TWI749366B - Vacuum heating device and reflector device - Google Patents
Vacuum heating device and reflector device Download PDFInfo
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 51
- 238000009434 installation Methods 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 description 21
- 238000003780 insertion Methods 0.000 description 9
- 230000037431 insertion Effects 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000009489 vacuum treatment Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D11/00—Arrangement of elements for electric heating in or on furnaces
- F27D11/02—Ohmic resistance heating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
- F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
- F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
- F27D2007/066—Vacuum
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Abstract
提供一種具備有不會發生起因於熱延伸所導致的損傷之反射器裝置的真空加熱裝置。將被作了行列配置之複數個的單位反射板(31),藉由固定裝置(21)和保持裝置(11a)~(11d)來分別安裝在真空槽(17)之安裝面(19)處。若是紅外線被照射至各單位反射板(31)處,則伴隨著保持裝置(11a)~(11d)之變形部(64)的變形,各單位反射板(31)係以固定裝置(21)之安裝場所作為中心而進行熱延伸。起因於熱延伸而被施加於各單位反射板(31)處的力係被紓緩,各單位反射板(31)所被安裝在安裝面(19)處的場所之損傷係被防止。Provided is a vacuum heating device equipped with a reflector device that does not cause damage due to thermal extension. Install the multiple unit reflectors (31) arranged in rows and columns on the mounting surface (19) of the vacuum tank (17) by the fixing device (21) and the holding device (11a) ~ (11d) . If infrared rays are irradiated to each unit reflector (31), along with the deformation of the deformed portion (64) of the holding device (11a) to (11d), each unit reflector (31) is fixed by the fixing device (21). The installation site serves as the center for thermal extension. The force applied to each unit reflector (31) due to thermal extension is relieved, and damage to the place where each unit reflector (31) is installed at the installation surface (19) is prevented.
Description
本發明,係有關於在真空氛圍中而以紅外線來將加熱對象物作加熱的技術,特別是有關於反射紅外線之反射器裝置、和具備有該反射器裝置之真空加熱裝置。 The present invention relates to a technique for heating an object to be heated with infrared rays in a vacuum atmosphere, and particularly relates to a reflector device that reflects infrared rays and a vacuum heating device equipped with the reflector device.
以半導體基板或玻璃基板等作為處理對象物並在真空氛圍中於處理對象物之表面上形成薄膜或者是對已被形成之薄膜在真空氛圍中進行蝕刻處理的真空處理,係被廣泛地進行,在緊接於進行真空處理之前,係設置有使處理對象物升溫至特定溫度並使真空處理的反應性提升之加熱前置處理工程。 Vacuum processing, which uses semiconductor substrates or glass substrates as processing objects and forms a thin film on the surface of the processing object in a vacuum atmosphere, or etching the formed thin film in a vacuum atmosphere, is widely performed. Immediately before the vacuum treatment, a heating pretreatment process is provided to raise the temperature of the treatment target to a specific temperature and improve the reactivity of the vacuum treatment.
又,若是在真空氛圍中加熱處理對象物,則附著在處理對象物上的有機物或水分係在真空氛圍中蒸發,處理對象物之清淨係被進行。 In addition, if the treatment target is heated in a vacuum atmosphere, the organic matter or moisture adhering to the treatment target evaporates in the vacuum atmosphere, and the purification of the treatment target is performed.
基於溫度控制性之良好的理由,此種處理對象物之加熱多係藉由紅外線照射來進行,為了將對於真空 槽之紅外線照射遮斷,在真空槽之壁面與紅外線照射裝置之間係被配置有反射器,而構成為不會使真空槽升溫。 For the reason of good temperature controllability, the heating of this kind of processing object is mostly performed by infrared radiation. The infrared radiation of the groove is blocked, and a reflector is arranged between the wall surface of the vacuum groove and the infrared irradiating device, and it is configured to not raise the temperature of the vacuum groove.
另外,為了使製造成本降低,處理對象物係日益大型化,伴隨於此,真空槽亦係大型化,但是,若是將反射器大型化,則起因於熱所導致的線膨脹量係會變大,在反射器或反射器安裝部等處產生變形或者是發生安裝不良等的問題係變得嚴重。 In addition, in order to reduce the manufacturing cost, the object to be processed has become larger and larger. Accompanying this, the vacuum chamber has also become larger. However, if the reflector is enlarged, the amount of linear expansion due to heat will increase. , The problem of deformation or poor installation in the reflector or reflector mounting part has become serious.
近年來,係嘗試開發有將複數之單位反射板作行列配置並構成一台的反射器之反射器裝置,但是,若是將單位反射板僅固定在單一場所處而構成為使其能夠並不產生變形地而作熱膨脹,則在單位反射板之邊緣附近的下垂量係會變大,在單位反射板之間係會產生熱漏洩。 In recent years, an attempt has been made to develop a reflector device in which a plurality of unit reflectors are arranged in rows and constitute one reflector. However, if the unit reflectors are fixed only in a single place, they are constructed so that they can not produce When the ground is deformed and thermally expanded, the amount of sagging near the edge of the unit reflector will increase, and heat leakage will occur between the unit reflectors.
又,若是為了防止熱漏洩而將單位反射板之邊緣附近相互重疊,則在發生熱膨脹時,邊緣附近係會彼此滑動並產生大量的塵埃。 In addition, if the edges of the unit reflectors are overlapped to prevent heat leakage, when thermal expansion occurs, the edges will slide on each other and generate a lot of dust.
[專利文獻1]日本特開平10-19386號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 10-19386
本發明,係為了解決上述先前技術之問題而創作者,其之所欲解決之課題,係在於提供一種在反射板 處不會發生變形或下垂的反射器裝置、和設置有該反射器裝置之真空加熱裝置。 The present invention was created to solve the above-mentioned problems of the prior art, and the problem to be solved is to provide a reflection plate A reflector device that does not deform or sag, and a vacuum heating device equipped with the reflector device.
本發明,係為一種真空加熱裝置,其特徵為,係具備有:真空槽,係被作真空排氣;和加熱源,係被配置在前述真空槽之內部,並輻射出紅外線而將加熱對象物加熱;和反射器裝置,係被配置在前述真空槽之內部,並具備有將從前述加熱源而被輻射並朝向前述真空槽之內壁面之中之安裝面的紅外線作遮蔽之複數個的單位反射板,前述單位反射板,係沿著前述安裝面而被作配置,前述反射器裝置,係具備有:複數個的固定裝置,係使其中一端被固定在前述真空槽之前述安裝面處,並使另外一端被固定在前述單位反射板處;和複數個的保持裝置,係使其中一端被固定在前述真空槽之前述安裝面處,並使另外一端被固定在前述單位反射板處,前述固定裝置之被固定於前述安裝面處的場所和被固定於前述單位反射板處的場所之間的相對性之位置,係藉由前述固定裝置而被固定,前述保持裝置,係具備有可變形之變形部,前述保持裝置之被固定於前述安裝面處的場所和被固定於前述單位反射板處的場所之間的相對性之位置關係,係構成為藉由前述變形部之變形而被作變更。 The present invention is a vacuum heating device, which is characterized in that it is provided with: a vacuum tank, which is used for vacuum exhaust; and a heating source, which is arranged inside the vacuum tank and radiates infrared rays to heat the object Object heating; and reflector devices are arranged inside the vacuum tank, and are equipped with a plurality of shielding infrared rays that are radiated from the heating source and directed toward the mounting surface in the inner wall surface of the vacuum tank The unit reflector, the unit reflector is arranged along the mounting surface, and the reflector device is provided with: a plurality of fixing devices, one end of which is fixed to the mounting surface of the vacuum tank , And the other end is fixed at the unit reflector; and a plurality of holding devices, one end is fixed at the installation surface of the vacuum tank, and the other end is fixed at the unit reflector, The relative position between the place where the fixing device is fixed at the mounting surface and the place at the unit reflector is fixed by the fixing device, and the holding device is provided with The deformed deformed part, the relative positional relationship between the place where the holding device is fixed to the mounting surface and the place fixed to the unit reflector is configured to be deformed by the deformed part Make changes.
又,本發明,係為一種真空加熱裝置,其係構成為:當前述單位反射板被加熱而發生熱延伸時,前述變形部係 變形,前述保持裝置之被固定於前述安裝面處之場所和被固定於前述單位反射板處之場所之間的相對性之位置關係係被作變更。 In addition, the present invention is a vacuum heating device, which is configured such that when the unit reflector is heated and thermally stretched, the deformed portion is Deformed, the relative positional relationship between the place where the holding device is fixed at the installation surface and the place where it is fixed at the unit reflector is changed.
又,本發明,係為一種真空加熱裝置,其係構成為:前述變形部係為板彈簧,前述板彈簧,係被配置在藉由前述單位反射板之熱延伸而被施加有與前述板彈簧之表面相垂直之方向的力之方向上。 In addition, the present invention is a vacuum heating device, which is configured such that the deformed portion is a leaf spring, and the leaf spring is arranged to be applied with the leaf spring by the thermal extension of the unit reflector. The direction of the force in the direction perpendicular to the surface.
又,本發明,係為一種真空加熱裝置,其係構成為:在前述單位反射板處,係被設置有餘裕孔,前述保持裝置,係藉由被插通於前述餘裕孔處之第1螺絲鎖合裝置而被螺絲鎖合固定於前述安裝面處,前述餘裕孔之邊緣和前述第1螺絲鎖合裝置,係構成為就算是前述單位反射板沿著前述安裝面而作熱延伸,在前述單位反射板為室溫以上且較上限溫度而更低溫之溫度範圍內也會成為非接觸。 In addition, the present invention is a vacuum heating device, which is configured such that the unit reflector is provided with a clearance hole, and the holding device is provided by a first screw inserted into the clearance hole. The locking device is screwed and fixed to the mounting surface. The edge of the margin hole and the first screw locking device are configured to thermally extend along the mounting surface even if the unit reflector is The unit reflector becomes non-contact in the temperature range above room temperature and lower than the upper limit temperature.
又,本發明,係為一種真空加熱裝置,其係構成為:前述固定裝置和前述保持裝置,係被熔接固定於前述單位反射板處。 In addition, the present invention is a vacuum heating device, which is configured such that the fixing device and the holding device are welded and fixed to the unit reflector.
又,本發明,係為一種真空加熱裝置,其係構成為:前述固定裝置係被熔接固定於前述單位反射板處,前述保持裝置係藉由第2螺絲鎖合裝置而被螺絲鎖合固定於前述單位反射板處。 In addition, the present invention is a vacuum heating device, which is configured such that the fixing device is welded and fixed to the unit reflector, and the holding device is screwed and fixed to the unit reflector by a second screw locking device. At the aforementioned unit reflector.
又,本發明,係為一種真空加熱裝置,其係構成為:被固定在1片的前述單位反射板處之前述固定裝置,係被配置在被固定於相同的前述單位反射板處之前述保持裝置 與前述保持裝置之間。 In addition, the present invention is a vacuum heating device, which is configured such that the fixing device fixed to one unit reflector is arranged on the holder fixed to the same unit reflector. Device Between and the aforementioned holding device.
又,本發明,係為一種真空加熱裝置,其係構成為:以被固定在1片的前述單位反射板處之前述固定裝置作為中心,而被配置有被固定於相同的前述單位反射板處之複數之前述保持裝置。 In addition, the present invention is a vacuum heating device, which is configured to be fixed to the same unit reflector with the fixing device fixed at the unit reflector as the center. The plural of the aforementioned holding devices.
又,本發明,係為一種反射器裝置,其特徵為,係具備有:複數個的單位反射板,係在真空槽之內部沿著前述真空槽之內壁面之中之安裝面而被作配置,並將從加熱源而被輻射並朝向前述安裝面的紅外線作遮蔽;和複數個的固定裝置,係使其中一端被固定在前述真空槽之前述安裝面處,並使另外一端被固定在前述單位反射板處;和複數個的保持裝置,係使其中一端被固定在前述真空槽之前述安裝面處,並使另外一端被固定在前述單位反射板處,前述固定裝置之被固定於前述安裝面處的場所和被固定於前述單位反射板處的場所之間的相對性之位置,係藉由前述固定裝置而被固定,前述保持裝置,係具備有可變形之變形部,前述保持裝置之被固定於前述安裝面處的場所和被固定於前述單位反射板處的場所之間的相對性之位置關係,係構成為藉由前述變形部之變形而被作變更。 Furthermore, the present invention is a reflector device characterized in that it is provided with: a plurality of unit reflectors, which are arranged inside the vacuum tank along the mounting surface in the inner wall surface of the vacuum tank , And shield the infrared rays radiated from the heating source toward the aforementioned mounting surface; and a plurality of fixing devices, one end of which is fixed to the aforementioned mounting surface of the aforementioned vacuum tank, and the other end is fixed to the aforementioned The unit reflector; and a plurality of holding devices, one end of which is fixed to the mounting surface of the vacuum tank, and the other end is fixed to the unit reflector, and the fixing device is fixed to the installation The relative position between the place on the surface and the place fixed on the unit reflector is fixed by the fixing device. The holding device is provided with a deformable deforming part. The relative positional relationship between the place fixed to the mounting surface and the place fixed to the unit reflector is configured to be changed by the deformation of the deforming portion.
又,本發明,係為一種反射器裝置,其係構成為:當前述單位反射板被加熱而發生熱延伸時,前述變形部係變形,前述保持裝置之被固定於前述安裝面處之場所和被固定於前述單位反射板處之場所之間的相對性之位置關係係被作變更。 In addition, the present invention is a reflector device, which is configured such that when the unit reflector is heated and thermally stretched, the deformed portion is deformed, and the holding device is fixed to the mounting surface at the location and The relative positional relationship between the places fixed to the unit reflector is changed.
又,本發明,係為一種反射器裝置,其係構成為:前述變形部係為板彈簧,前述板彈簧,係被配置在藉由前述單位反射板之熱延伸而被施加有與前述板彈簧之表面相垂直之方向的力之方向上。 In addition, the present invention is a reflector device, which is configured such that the deformed portion is a leaf spring, and the leaf spring is arranged to be applied with the leaf spring by the thermal extension of the unit reflector. The direction of the force in the direction perpendicular to the surface.
又,本發明,係為一種反射器裝置,其係構成為:在前述單位反射板處,係被設置有餘裕孔,前述保持裝置,係藉由被插通於前述餘裕孔處之第1螺絲鎖合裝置而被螺絲鎖合固定於前述安裝面處,前述餘裕孔之邊緣和前述第1螺絲鎖合裝置,係構成為就算是前述單位反射板沿著前述安裝面而作熱延伸,在前述單位反射板為室溫以上且較上限溫度而更低溫之溫度範圍內也會成為非接觸。 In addition, the present invention is a reflector device, which is configured such that the unit reflector is provided with a clearance hole, and the holding device is provided with a first screw inserted into the clearance hole. The locking device is screwed and fixed to the mounting surface. The edge of the margin hole and the first screw locking device are configured to thermally extend along the mounting surface even if the unit reflector is The unit reflector becomes non-contact in the temperature range above room temperature and lower than the upper limit temperature.
又,本發明,係為一種反射器裝置,其係構成為:前述固定裝置和前述保持裝置,係被熔接固定於前述單位反射板處。 In addition, the present invention is a reflector device, which is configured such that the fixing device and the holding device are welded and fixed to the unit reflector.
又,本發明,係為一種反射器裝置,其係構成為:前述固定裝置係被熔接固定於前述單位反射板處,前述保持裝置係藉由第2螺絲鎖合裝置而被螺絲鎖合固定於前述單位反射板處。 In addition, the present invention is a reflector device, which is configured such that the fixing device is welded and fixed to the unit reflector, and the holding device is screwed and fixed to the unit reflector by a second screw locking device. At the aforementioned unit reflector.
又,本發明,係為一種反射器裝置,其係構成為:被固定在1片的前述單位反射板處之前述固定裝置,係被配置在被固定於相同的前述單位反射板處之前述保持裝置與前述保持裝置之間。 In addition, the present invention is a reflector device, which is configured such that the fixing device fixed to one piece of the unit reflector is arranged on the holder fixed to the same unit reflector Between the device and the aforementioned holding device.
又,本發明,係為一種反射器裝置,其係構成為:以被固定在1片的前述單位反射板處之前述固定裝置作為中 心,而被配置有被固定於相同的前述單位反射板處之複數之前述保持裝置。 In addition, the present invention is a reflector device, which is configured to use the fixing device fixed to one piece of the unit reflector as the center The core is configured with a plurality of the holding devices fixed to the same unit reflector.
由於單位反射板係藉由固定裝置和保持裝置而被固定在真空槽處,因此係並不會發生起因於熱所導致的大的下垂。 Since the unit reflector is fixed at the vacuum tank by the fixing device and the holding device, the large sagging caused by heat does not occur.
由於安裝構件和單位反射板之間或者是單位反射板彼此之間係並不會滑動,因此並不會產生塵埃。 Since the mounting member and the unit reflector or the unit reflector will not slide between each other, no dust will be generated.
2:真空加熱裝置 2: Vacuum heating device
11a~11d,12,13a,13b,14a~14c,15a~15d,16a~16d:保持裝置 11a~11d,12,13a,13b,14a~14c,15a~15d,16a~16d: holding device
17:真空槽 17: Vacuum tank
19:安裝面 19: Mounting surface
21~24,54,55:固定裝置 21~24,54,55: fixed device
26a~26d:第1螺絲鎖合裝置 26a~26d: The first screw locking device
28a~28d:第2螺絲鎖合裝置 28a~28d: 2nd screw locking device
31~36:單位反射板 31~36: unit reflector
46a~46d:餘裕孔 46a~46d: surplus hole
64:變形部 64: Deformation
87:加熱對象物 87: Heating object
88:加熱源 88: heating source
110,210,310,410:反射器裝置 110,210,310,410: reflector device
[圖1]係為本發明之真空加熱裝置的其中一例。 [Figure 1] is an example of the vacuum heating device of the present invention.
[圖2]係為用以對於第1例之反射器裝置作說明之平面圖。 [Fig. 2] is a plan view for explaining the reflector device of the first example.
[圖3](a):係為組裝前之第1例之反射器裝置的單位反射裝置,(b):係為組裝後之第1例之反射器裝置的單位反射裝置。 [Figure 3] (a): is the unit reflector of the reflector device of the first example before assembly, (b): is the unit reflector of the reflector device of the first example after assembly.
[圖4]係為保持裝置之(a):平面圖,(b):左側面圖,(c):正面圖,(d):背面圖,(e):剖面圖。 [Figure 4] is the holding device (a): plan view, (b): left side view, (c): front view, (d): back view, (e): cross-sectional view.
[圖5]係為用以對於第2例之反射器裝置作說明之平面圖。 [Fig. 5] is a plan view for explaining the reflector device of the second example.
[圖6]係為用以對於第3例之反射器裝置作說明之平面圖。 [Fig. 6] is a plan view for explaining the reflector device of the third example.
[圖7]係為用以對於第4例之反射器裝置作說明之平面圖。 [Fig. 7] is a plan view for explaining the reflector device of the fourth example.
[圖8](a)、(b):係為保持裝置與固定裝置之安裝方法為相異的單位反射裝置之例。 [Figure 8] (a), (b): are examples of unit reflection devices in which the mounting methods of the holding device and the fixing device are different.
[圖9](a)、(b):係為保持裝置與固定裝置之安裝方法為相異的單位反射裝置之其他例。 [Figure 9] (a), (b): are other examples of unit reflection devices in which the mounting methods of the holding device and the fixing device are different.
[圖10]係為保持裝置之其他例之(a):平面圖,(b):左側面圖,(c):正面圖,(d):背面圖,(e):剖面圖。 [Fig. 10] is another example of the holding device (a): plan view, (b): left side view, (c): front view, (d): back view, (e): cross-sectional view.
[圖11]係為保持裝置之又一其他例之(a):平面圖,(b):左側面圖,(c):正面圖,(d):背面圖,(e):剖面圖。 [Fig. 11] is another example of the holding device (a): plan view, (b): left side view, (c): front view, (d): back view, (e): cross-sectional view.
圖1之元件符號2,係為本發明之其中一例之真空加熱裝置,並具備有真空槽17。
The
在真空槽17之內部,係被配置有加熱源88,真空槽17係具備有複數之內壁面。在身為複數之內壁面之中之其中一個內壁面的安裝面19與加熱源88之間,係被設置有反射器裝置110。在與該安裝面19相對向的其他之內壁面18與加熱源88之間,係被設置有基板配置裝置85。於此,真空槽17之內壁面中的安裝面19,係身為頂板之表面,與安裝面19平行地相對向之內壁面18,係身為底面。
Inside the
在真空槽17處,係被連接有真空排氣裝置78,若是真空排氣裝置78動作,則真空槽17之內部係被作真空排氣,並被形成有真空氛圍。
A
在基板配置裝置85處,係被設置有銷86,在銷86為上升至較基板配置裝置85之表面而更上方處的狀態下,身為加熱對象物之基板87係被搬入至真空槽17之內部,並被承載於銷86之上。圖1,係對於該狀態作展示。
The
接著,銷86係下降,基板87係被水平地配置在基板配置裝置85上,接著,加熱源88係被通電,加熱源88係升溫並輻射出紅外線。
Next, the
從加熱源88所輻射出的紅外線中之朝向基板配置裝置85所輻射的紅外線,係被照射至基板87處,基板87係被加熱。
Among the infrared rays radiated from the
從加熱源88所輻射出的紅外線中之朝向位置於與基板87相反側處的安裝面19所輻射的紅外線,係被照射至位置於加熱源88與安裝面19之間之反射器裝置110處。
Among the infrared rays radiated from the
故而,在安裝面19側處,藉由反射器裝置110,紅外線係被遮蔽,而並不會被照射至安裝面19處,真空槽17係構成為並不會升溫。
Therefore, at the side of the mounting
被照射至反射器裝置110處之紅外線,係被反射至加熱源88所位置之方向,並被照射至基板87處。
The infrared rays irradiated to the
基板87,若是在被配置於將真空槽17之內部作真空排氣所形成的真空氛圍中之狀態下而被加熱,並升
溫至特定之溫度,則對於加熱源88之通電係被停止,基板87係從真空加熱裝置2之內部而被搬送至被與真空加熱裝置2作了連接的真空處理裝置處。
The
針對反射器裝置110之構造作說明。反射器裝置110,係如同圖2中所示一般,具備有複數之單位反射裝置111~113、121~123、131~133。各單位反射裝置111~113、121~123、131~133,係具備有四角形狀之單位反射板31,各單位反射裝置111~113、121~123、131~133之單位反射板31,於此係被配置為橫方向3個且縱方向3個的3×3個之行列狀。單位反射板31係被配置為水平。
The structure of the
在各單位反射板31處,1個的固定裝置21和1乃至複數個(於此係為4個)的保持裝置11a~11d,係分別被安裝在相同之表面上。
At each
各單位反射裝置111~113、121~123、131~133之構造係為相同,在圖3(a)、(b)中,係展示有該些之單位反射裝置111~113、121~123、131~133之中之一台的單位反射裝置122之構造。
The structure of each
各單位反射裝置111~113、121~123、131~133,係藉由固定裝置21和保持裝置11a~11d,而如同後述一般地分別被安裝在真空槽17之複數之內壁面中的安裝面19處。
The
圖3(a),係對於單位反射板31被從安裝面19
而作了分離的狀態作展示,同圖之(b),係對於單位反射板31被安裝在安裝面19處的狀態作展示。
Fig. 3(a), the
固定裝置21,係具備有於中心被設置有插通孔53的筒形形狀之本體52。
The fixing
在單位反射板31之中央處,係被形成有身為貫通孔之第1板側固定孔47,固定裝置21,係以使插通孔53和第1板側固定孔47相通連的方式,而被固定在單位反射板31處。於此,固定裝置21,係在使插通孔53和第1板側固定孔47相互作了通連的狀態下,而被熔接固定在單位反射板31處。
In the center of the
各保持裝置11a~11d,係位置於單位反射板31與安裝面19之間,並具備有與單位反射板31相接觸之板側連接部62、和與安裝面19相接觸之槽側連接部63、和使其中一端被固定於板側連接部62處並使另外一端被固定在槽側連接部63處的變形部64。
Each holding
圖4(a),係為保持裝置11a~11d之平面圖,同圖之(b)係為左側面圖,同圖之(c)係為正面圖,同圖之(d)係為背面圖,同圖之(e)係為將保持裝置11a~11d以通過板側連接部62和變形部64以及槽側連接部63之平面來作了截斷的截斷剖面圖。
Figure 4(a) is a plan view of the
若是對於安裝面19和槽側連接部63與固定裝置21之間之連接作說明,則在槽側連接部63處,係被設置有第1保持側固定孔60,在單位反射板31中之與第1保持側固定孔60相對面之部分處,係被設置有餘裕孔46a~
46d(在圖3(a)、(b)中,係並未對於以元件符號46c、46d所特定之餘裕孔和以元件符號11c、11d所特定之保持裝置和下述之以元件符號26c、26d所特定之第1螺絲鎖合裝置以及下述之以元件符號58c、58d所特定之第2槽側固定孔作展示)。
If the connection between the mounting
在安裝面19處,於與插通孔53相對面之位置處,係被設置有第1槽側固定孔57,又,在與第1保持側固定孔60相對面之位置處,係分別被設置有第2槽側固定孔58a~58d。
The mounting
板側連接部62,係被熔接固定於單位反射板31處,在使第1槽側固定孔57與插通孔53相互通連並且使第2槽側固定孔58a~58d與各保持裝置11a~11d之第1保持側固定孔60分別相互通連的狀態下,使固定裝置21中之朝向安裝面19側的其中一端和各保持裝置11a~11d之槽側連接部63與安裝面19相接觸,並將固定螺絲鎖合裝置27之胴體部66插通於第1板側固定孔47與插通孔53處,再使固定螺絲鎖合裝置27旋轉而使被設置在第1槽側固定孔57之內周面上的螺紋部分與被設置在胴體部66之前端之部分之外周面處的螺紋部分相螺合,而藉由該旋轉來使胴體部66之前端朝向第1槽側固定孔57之底面前進。
The plate-
從各固定螺絲鎖合裝置27之胴體部66所突出的頭部67,係被形成為較第1板側固定孔47而更大,藉由固定螺絲鎖合裝置27之前進,頭部67之座面係分別與單位反射板31作接觸,藉由固定螺絲鎖合裝置27之旋轉,頭部
67係將單位反射板31和固定裝置21朝向安裝面19而作推壓。
The
另一方面,第1螺絲鎖合裝置26a~26d之胴體部37,係從被設置在胴體部37之前端處的前端部38起而被插通於餘裕孔46a~46d中,前端部38係分別被插入至各保持裝置11a~11d之第1保持側固定孔60和第2槽側固定孔58a~58d中。元件符號39係為頭部,其與單位反射板31係為非接觸。
On the other hand, the
餘裕孔46a~46d,係被形成為較第1螺絲鎖合裝置26a~26d之胴體部37而更大,餘裕孔46a~46d之邊緣和被插通於餘裕孔46a~46d中之胴體部37的外周側面之間,係構成為在常溫(於此,係將20℃±15℃之溫度範圍設為常溫)或室溫(於此係為300K)之下會相互分離特定距離,並且構成為當反射器裝置110為較特定之上限溫度而更低溫的情況時亦會相互分離。上限溫度,例如係為600℃。
The margin holes 46a~46d are formed to be larger than the
在第2槽側固定孔58a~58d之內周面與前端部38之外周面處,係分別被形成有螺紋,前端部38係被插通於第1保持側固定孔60和第2槽側固定孔58a~58d中,若是第1螺絲鎖合裝置26a~26d被旋轉,則前端部38和第2槽側固定孔58a~58d係螺合,同時,前端部38係朝向第2槽側固定孔58a~58d之底面而前進。
The inner peripheral surface of the second groove
於此,胴體部37之直徑係被形成為較第1保持側固定孔60之直徑和前端部38之直徑而更大,前端部38
係朝向第2槽側固定孔58a~58d之底面而前進,胴體部37中之前端部38側之端部係與槽側連接部63相抵接,若是前端部38更進一步前進,則槽側連接部63係藉由胴體部37之端部而被推壓於真空槽17之安裝面19處。
Here, the diameter of the
故而,單位反射板31,其之被設置有固定裝置21之部分係藉由固定螺絲鎖合裝置27而被固定在安裝面19處,其之被設置有保持裝置11a~11d之部分,則係藉由第1螺絲鎖合裝置26a~26d而被固定在安裝面19處。其結果,固定裝置21之被固定於安裝面19處的場所、和固定裝置21之被固定於單位反射板31處之場所,此兩者間之相對性之位置,係藉由固定裝置21而被作固定。
Therefore, the part of the
真空槽17之內部係藉由真空排氣裝置78而被作真空排氣,並被設為真空氛圍,在一面被作真空排氣一面將基板87配置在基板配置裝置85上之後,若是對於加熱源88通電而使其發熱並輻射出紅外線,則被輻射出的紅外線係被照射至基板87和反射器裝置110之單位反射板31處,基板87和單位反射板31係被加熱。
The inside of the
固定裝置21,係位置於各單位反射板31之中央處,被固定在1片的單位反射板31處之保持裝置11a~11d,係被配置在以被固定於相同的單位反射板31處之固定裝置21作為中心的圓周上。
The fixing
各保持裝置11a~11d之變形部64,係身為平
板形形狀,各變形部64之面積為大之面,係被朝向固定裝置21。
The
在單位反射板31處,係被照射有紅外線,在真空槽17之安裝面19處,由於紅外線之照射係被遮蔽,因此就算是輻射有紅外線,真空槽17之內壁面之升溫亦為小,但是,單位反射板31之溫度係相較於真空槽17之安裝面19之溫度而作更大的升溫。
The
故而,真空槽17之安裝面19係並不會發生熱延伸(亦稱作膨脹),相對於此,單位反射板31係會發生熱延伸。於此情況,被安裝有固定裝置21之部分由於係被固定在安裝面19處,因此,單位反射板31,係想要朝向以固定裝置21所被作固定的部分作為中心的輻射方向而進行熱延伸。
Therefore, the mounting
各保持裝置11a~11d之槽側連接部63,由於係藉由第1螺絲鎖合裝置26a~26d而被固定在安裝面19處,因此係並不會移動,但是,板側連接部62側,係會與單位反射板31之熱延伸一同地而移動。因此,在變形部64處,係從板側連接部62而被施加有朝向輻射方向之力。
The groove-
保持裝置11a~11d(以及後述之保持裝置12、13a、13b、14a~14c、15a~15d、16a~16d),係以使被施加於變形部64處之力會相對於矩形形狀之變形部64之面積為大之面而成為垂直的方式,而被作配置,伴隨著變形部64之變形,在1個的保持裝置11a~11d(以及後述之保持裝置12、13a、13b、14a~14c、15a~15d、16a~16d)之
中,板側連接部62係想要相對於槽側連接部63而作移動。
The holding
此時,由於在餘裕孔46a~46d之邊緣與第1螺絲鎖合裝置26a~26d之胴體部37的外周側面之間,係被形成有間隙,並被設為非接觸之狀態,因此,在單位反射板31被加熱並伴隨著變形部64之變形而進行熱延伸時,若是單位反射板31之溫度係為特定溫度以下,則餘裕孔46a~46d之邊緣和胴體部37之外周側面係並不會相互接觸而成為維持於非接觸之狀態。
At this time, a gap is formed between the edges of the
故而,各保持裝置11a~11d之板側連接部62,起因於單位反射板31之熱延伸,保持裝置11a~11d之被固定於安裝面19處的場所和被固定於單位反射板31處之場所之間之相對性之位置關係,係藉由變形部64之變形而被作變更,其結果,係以固定裝置21之被固定於單位反射板31處的部分作為中心,而朝向輻射方向移動。
Therefore, the plate-
如此這般,伴隨著變形部64之變形,在1個的保持裝置11a~11d之中,起因於被固定在單位反射板31處的板側連接部62之相對於被固定在安裝面19處之槽側連接部63而相對性地移動一事,由於被施加在板側連接部62與槽側連接部63處的力係被紓緩,因此保持裝置11a~11d係並不會被破壞。
In this way, along with the deformation of the deforming
當被加熱的單位反射板31之溫度作了降低時,進行了熱延伸的單位反射板31係收縮,變形部64之變形係恢復至原本之形狀,在各保持裝置11a~11d之1片的單位反射板31之中,板側連接部62係相對於槽側連接部63
而朝向單位反射板31之中心方向移動,板側連接部62與槽側連接部63之間之相對性的位置關係係恢復至加熱前之狀態。
When the temperature of the
另外,相鄰接之單位反射板31之側面與單位反射板31之側面,係亦可構成為在常溫下係預先使其分離,並藉由熱延伸而相互接近。
In addition, the side surface of the adjacent
若是基板87被加熱至特定溫度,則基板87係從真空槽17而被移動至其他之真空處理裝置的處理室處。
If the
在以上所作了說明的反射器裝置110中,雖係構成為將固定裝置21熔接固定於1片的單位反射板31之中心處,並在位置於該單位反射板31之中央處的固定裝置21之周圍之位置處配置有4個的保持裝置11a~11d,但是,如同圖7中所示一般之使固定裝置24位置在被作了行列配置的複數之單位反射裝置411~413、421~423、431~433之單位反射板34之中央處並在該固定裝置24之周圍配置有3個的保持裝置14a~14c之反射器裝置410,係亦被包含於本發明中。
In the
又,如同圖6中所示一般之使固定裝置23位置在被作了行列配置的複數之單位反射裝置311~313、321~323、331~333之單位反射板33的長邊方向之其中一端處並在另外一端處配置有2個的保持裝置13a、13b之反射器裝置310,係亦被包含於本發明中。
In addition, as shown in FIG. 6, the fixing
又,如同圖5中所示一般之使固定裝置22位置在被作了行列配置的複數之單位反射裝置211~213、
221~223、231~233之單位反射板32的長邊方向之其中一端處並在另外一端處配置有1個的保持裝置12之反射器裝置210,係亦被包含於本發明中。
In addition, as shown in FIG. 5, the fixing
此些之圖5~圖7之反射器裝置210、310、410的固定裝置22、23、24之構造,係與在圖3中所作了說明的固定裝置21相同,而使其中一端被熔接固定於單位反射板32、33、34處。
The structures of the fixing
又,圖5~圖7之反射器裝置210、310、410的保持裝置12、13a、13b、14a~14c之構造,係與圖4之保持裝置11a~11d相同,而以使板側連接部62分別被熔接固定於單位反射板32、33、34處並且使矩形形狀之變形部64的面積為廣之一面與固定裝置22、23、24相對面的方式來作配置。關於在餘裕孔46a~46d之邊緣與被配置於餘裕孔46a~46d處之第1螺絲鎖合裝置26a~26d之胴體部37的外周側面之間為分離有特定距離一事,亦為相同,而構成為在單位反射板32~34被加熱並作了熱延伸時,板側連接部62能夠進行與所分離了的距離相應之量的起因於熱延伸所導致之移動。
In addition, the structure of the holding
另外,係確認到了:當並不設置保持裝置而僅藉由1個的固定裝置來將1片的單位反射板固定於真空槽之內壁面處時,當單位反射板被作了加熱時,單位反射板之邊緣附近係會下垂,單位反射板之邊緣與加熱源88會相互接觸,而並不理想。
In addition, it has been confirmed that when the unit reflector is fixed to the inner wall surface of the vacuum tank by only one fixing device without a holding device, when the unit reflector is heated, the unit The vicinity of the edge of the reflector will sag, and the edge of the unit reflector and the
在以上的反射器裝置110、210、310、410
中,固定裝置21~24和保持裝置11a~11d、12、13a、13b、14a~14c,雖係構成為使單位反射板31~34側被作熔接固定並使真空槽17之安裝面19側被作螺絲鎖合固定,但是,本發明係並不被限定於此。
In the
在圖8(a)、(b)和圖9(a)、(b)中,係展示有與圖3(a)、(b)之單位反射裝置122相異的單位反射裝置151、152,各單位反射裝置151、152係分別被作行列配置,並被安裝於真空槽17處,而構成反射器裝置。
In Figs. 8(a), (b) and Figs. 9(a), (b), there are shown
圖8(a)、圖9(a),係為使單位反射裝置151、152分別從真空槽17之安裝面19而作了分離的狀態,圖8(b)、圖9(b),係身為使其之單位反射裝置151、152分別被安裝於安裝面19處之狀態。
Figures 8(a) and 9(a) are in a state where the
在圖8(a)、(b)之單位反射裝置151中,固定裝置54之兩端和保持裝置15a~15d(保持裝置15c、15d和下述第2板側固定孔48c、48d、第2槽側固定孔58c、58d係並未圖示)之兩端,係並未被熔接固定於安裝面19和單位反射板35處。
In the
在圖8(a)、(b)中所使用的保持裝置15a~15d,係被展示於圖10(a)~(e)中。
The holding
圖7(a)、(b)之左方的保持裝置15a,係以剖面作展示,右方之保持裝置15b,係以斜側方作展示。在後述之圖9(a)、(b)中,亦為相同。
The holding
此保持裝置15a~15d,係位置於單位反射板35與安裝面19之間,並具備有單位反射板35側之板側連接
部62、和安裝面19側之槽側連接部63、和使其中一端被固定於板側連接部62處並使另外一端被固定在槽側連接部63處的變形部64。
The holding
板側連接部62和單位反射板35,係並未被作熔接固定,在板側連接部62處,係被形成有第2保持側固定孔61,在單位反射板35處,係被形成有第2板側固定孔48a~48d。
The board-
以使第1槽側固定孔57和插通孔53以及第1板側固定孔47相互通連、第2槽側固定孔58a~58d和第1保持側固定孔60以及餘裕孔46a~46d相互通連、第2保持側固定孔61和第2板側固定孔48a~48d相互通連的方式,來對於真空槽17,而配置固定裝置54和保持裝置15a~15d以及單位反射板35,並將固定螺絲鎖合裝置27從第1板側固定孔47側起來插通於第1板側固定孔47和插通孔53以及第1槽側固定孔57中,又,係將第1螺絲鎖合裝置26a~26d(被附加有元件符號c、d之裝置係並未圖示)之前端部38,從餘裕孔46a~46d側起而插入至餘裕孔46a~46d和第1保持側固定孔60以及第2槽側固定孔58a~58d中,又,係將第2螺絲鎖合裝置28a~28d(被附加有元件符號c、d之裝置係並未圖示)之胴體部77,從第2板側固定孔48a~48d側起而插通於第2板側固定孔48a~48d和第2保持側固定孔61中,藉由固定裝置54,來將單位反射板35之中央隔著固定裝置54而螺絲鎖合固定於安裝面19處,將槽側連接部63藉由第1螺絲鎖合裝置26a~26d來螺絲鎖合固定於安裝面19處,將
板側連接部62藉由第2螺絲鎖合固定裝置28a~28d來螺絲鎖合固定於單位反射板35處。固定裝置54和單位反射板35,係藉由安裝面19和頭部67而被作包夾,單位反射板35係藉由板側連接部62和頭部76而被作包夾。
The first groove
在圖3(a)、(b)之單位反射裝置122中,保持裝置11a~11d之板側連接部62係被熔接固定於單位反射板31處,槽側連接部63係被作螺絲鎖合固定,但是,在圖9(a)、(b)之單位反射裝置152中,保持裝置16a~16d(被附加有元件符號c、d之裝置係並未圖示)之板側連接部62係藉由第2螺絲鎖合裝置28a~28d(被附加有元件符號28c、28d之裝置係並未圖示)而被螺絲鎖合固定於單位反射板36處,槽側連接部63係被熔接固定於安裝面19處。固定裝置55,係在使固定螺絲鎖合裝置27被插通於第1板側固定孔47和插通孔53以及第1槽側固定孔57中的狀態下,使安裝面19側被固定於安裝面19處。胴體部66,係藉由第1槽側固定孔57而被作螺絲鎖合固定。將第2螺絲鎖合裝置28a~28d之胴體部77,從第2板側固定孔48a~48d(被附加有元件符號48c、48d之裝置係並未圖示)側起而插通於第2板側固定孔48a~48d和第2保持側固定孔61中,並將板側連接部62藉由第2螺絲鎖合裝置28a~28d來螺絲鎖合固定於單位反射板36處。
In the
保持裝置16a~16d,係被展示於圖11(a)~(e)中。
The holding
在此單位反射裝置152中,係亦可與圖3(a)、(b)之固定裝置21相同的,將固定裝置55與單位反射板36
作熔接固定,並將固定裝置55和安裝面19作螺絲鎖合固定。係亦可將安裝面19和單位反射板36經由固定裝置55來作螺絲鎖合固定。
In this
另外,上述變形部64,雖係身為板彈簧,但是,不論是針對保持裝置11a~11d、12、13a、13b、14a~14c、15a~15d、16a~16d之何者,均可替代板彈簧而使用線圈彈簧等之其他形式之彈簧。
In addition, although the aforementioned deforming
11a,11b:保持裝置 11a, 11b: holding device
17:真空槽 17: Vacuum tank
19:安裝面 19: Mounting surface
21:固定裝置 21: Fixing device
26a,26b:第1螺絲鎖合裝置 26a, 26b: The first screw locking device
27:固定螺絲鎖合裝置 27: Fixed screw locking device
31:單位反射板 31: Unit reflector
37:胴體部 37: Carcass
38:前端部 38: Front end
39:頭部 39: head
46a,46b:餘裕孔 46a, 46b: excess hole
47:第1板側固定孔 47: 1st plate side fixing hole
52:本體 52: body
53:插通孔 53: Through hole
57:第1槽側固定孔 57: 1st slot side fixing hole
58a,58b:第2槽側固定孔 58a, 58b: 2nd groove side fixing hole
62:板側連接部 62: Board side connection part
63:槽側連接部 63: Groove side connection part
64:變形部 64: Deformation
66:胴體部 66: Carcass
67:頭部 67: head
122:單位反射裝置 122: unit reflection device
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JPS58164222A (en) * | 1982-03-25 | 1983-09-29 | Matsushita Electric Ind Co Ltd | Heat treatment device |
JPH06128750A (en) * | 1992-10-20 | 1994-05-10 | Ulvac Japan Ltd | High frequency induction electrode in vacuum treating device |
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