31の中心方向に移動し、板側接続部62と槽側接続部63との間の相対的な位置関係は加熱前の状態に戻る。 When the temperature of the heated unit reflector 31 drops, the heat-stretched unit reflector 31 contracts, the deformation of the deformed portion 64 returns to its original shape, and one unit reflector of each holding device 11a to 11d. In 31, the plate-side connecting portion 62 moves toward the center of the unit reflector 31 with respect to the tank-side connecting portion 63, and the relative positional relationship between the plate-side connecting portion 62 and the tank-side connecting portion 63. Returns to the state before heating.

なお、隣接する単位反射板31の側面と単位反射板31の側面とは、常温では離間させておき、熱伸びによって互いに近接するようにしてもよい。 The side surface of the adjacent unit reflector 31 and the side surface of the unit reflector 31 may be separated from each other at room temperature so as to be close to each other by thermal elongation.

基板87が所定温度に加熱されると、基板87は真空槽17から他の真空処理装置の処理室に移動される。 When the substrate 87 is heated to a predetermined temperature, the substrate 87 is moved from the vacuum chamber 17 to the processing chamber of another vacuum processing apparatus.

以上説明したリフレクタ装置110では、一枚の単位反射板31の中心に固定装置21を溶接固定し、その単位反射板31の中央に位置する固定装置21の周囲の位置に四個の保持装置11a~11dが配置されていたが、図7のように行列配置された複数の単位反射装置411~413、421~423、431~433の単位反射板34の中央に固定装置24を位置させ、その固定装置24の周囲に三個の保持装置14a~14cを位置させたリフレクタ装置410も本発明に含まれる。 In the reflector device 110 described above, the fixing device 21 is welded and fixed to the center of one unit reflector 31, and four holding devices 11a are located around the fixing device 21 located at the center of the unit reflector 31. ~ 11d was arranged, but the fixing device 24 was positioned at the center of the unit reflectors 34 of the plurality of unit reflectors 411 to 413, 421 to 423, 431 to 433 arranged in a matrix as shown in FIG. The present invention also includes a reflector device 410 in which three holding devices 14a to 14c are positioned around the fixing device 24.

また、図6のように行列配置された複数の単位反射装置311~313、321~323、331~333の単位反射板33の長手方向の一端に固定装置23を位置させ、他端に二個の保持装置13a、13bを位置させたリフレクタ装置310も本発明に含まれる。 Further, the fixing devices 23 are located at one end in the longitudinal direction of the unit reflectors 33 of the plurality of unit reflectors 311 to 313, 321 to 323, 331 to 333 arranged in a matrix as shown in FIG. 6, and two at the other end. The reflector device 310 in which the holding devices 13a and 13b are located is also included in the present invention.

また、図5のように行列配置された複数の単位反射装置211~213、221~223、231~233の単位反射板32の長手方向の一端に固定装置22を位置させ、他端に一個の保持装置12を位置させたリフレクタ装置210も本発明に含まれる。 Further, the fixing device 22 is positioned at one end in the longitudinal direction of the unit reflector 32 of the plurality of unit reflectors 211 to 213, 221 to 223, 231 to 233 arranged in a matrix as shown in FIG. 5, and one at the other end. The reflector device 210 in which the holding device 12 is located is also included in the present invention.

これら図5~図7のリフレクタ装置210、310、410の固定装置22、23、24の構造は、図3で説明した固定装置21と同じであり、一端が単位反射板32、33、34に溶接固定されている。 The structures of the fixing devices 22, 23, and 24 of the reflector devices 210, 310, and 410 of FIGS. 5 to 7 are the same as those of the fixing device 21 described with reference to FIG. It is fixed by welding.

また、図5~図7のリフレクタ装置210、310、410の保持装置12、13a、13b、14a~14cの構造は、図4の保持装置11a~11dと同じであり、板側接続部62が単位反射板32、33、34にそれぞれ溶接固定されており、矩形形状の変形部64の面積の広い一面が固定装置22、23、24に対面するように配置されている。遊び孔46a~46dの縁と、遊び孔46a~46dに配置された第一のねじ止め装置26a~26dの胴部37の外周側面との間は所定距離離間している点も同じであり、単位反射板32~34が加熱されて熱伸びしたときに、板側接続部62は離間した距離の分だけ熱伸びによる移動ができるようにされている。 Further, the structures of the holding devices 12, 13a, 13b, 14a to 14c of the reflector devices 210, 310, 410 of FIGS. 5 to 7 are the same as those of the holding devices 11a to 11d of FIG. It is welded and fixed to the unit reflectors 32, 33, and 34, respectively, and one surface of the rectangular deformed portion 64 having a large area is arranged so as to face the fixing devices 22, 23, and 24. It is also the same that the edges of the play holes 46a to 46d and the outer peripheral side surface of the body portion 37 of the first screwing devices 26a to 26d arranged in the play holes 46a to 46d are separated by a predetermined distance. When the unit reflectors 32 to 34 are heated and thermally stretched, the plate-side connecting portion 62 is configured to be able to move by the heat elongation by the distance.

なお、保持装置を設けず、一個の固定装置だけで一枚の単位反射板を真空槽の内壁面に固定したときには、単位反射板が加熱されたときに、単位反射板の縁付近が垂れ下がり、単位反射板の縁と加熱源88とが接触して望ましくないことが確認されている。 When one unit reflector is fixed to the inner wall surface of the vacuum chamber with only one fixing device without providing a holding device, when the unit reflector is heated, the vicinity of the edge of the unit reflector hangs down. It has been confirmed that the edge of the unit reflector and the heating source 88 are in contact with each other, which is not desirable.

以上のリフレクタ装置110、210、310、410では、固定装置21~24と保持装置11a~11d、12、13a、13b、14a~14cとは、単位反射板31~34側が溶接固定され、真空槽17の取付面19側がねじ止め固定されていたが、本発明はそれに限定されるものではない。 In the reflector devices 110, 210, 310, 410 described above, the fixing devices 21 to 24 and the holding devices 11a to 11d, 12, 13a, 13b, 14a to 14c are welded and fixed on the unit reflector 31 to 34 side, and are in a vacuum chamber. The mounting surface 19 side of 17 was fixed by screwing, but the present invention is not limited thereto.

図8(a)、(b)と図9(a)、(b)とには、図3(a)、(b)の単位反射装置122とは異なる単位反射装置151、152が示されており、各単位反射装置151、152はそれぞれ行列配置され、真空槽17に取り付けられてリフレクタ装置を構成する。 8 (a) and 8 (b) and FIGS. 9 (a) and 9 (b) show unit reflectors 151 and 152 different from the unit reflector 122 of FIGS. 3 (a) and 3 (b). The unit reflectors 151 and 152 are arranged in a matrix and attached to the vacuum chamber 17 to form a reflector device.

図8(a)、図9(a)は単位反射装置151、152を真空槽17の取付面19からそれぞれ分離した状態であり、図8(b)、図9(b)は、その単位反射装置151、152を取付面19にそれぞれ取り付けた状態である。 8 (a) and 9 (a) show the unit reflection devices 151 and 152 separated from the mounting surface 19 of the vacuum chamber 17, respectively, and FIGS. 8 (b) and 9 (b) show the unit reflection. The devices 151 and 152 are mounted on the mounting surface 19, respectively.

図8(a)、(b)の単位反射装置151では、固定装置54の両端と、保持装置15a~15d(保持装置15c、15dと、下記第二の板側固定孔48c、48d、第二の槽側固定孔58c、58dとは不図示。)の両端とは、取付面19と単位反射板35とには溶接固定されていない。 In the unit reflector 151 of FIGS. 8A and 8B, both ends of the fixing device 54, holding devices 15a to 15d (holding devices 15c and 15d, and the following second plate-side fixing holes 48c and 48d, second). Both ends of the tank-side fixing holes 58c and 58d are not welded and fixed to the mounting surface 19 and the unit reflector 35.

図8(a)、(b)に用いた保持装置15a~15dは図10(a)~(e)に示されている。
図8(a)、(b)の左方の保持装置15aは断面を示しており、右方の保持装置15bは斜め側方を示している。後述の図9(a)、(b)でも同様である。
The holding devices 15a to 15d used in FIGS. 8A and 8B are shown in FIGS. 10A to 10E.
The holding device 15a on the left side of FIGS. 8A and 8B shows a cross section, and the holding device 15b on the right side shows an oblique side view. The same applies to FIGS. 9 (a) and 9 (b) described later.

この保持装置15a~15dは単位反射板35と取付面19との間に位置し、単位反射板35側の板側接続部62と、取付面19側の槽側接続部63と、一端が板側接続部62に固定され他端が槽側接続部63に固定された変形部64とを有している。
板側接続部62と単位反射板35とは溶接固定されておらず、板側接続部62には第二の保持側固定孔61が形成され、単位反射板35には第二の板側固定孔48a~48dが形成されている。
The holding devices 15a to 15d are located between the unit reflector 35 and the mounting surface 19, and have a plate-side connecting portion 62 on the unit reflecting plate 35 side, a tank-side connecting portion 63 on the mounting surface 19 side, and one end of the plate. It has a deformed portion 64 fixed to the side connecting portion 62 and the other end fixed to the tank side connecting portion 63.
The plate-side connecting portion 62 and the unit reflector 35 are not welded and fixed, a second holding-side fixing hole 61 is formed in the plate-side connecting portion 62, and a second plate-side fixing is formed in the unit reflector 35. Holes 48a to 48d are formed.

第一の槽側固定孔57と挿通孔53と第一の板側固定孔47とが連通し、第二の槽側固定孔58a~58dと第一の保持側固定孔60と遊び孔46a~46dとが連通し、第二の保持側固定孔61と第二の板側固定孔48a~48dとが連通するように、真空槽17に対して、固定装置54と保持装置15a~15dと単位反射板35とを配置し、固定ねじ止め装置27を、第一の板側固定孔47側から、第一の板側固定孔47と挿通孔53と第一の槽側固定孔57とに挿通し、また、第一のねじ止め装置26a~26d(符号c、dが付された装置は不図示。)の先端部38を、遊び孔46a~46d側から、遊び孔46a~46dと第一の保持側固定孔60と第二の槽側固定孔58a~58dとに挿入し、また、第二のねじ止め装置28a~28d(符号c、dが付された装置は不図示。)の胴部77を、第二の板側固定孔48a~48d側から第二の板側固定孔48a~48dと第二の保持側固定孔61とに挿通し、固定装置54によって単位反射板35の中央を固定装置54を介して取付面19にねじ止め固定し、槽側接続部63を第一のねじ止め装置26a~26dによって取付面19にねじ止め固定し、板側接続部62を第二のねじ止め装置28a~28dによって単位反射板35にねじ止め固定する。固定装置54と単位反射板35は、取付面19と頭部67によって挟まれ、単位反射板35は板側接続部62と頭部76によって挟まれる。 The first tank-side fixing hole 57, the insertion hole 53, and the first plate-side fixing hole 47 communicate with each other, and the second tank-side fixing hole 58a to 58d, the first holding-side fixing hole 60, and the play hole 46a to The fixing device 54 and the holding devices 15a to 15d are united with respect to the vacuum chamber 17 so that the second holding side fixing holes 61 and the second plate side fixing holes 48a to 48d communicate with each other. A reflector 35 is arranged, and the fixing screw fixing device 27 is inserted from the first plate side fixing hole 47 side into the first plate side fixing hole 47, the insertion hole 53, and the first tank side fixing hole 57. Further, the tip portions 38 of the first screwing devices 26a to 26d (devices with reference numerals c and d are not shown) are first connected to the play holes 46a to 46d from the play holes 46a to 46d side. Inserted into the holding-side fixing holes 60 and the second tank-side fixing holes 58a to 58d, and the body of the second screwing devices 28a to 28d (devices with reference numerals c and d are not shown). The portion 77 is inserted from the second plate side fixing holes 48a to 48d side into the second plate side fixing holes 48a to 48d and the second holding side fixing hole 61, and is centered on the unit reflector 35 by the fixing device 54. Is screwed and fixed to the mounting surface 19 via the fixing device 54, the tank side connecting portion 63 is screwed and fixed to the mounting surface 19 by the first screwing devices 26a to 26d, and the plate side connecting portion 62 is seconded. It is screwed and fixed to the unit reflector 35 by the screwing devices 28a to 28d. The fixing device 54 and the unit reflector 35 are sandwiched between the mounting surface 19 and the head 67, and the unit reflector 35 is sandwiched between the plate side connection portion 62 and the head 76.

図3(a)、(b)の単位反射装置122では、保持装置11a~11dの板側接続部62が単位反射板31に溶接固定され、槽側接続部63がねじ止め固定されていたが、図9(a)、(b)の単位反射装置152では、保持装置16a~16d(符号c、dが付された装置は不図示。)の板側接続部62は第二のねじ止め装置28a~28d(符号28c、28dが付された装置は不図示。)によって単位反射板36にねじ止め固定され、槽側接続部63は取付面19に溶接固定されている。固定装置55は、固定ねじ止め装置27が第一の板側固定孔47と挿通孔53と第一の槽側固定孔57とに挿通した状態で、取付面19側が取付面19に固定されている。胴部66は第一の槽側固定孔57にねじ止め固定される。第二のねじ止め装置28a~28dの胴部77を、第二の板側固定孔48a~48d(符号48c、48dが付された装置は不図示。)側から第二の板側固定孔48a~48dと第二の保持側固定孔61とに挿通し、板側接続部62を第二のねじ止め装置28a~28dによって単位反射板36にねじ止め固定する。
保持装置16a~16dは、図11(a)~(e)に示す。
In the unit reflector 122 of FIGS. 3A and 3B, the plate-side connecting portion 62 of the holding devices 11a to 11d was welded and fixed to the unit reflector 31, and the tank-side connecting portion 63 was screwed and fixed. In the unit reflector 152 of FIGS. 9 (a) and 9 (b), the plate-side connecting portion 62 of the holding devices 16a to 16d (devices with reference numerals c and d are not shown) is a second screwing device. 28a to 28d (devices with reference numerals 28c and 28d are not shown) are screwed and fixed to the unit reflector 36, and the tank side connecting portion 63 is welded and fixed to the mounting surface 19. In the fixing device 55, the mounting surface 19 side is fixed to the mounting surface 19 in a state where the fixing screw fixing device 27 is inserted into the first plate side fixing hole 47, the insertion hole 53, and the first tank side fixing hole 57. There is. The body portion 66 is screwed and fixed to the first tank side fixing hole 57. The body 77 of the second screwing devices 28a to 28d is provided with the second plate side fixing holes 48a to 48d (devices with reference numerals 48c and 48d are not shown) side to the second plate side fixing holes 48a. It is inserted through 48d and the second holding side fixing hole 61, and the plate side connecting portion 62 is screwed and fixed to the unit reflector 36 by the second screwing devices 28a to 28d.
The holding devices 16a to 16d are shown in FIGS. 11A to 11D.

この単位反射装置152に於いて、図3(a)、(b)の固定装置21と同じく固定装置55と単位反射板36とを溶接固定し、固定装置55と取付面19とをねじ止め固定してもよい。取付面19と単位反射板36とを、固定装置55を介してねじ止め固定してもよい。 In the unit reflector 152, the fixing device 55 and the unit reflector 36 are welded and fixed in the same manner as the fixing device 21 of FIGS. 3A and 3B, and the fixing device 55 and the mounting surface 19 are screwed and fixed. You may. The mounting surface 19 and the unit reflector 36 may be screwed and fixed via the fixing device 55.

なお、上記変形部64は板バネであったが、いずれの保持装置11a~11d、12、13a、13b、14a~14c、15a~15d、16a~16dについても、板バネに替え、コイルバネ等、他の形式のバネを用いるようにしてもよい。 Although the deformed portion 64 was a leaf spring, any of the holding devices 11a to 11d, 12, 13a, 13b, 14a to 14c, 15a to 15d, 16a to 16d was replaced with a leaf spring, and a coil spring or the like was used. Other types of springs may be used.

2……真空加熱装置
11a~11d、12、13a、13b、14a~14c、15a~15d、16a~16d……保持装置
17……真空槽
19……取付面
21~24、54、55……固定装置
26a~26d……第一のねじ止め装置
28a~28d……第二のねじ止め装置
31~36……単位反射板
46a~46d……遊び孔
64……変形部
87……加熱対象物
88……加熱源
110、210、310、410……リフレクタ装置
2 ... Vacuum heating devices 11a to 11d, 12, 13a, 13b, 14a to 14c, 15a to 15d, 16a to 16d ... Holding device 17 ... Vacuum tank 19 ... Mounting surfaces 21 to 24, 54, 55 ... Fixing devices 26a to 26d ... First screwing devices 28a to 28d ... Second screwing devices 31 to 36 ... Unit reflectors 46a to 46d ... Play holes 64 ... Deformation part 87 ... Object to be heated 88 …… Heating sources 110, 210, 310, 410 …… Reflector device

Claims (16)

真空排気される真空槽と、
前記真空槽の内部に配置され、赤外線を放射して加熱対象物を加熱する加熱源と、
前記真空槽の内部に配置され、前記加熱源から放射されて前記真空槽の内壁面のうちの取付面に向かう赤外線を遮蔽する複数個の単位反射板を有するリフレクタ装置と、
を有し、
前記単位反射板は前記取付面に沿って配置された真空加熱装置であって、
前記リフレクタ装置は、
一端が前記真空槽の前記取付面に固定され、他端が前記単位反射板に各々一個ずつ固定された複数個の固定装置と、
一端が前記真空槽の前記取付面に固定され、他端が前記単位反射板に各々一乃至複数個ずつ固定された複数個の保持装置と、
を有し、
前記固定装置が前記取付面に固定された場所と前記単位反射板に固定された場所との間の相対的な位置は前記固定装置によって固定され、
前記保持装置は弾性変形可能な変形部を有し、前記保持装置が前記取付面に固定された場所と、前記単位反射板に固定された場所との間の相対的な位置関係は、前記変形部の変形によって変更されるようにされた真空加熱装置。
A vacuum tank that is evacuated and
A heating source that is placed inside the vacuum chamber and radiates infrared rays to heat the object to be heated,
A reflector device arranged inside the vacuum chamber and having a plurality of unit reflectors that shield infrared rays radiated from the heating source and directed to the mounting surface of the inner wall surface of the vacuum chamber.
Have,
The unit reflector is a vacuum heating device arranged along the mounting surface.
The reflector device is
A plurality of fixing devices, one end of which is fixed to the mounting surface of the vacuum chamber and the other end of which is fixed to the unit reflector.
A plurality of holding devices in which one end is fixed to the mounting surface of the vacuum chamber and the other end is fixed to one or more of the unit reflectors.
Have,
The relative position between the place where the fixing device is fixed to the mounting surface and the place where the fixing device is fixed to the unit reflector is fixed by the fixing device.
The holding device has a deformable portion that can be elastically deformed, and the relative positional relationship between the place where the holding device is fixed to the mounting surface and the place where the holding device is fixed to the unit reflector is the deformation. A vacuum heating device that is modified by the deformation of the part.
前記単位反射板が加熱されて熱伸びする際には、前記変形部は変形されて、前記保持装置が前記取付面に固定された場所と、前記単位反射板に固定された場所との間の相対的な位置関係が変更される請求項1記載の真空加熱装置。 When the unit reflector is heated and stretched, the deformed portion is deformed between the place where the holding device is fixed to the mounting surface and the place where the holding device is fixed to the unit reflector. The vacuum heating device according to claim 1, wherein the relative positional relationship is changed. 前記変形部は板バネであり、前記単位反射板の熱伸びによって前記板バネの表面に垂直な方向の力が印加される向きに前記板バネが配置された請求項2記載の真空加熱装置。 The vacuum heating device according to claim 2, wherein the deformed portion is a leaf spring, and the leaf spring is arranged in a direction in which a force in a direction perpendicular to the surface of the leaf spring is applied due to thermal elongation of the unit reflector. 前記単位反射板には遊び孔が各々設けられ、前記保持装置は、前記遊び孔に挿通された第一のねじ止め装置によって前記取付面にねじ止め固定され、
前記遊び孔の縁と前記第一のねじ止め装置とは、前記単位反射板が前記取付面に沿って熱伸びしても、前記単位反射板が室温以上で上限温度よりも低温の温度範囲では非接触になるようにされた請求項1記載の真空加熱装置。
Each of the unit reflectors is provided with a play hole, and the holding device is screwed and fixed to the mounting surface by a first screwing device inserted through the play hole.
The edge of the play hole and the first screwing device are provided in a temperature range in which the unit reflector is at room temperature or higher and lower than the upper limit temperature even if the unit reflector is thermally stretched along the mounting surface. The vacuum heating device according to claim 1, which is designed to be non-contact.
前記固定装置と前記保持装置とは、前記単位反射板に溶接固定された請求項4記載の真空加熱装置。 The vacuum heating device according to claim 4, wherein the fixing device and the holding device are welded and fixed to the unit reflector. 前記固定装置は前記単位反射板に溶接固定され、
前記保持装置は第二のねじ止め装置によって前記単位反射板にねじ止め固定された請求項4記載の真空加熱装置。
The fixing device is welded and fixed to the unit reflector.
The vacuum heating device according to claim 4, wherein the holding device is screwed and fixed to the unit reflector by a second screwing device.
記単位反射板に各々固定された前記固定装置は、同じ前記単位反射板に固定された前記保持装置と前記保持装置の間に配置された請求項1記載の真空加熱装置。 The vacuum heating device according to claim 1, wherein the fixing device fixed to each of the unit reflectors is arranged between the holding device fixed to the same unit reflector and the holding device. 記単位反射板に各々固定された前記固定装置を中心にして、同じ前記単位反射板に固定された複数の前記保持装置が配置された請求項1記載の真空加熱装置。 The vacuum heating device according to claim 1, wherein a plurality of holding devices fixed to the same unit reflector are arranged around the fixing device fixed to the unit reflector. 真空槽の内部で前記真空槽の内壁面のうちの取付面に沿って配置され、加熱源から放射されて前記取付面に向かう赤外線を遮蔽する複数個の単位反射板と、
一端が前記真空槽の前記取付面に固定され、他端が前記単位反射板に各々一個ずつ固定される複数個の固定装置と、
一端が前記真空槽の前記取付面に固定され、他端が前記単位反射板に各々一乃至複数個ずつ固定される複数個の保持装置と、
を有し、
前記固定装置が前記取付面に固定された場所と前記単位反射板に固定された場所との間の相対的な位置は前記固定装置によって固定され、
前記保持装置は弾性変形可能な変形部を有し、
前記保持装置が前記取付面に固定された場所と、前記単位反射板に固定された場所との間の相対的な位置関係は、前記変形部の変形によって変更されるようにされたリフレクタ装置。
A plurality of unit reflectors arranged inside the vacuum chamber along the mounting surface of the inner wall surface of the vacuum chamber and shielding infrared rays radiated from the heating source toward the mounting surface.
A plurality of fixing devices, one end of which is fixed to the mounting surface of the vacuum chamber and the other end of which is fixed to the unit reflector.
A plurality of holding devices in which one end is fixed to the mounting surface of the vacuum chamber and the other end is fixed to the unit reflector by one or more.
Have,
The relative position between the place where the fixing device is fixed to the mounting surface and the place where the fixing device is fixed to the unit reflector is fixed by the fixing device.
The holding device has a deformable portion that can be elastically deformed.
A reflector device whose relative positional relationship between a place where the holding device is fixed to the mounting surface and a place where the holding device is fixed to the unit reflector is changed by deformation of the deformed portion.
前記単位反射板が加熱されて熱伸びする際には、前記変形部は変形されて、前記保持装置が前記取付面に固定された場所と、前記単位反射板に固定された場所との間の相対的な位置関係が変更される請求項9記載のリフレクタ装置。 When the unit reflector is heated and stretched, the deformed portion is deformed between the place where the holding device is fixed to the mounting surface and the place where the holding device is fixed to the unit reflector. The reflector device according to claim 9, wherein the relative positional relationship is changed. 前記変形部は板バネであり、前記単位反射板の熱伸びによって前記板バネの表面に垂直な方向の力が印加される向きに前記板バネが配置された請求項10記載のリフレクタ装置。 The reflector device according to claim 10, wherein the deformed portion is a leaf spring, and the leaf spring is arranged in a direction in which a force in a direction perpendicular to the surface of the leaf spring is applied due to thermal elongation of the unit reflector. 前記単位反射板には遊び孔が各々設けられ、前記保持装置は、前記遊び孔に挿通された第一のねじ止め装置によって前記取付面にねじ止め固定され、
前記遊び孔の縁と前記第一のねじ止め装置とは、前記単位反射板が前記取付面に沿って熱伸びしても、前記単位反射板が室温以上で上限温度よりも低温の温度範囲では非接触になるようにされた請求項9記載のリフレクタ装置。
Each of the unit reflectors is provided with a play hole, and the holding device is screwed and fixed to the mounting surface by a first screwing device inserted through the play hole.
The edge of the play hole and the first screwing device are provided in a temperature range in which the unit reflector is at room temperature or higher and lower than the upper limit temperature even if the unit reflector is thermally stretched along the mounting surface. The reflector device according to claim 9, which is designed to be non-contact.
前記固定装置と前記保持装置とは、前記単位反射板に溶接固定された請求項12記載のリフレクタ装置。 The reflector device according to claim 12, wherein the fixing device and the holding device are welded and fixed to the unit reflector. 前記固定装置は前記単位反射板に溶接固定され、
前記保持装置は第二のねじ止め装置によって前記単位反射板にねじ止め固定された請求項12記載のリフレクタ装置。
The fixing device is welded and fixed to the unit reflector.
The reflector device according to claim 12, wherein the holding device is screwed and fixed to the unit reflector by a second screwing device.
記単位反射板に各々固定された前記固定装置は、同じ前記単位反射板に固定された前記保持装置と前記保持装置の間に配置された請求項9記載のリフレクタ装置。 The reflector device according to claim 9, wherein the fixing device fixed to each of the unit reflectors is arranged between the holding device fixed to the same unit reflector and the holding device. 記単位反射板に各々固定された前記固定装置を中心にして、同じ前記単位反射板に固定された複数の前記保持装置が配置された請求項9記載のリフレクタ装置。 The reflector device according to claim 9, wherein a plurality of the holding devices fixed to the same unit reflector are arranged around the fixing device fixed to the unit reflector.
JP2020556616A 2018-11-14 2019-08-26 Vacuum heating device, reflector device Active JP7044900B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018213953 2018-11-14
JP2018213953 2018-11-14
PCT/JP2019/033320 WO2020100376A1 (en) 2018-11-14 2019-08-26 Vacuum heating device and reflector device

Publications (2)

Publication Number Publication Date
JPWO2020100376A1 JPWO2020100376A1 (en) 2021-06-10
JP7044900B2 true JP7044900B2 (en) 2022-03-30

Family

ID=70731092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020556616A Active JP7044900B2 (en) 2018-11-14 2019-08-26 Vacuum heating device, reflector device

Country Status (5)

Country Link
JP (1) JP7044900B2 (en)
KR (1) KR102476865B1 (en)
CN (1) CN112041627B (en)
TW (1) TWI749366B (en)
WO (1) WO2020100376A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017180865A (en) 2016-03-28 2017-10-05 日本碍子株式会社 Firing furnace
JP2018037482A (en) 2016-08-30 2018-03-08 東京応化工業株式会社 Substrate heating apparatus and substrate heating method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164222A (en) * 1982-03-25 1983-09-29 Matsushita Electric Ind Co Ltd Heat treatment device
JP3155844B2 (en) * 1992-10-20 2001-04-16 日本真空技術株式会社 High frequency electrode of vacuum processing equipment
JP3682340B2 (en) 1996-06-28 2005-08-10 リンナイ株式会社 Heat shield plate
US7126087B2 (en) * 2003-08-07 2006-10-24 Canon Kabushiki Kaisha Method of effecting heating and cooling in reduced pressure atmosphere
JP4769532B2 (en) * 2005-09-30 2011-09-07 パナソニック環境エンジニアリング株式会社 High temperature processing equipment
KR101895398B1 (en) 2011-04-28 2018-10-25 삼성전자 주식회사 Method of forming an oxide layer and a method of fabricating a semiconductor device comprising the same
WO2013172359A1 (en) * 2012-05-14 2013-11-21 コニカミノルタ株式会社 Gas barrier film, manufacturing method for gas barrier film, and electronic device
CN104779179A (en) * 2014-01-13 2015-07-15 马悦 Apparatus for carrying out heat treatment on semiconductor device substrates
KR102386812B1 (en) * 2014-05-16 2022-04-15 어플라이드 머티어리얼스, 인코포레이티드 Showerhead design
JP7018713B2 (en) * 2017-03-29 2022-02-14 東京応化工業株式会社 Substrate heating device, substrate processing system and substrate heating method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017180865A (en) 2016-03-28 2017-10-05 日本碍子株式会社 Firing furnace
JP2018037482A (en) 2016-08-30 2018-03-08 東京応化工業株式会社 Substrate heating apparatus and substrate heating method

Also Published As

Publication number Publication date
CN112041627A (en) 2020-12-04
CN112041627B (en) 2022-07-05
JPWO2020100376A1 (en) 2021-06-10
KR20200139792A (en) 2020-12-14
KR102476865B1 (en) 2022-12-12
WO2020100376A1 (en) 2020-05-22
TWI749366B (en) 2021-12-11
TW202018237A (en) 2020-05-16

Similar Documents

Publication Publication Date Title
JP6840138B2 (en) Wafer heating diode laser for processing
US8742287B2 (en) Lighting solution for apparatuses for vacuum insulating glass (VIG) unit tip-off, and/or associated methods
KR20170134743A (en) Substrate holding mechanism, film forming apparatus, and substrate holding method
WO2013090667A1 (en) Apparatuses for vacuum insulating glass (vig) unit tip-off, and/or associated methods
JP5003663B2 (en) Vacuum heating device
JP7044900B2 (en) Vacuum heating device, reflector device
WO2014119273A1 (en) Ultraviolet light emitting device
KR102281718B1 (en) Substrate processing apparatus and substrate processing method
JP2001210604A (en) Optically heating device
US6599585B2 (en) UV curing system for heat sensitive substances and process
JP6783571B2 (en) Radiation equipment and processing equipment using radiation equipment
JP5891255B2 (en) Heat treatment equipment
JP6890278B2 (en) Manufacturing method of glass panel unit
JP6650814B2 (en) Heating equipment
JP2007333250A (en) Far-infrared panel heater
JP4227578B2 (en) Heating method and image display device manufacturing method
KR101768642B1 (en) Apparatus for thermoforming glass and method for thermoforming the same
WO2011125394A1 (en) Vacuum processing device, substrate processing method, and low-dielectric constant film manufacturing device
JP6926437B2 (en) Heating device
JP2009231608A (en) Heat treatment equipment
JP2519187Y2 (en) Light irradiation type heat treatment equipment
KR100567663B1 (en) Heating apparatus for stripping photo resistor by far infrared ray
JPH06281166A (en) Heating device
JPH0940500A (en) Laser annealing treatment device
RU2020121367A (en) HEATING DEVICE

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20201125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210810

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211006

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20211006

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220301

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220317

R150 Certificate of patent or registration of utility model

Ref document number: 7044900

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150