CN112041627A - Vacuum heating device and reflector device - Google Patents
Vacuum heating device and reflector device Download PDFInfo
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- CN112041627A CN112041627A CN201980029651.4A CN201980029651A CN112041627A CN 112041627 A CN112041627 A CN 112041627A CN 201980029651 A CN201980029651 A CN 201980029651A CN 112041627 A CN112041627 A CN 112041627A
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 44
- 238000009434 installation Methods 0.000 claims abstract description 12
- 238000002360 preparation method Methods 0.000 claims 1
- 239000011159 matrix material Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 21
- 238000003780 insertion Methods 0.000 description 9
- 230000037431 insertion Effects 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 8
- 238000003466 welding Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000007665 sagging Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D11/00—Arrangement of elements for electric heating in or on furnaces
- F27D11/02—Ohmic resistance heating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
- F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
- F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
- F27D2007/066—Vacuum
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- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Control Of Resistance Heating (AREA)
- Furnace Details (AREA)
Abstract
Provided is a vacuum heating device having a reflector device which is not damaged by thermal elongation. A plurality of unit reflecting plates (31) arranged in a matrix are attached to an attachment surface (19) of a vacuum chamber (17) by a fixing device (21) and holding devices (11 a to 11 d). When infrared rays are irradiated to each unit reflection plate (31), each unit reflection plate (31) thermally expands around the installation location of the fixing device (21) as the deformation portion (64) of the holding devices (11 a-11 d) deforms. By thermal expansion, the force applied to each unit reflecting plate (31) is alleviated, and damage to the portion of each unit reflecting plate (31) attached to the attachment surface (19) is prevented.
Description
Technical Field
The present invention relates to a technique for heating an object to be heated by infrared rays in a vacuum environment, and more particularly to a reflector device for reflecting infrared rays and a vacuum heating apparatus having the reflector device.
Background
Vacuum processing is widely performed in which a semiconductor substrate, a glass substrate, or the like is used as a processing object, a thin film is formed on a surface of the processing object in a vacuum atmosphere, or the formed thin film is etched in a vacuum atmosphere, and immediately before the vacuum processing, a heat pretreatment step is provided in which the processing object is heated to a predetermined temperature to improve the reactivity of the vacuum processing.
Further, if the object to be processed is heated in the vacuum environment, organic substances and moisture adhering to the object to be processed are evaporated in the vacuum environment, and the object to be processed is cleaned.
Since the temperature controllability is good, heating of the processing object is often performed by infrared irradiation, and a reflector is disposed between the wall surface of the vacuum chamber and the infrared irradiation device so as not to increase the temperature of the vacuum chamber in order to block infrared irradiation to the vacuum chamber.
However, in order to reduce the manufacturing cost, the size of the object to be processed is increased, and the size of the vacuum tank is increased, but if the size of the reflector is increased, the linear expansion amount from the hot zone is increased, and the defects such as deformation or poor installation of the reflector or the reflector installation part are increased.
In recent years, there has been an attempt to develop a reflector apparatus in which a plurality of unit reflecting plates are arranged in a row and constitute one reflector, but if the unit reflecting plates are fixed at only one location and are configured so as to be thermally expandable without being deformed, the amount of sagging in the vicinity of the edges of the unit reflecting plates becomes large, and heat leakage occurs between the unit reflecting plates.
Further, if the vicinities of the edges of the unit reflection plates are overlapped in order to prevent heat leakage, the vicinities of the edges sagging upon thermal expansion slide each other, and dust is generated in a large amount.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 10-19386.
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made to solve the above-described problems of the conventional art, and an object of the present invention is to provide a reflector device in which a reflector plate is not deformed or sagged, and a vacuum heating device provided with the reflector device.
Means for solving the problems
The present invention is a vacuum heating apparatus, comprising: a vacuum tank which is evacuated; a heating source which is disposed inside the vacuum chamber and radiates infrared rays to heat a heating object; and a reflector device which is arranged in the vacuum tank and has a plurality of unit reflecting plates for shielding infrared rays emitted from the heating source and directed to the mounting surface on the inner wall surface of the vacuum tank; the unit reflecting plate is arranged along the installation surface, and the reflector device includes: a plurality of fixing devices, one end of which is fixed on the installation surface of the vacuum tank, and the other end of which is fixed on the unit reflecting plate; and a plurality of holding devices, one end of which is fixed on the installation surface of the vacuum tank, and the other end of which is fixed on the unit reflecting plate; the relative position between the location where the fixing device is fixed to the mounting surface and the location where the fixing device is fixed to the unit reflecting plate is fixed by the fixing device, and the holding device has a deformable portion that can be deformed, and the relative positional relationship between the location where the holding device is fixed to the mounting surface and the location where the holding device is fixed to the unit reflecting plate is changed by the deformation of the deformable portion.
Further, the present invention is a vacuum heating apparatus in which when the unit reflecting plate is heated and thermally elongated, the deformation portion is deformed, and a relative positional relationship between a position where the holding device is fixed to the mounting surface and a position where the holding device is fixed to the unit reflecting plate is changed.
In the vacuum heating apparatus of the present invention, the deformation portion is a plate spring disposed in a direction in which a force in a direction perpendicular to a surface of the plate spring is applied by thermal expansion of the unit reflecting plate.
In the vacuum heating apparatus of the present invention, the unit reflecting plate is provided with a clearance hole, the holding means is screwed and fixed to the mounting surface by a first screw stopper inserted into the clearance hole, and an edge of the clearance hole and the first screw stopper are configured so as to be in non-contact with each other in a temperature range in which the unit reflecting plate is at room temperature or higher and lower than an upper limit temperature even when the unit reflecting plate is thermally extended along the mounting surface.
Further, the present invention is the vacuum heating apparatus, wherein the fixing means and the holding means are welded and fixed to the unit reflecting plate.
The present invention is the vacuum heating apparatus, wherein the fixing means is welded and fixed to the unit reflecting plate, and the holding means is screw-fixed to the unit reflecting plate by a second screw-fixing means.
In addition, the present invention is a vacuum heating apparatus, wherein the fixing means fixed to one unit reflecting plate is disposed between the holding means fixed to the same unit reflecting plate and the holding means.
The present invention is a vacuum heating apparatus in which a plurality of holding devices fixed to the same unit reflecting plate are arranged centering on the fixing device fixed to one unit reflecting plate.
Further, the present invention is a reflector device having: a plurality of unit reflecting plates which are arranged along a mounting surface on an inner wall surface of the vacuum chamber in the vacuum chamber and which shield infrared rays emitted from a heating source and directed toward the mounting surface; a plurality of fixing devices, one end of which is fixed on the installation surface of the vacuum tank, and the other end of which is fixed on the unit reflecting plate; and a plurality of holding devices, one end of which is fixed on the installation surface of the vacuum tank, and the other end of which is fixed on the unit reflecting plate; the relative position between the location where the fixing device is fixed to the mounting surface and the location where the fixing device is fixed to the unit reflecting plate is fixed by the fixing device, and the holding device has a deformable portion that can be deformed, and the relative positional relationship between the location where the holding device is fixed to the mounting surface and the location where the holding device is fixed to the unit reflecting plate is changed by the deformation of the deformable portion.
Further, the present invention is a reflector device in which when the unit reflecting plate is heated and thermally elongated, the deformation portion is deformed, and a relative positional relationship between a position where the holding device is fixed to the mounting surface and a position where the holding device is fixed to the unit reflecting plate is changed.
The present invention is the reflector device, wherein the deformation portion is a plate spring disposed in a direction in which a force in a direction perpendicular to a surface of the plate spring is applied by thermal expansion of the unit reflecting plate.
The present invention is a reflector device, wherein the unit reflecting plate is provided with a clearance hole, the holding device is screwed and fixed to the mounting surface by a first screw stopper inserted into the clearance hole, and an edge of the clearance hole and the first screw stopper are configured to be in non-contact in a temperature range in which the unit reflecting plate is at room temperature or higher and lower than an upper limit temperature even when the unit reflecting plate is thermally extended along the mounting surface.
Further, the present invention is a reflector device, wherein the fixing means and the holding means are welded and fixed to the unit reflecting plates.
The present invention is the reflector device, wherein the fixing means is welded and fixed to the unit reflecting plate, and the holding means is screw-fixed to the unit reflecting plate by a second screw-fixing means.
The present invention is a reflector device, wherein the fixing means fixed to one unit reflecting plate is disposed between the holding means fixed to the same unit reflecting plate and the holding means.
The present invention is a reflector device in which a plurality of holding devices fixed to the same unit reflecting plate are arranged centering on the fixing device fixed to one unit reflecting plate.
Effects of the invention
Since the unit reflection plate is fixed to the vacuum chamber by the fixing means and the holding means, large sagging due to heat does not occur.
Since the mounting member and the unit reflection plates do not slide with each other, dust is not generated.
Drawings
Fig. 1 shows an example of a vacuum heating apparatus according to the present invention.
Fig. 2 is a plan view illustrating a reflector device according to a first example.
Fig. 3 (a): unit reflecting device of the reflector device of the first example before assembly, fig. 3 (b): the assembled unit reflecting device of the reflector device of the first example.
Fig. 4 is (a) of the holding device: top view, (b): left side view, (c): front view, (d): rear view, (e): a cross-sectional view.
Fig. 5 is a plan view for explaining a reflector device of the second example.
Fig. 6 is a plan view for explaining a reflector device of the third example.
Fig. 7 is a plan view for explaining a reflector device of the fourth example.
Fig. 8 (a) and 8 (b): examples of the unit reflecting device in which the holding device and the fixing device are mounted in different methods.
Fig. 9 (a) and 9 (b): another example of the unit reflecting device in which the holding device and the fixing device are mounted in different methods.
Fig. 10 shows another example of the holding device (a): top view, (b): left side view, (c): front view, (d): rear view, (e): a cross-sectional view.
Fig. 11 shows still another example of the holding device (a): top view, (b): left side view, (c): front view, (d): rear view, (e): a cross-sectional view.
Detailed Description
< vacuum heating apparatus >
A heat source 88 is disposed inside the vacuum chamber 17, and the vacuum chamber 17 has a plurality of inner wall surfaces. A reflector device 110 is provided between the mounting surface 19, which is one of the inner wall surfaces, and the heating source 88. A substrate placement device 85 is provided between the other inner wall surface 18 facing the mounting surface 19 and the heat source 88. Here, the mounting surface 19 of the inner wall surface of the vacuum chamber 17 is a ceiling surface, and the inner wall surface 18 facing the mounting surface 19 in parallel is a bottom surface.
A vacuum exhaust device 78 is connected to the vacuum chamber 17, and if the vacuum exhaust device 78 is operated, the inside of the vacuum chamber 17 is evacuated to form a vacuum atmosphere.
The substrate placement device 85 is provided with pins 86, and a substrate 87 as a heating target is carried into the vacuum chamber 17 and placed on the pins 86 in a state where the pins 86 are raised above the surface of the substrate placement device 85. Fig. 1 shows this state.
Next, the pins 86 are lowered, the substrate 87 is horizontally arranged on the substrate arranging apparatus 85, and then the heat source 88 is energized to raise the temperature of the heat source 88 and emit infrared rays.
Of the infrared rays emitted from the heat source 88, the infrared rays emitted toward the substrate placement device 85 are irradiated onto the substrate 87, and the substrate 87 is heated.
Of the infrared rays emitted from the heat source 88, infrared rays emitted toward the mounting surface 19 located on the opposite side of the substrate 87 are irradiated to the reflector device 110 located between the heat source 88 and the mounting surface 19.
Therefore, the reflector device 110 shields infrared rays from the mounting surface 19, and prevents the vacuum chamber 17 from being heated.
The infrared rays irradiated to the reflector device 110 are reflected in a direction in which the heat source 88 is located, and are irradiated to the substrate 87.
When the substrate 87 is heated and the temperature thereof is raised to a predetermined temperature while being placed in a vacuum environment formed by evacuating the inside of the vacuum chamber 17, the energization of the heat source 88 is stopped, and the substrate 87 is transported from the inside of the vacuum heating apparatus 2 to the vacuum processing apparatus connected to the vacuum heating apparatus 2.
< Reflector apparatus >
The construction of the reflector device 110 is explained. As shown in FIG. 2, the reflector device 110 has a plurality of unit reflection devices 111 to 113, 121 to 123, 131 to 133. Each of the unit reflectors 111 to 113, 121 to 123, 131 to 133 has a rectangular unit reflector 31, and the unit reflectors 31 of each of the unit reflectors 111 to 113, 121 to 123, 131 to 133 are arranged in 3 × 3 rows and columns of 3 in the horizontal direction and 3 in the vertical direction. The unit reflection plates 31 are horizontally arranged.
In each unit reflection plate 31, one fixing device 21 and one to a plurality (here, 4) of holding devices 11a to 11d are respectively mounted on the same surface.
The structures of the unit reflectors 111 to 113, 121 to 123, and 131 to 133 are the same, and fig. 3 (a) and 3 (b) show the structure of one unit reflector 122 of the unit reflectors 111 to 113, 121 to 123, and 131 to 133.
The unit reflection devices 111 to 113, 121 to 123, and 131 to 133 are attached to the attachment surface 19 of the inner wall surfaces of the vacuum chamber 17 by the fixing device 21 and the holding devices 11a to 11d, respectively, as will be described later.
Fig. 3 (a) shows a state where the unit reflection plate 31 is separated from the mounting surface 19, and fig. 3 (b) shows a state where the unit reflection plate 31 is mounted on the mounting surface 19.
The fixture 21 has a cylindrical shaped body 52 provided with an insertion hole 53 at the center.
A first plate-side fixing hole 47 as a through hole is formed in the center of the unit reflection plate 31, and the fixing device 21 is fixed to the unit reflection plate 31 so that the insertion hole 53 communicates with the first plate-side fixing hole 47. Here, the fixing device 21 is fixed by welding to the unit reflection plate 31 in a state where the insertion hole 53 and the first plate-side fixing hole 47 are communicated.
Each of the holding devices 11a to 11d is positioned between the unit reflection plate 31 and the mounting surface 19, and includes a plate-side connecting portion 62 that contacts the unit reflection plate 31, a groove-side connecting portion 63 that contacts the mounting surface 19, and a deformation portion 64 having one end fixed to the plate-side connecting portion 62 and the other end fixed to the groove-side connecting portion 63.
Fig. 4 (a) is a plan view of the holding devices 11a to 11d, fig. 4 (b) is a left side view, fig. 4 (c) is a front view, fig. 4 (d) is a rear view, and fig. 4 (e) is a cross-sectional view of the holding devices 11a to 11d cut by a plane passing through the plate-side connecting portion 62, the deformed portion 64, and the groove-side connecting portion 63.
In the description of the connection of the mounting surface 19 to the groove-side connecting portion 63 and the fixing device 21, the groove-side connecting portion 63 is provided with the first holding-side fixing hole 60, and the unit reflection plate 31 is provided with the clearance holes 46a to 46d at the portion facing the first holding-side fixing hole 60 (in fig. 3 (a) and 3 (b), the clearance holes defined by the reference numerals 46c and 46d, the holding devices defined by the reference numerals 11c and 11d, the first screw stoppers defined by the reference numerals 26c and 26d described below, and the second groove-side fixing hole defined by the reference numerals 58c and 58d described below are not shown).
The mounting surface 19 is provided with first groove-side fixing holes 57 at positions facing the insertion holes 53, and second groove-side fixing holes 58a to 58d at positions facing the first holding-side fixing holes 60.
The plate-side connecting portion 62 is welded and fixed to the unit reflection plate 31, and in a state where the first groove-side fixing hole 57 and the insertion hole 53 are communicated and the second groove-side fixing holes 58a to 58d and the first holding-side fixing holes 60 of the holding devices 11a to 11d are communicated, the end of the fixing device 21 facing the mounting surface 19 side and the groove-side connecting portion 63 of the holding devices 11a to 11d are brought into contact with the mounting surface 19, the body portion 66 of the fixing screw stopper 27 is inserted into the first plate-side fixing hole 47 and the insertion hole 53, the fixing screw stopper 27 is rotated, the screw portion provided on the inner peripheral surface of the first groove-side fixing hole 57 and the screw portion provided on the outer peripheral surface of the portion of the front end of the body portion 66 are screwed, and the front end of the body portion 66 is caused to travel toward the bottom surface of the first groove-side fixing hole 57 by the rotation.
The head portion 67 of each fixing screw stopper 27 extending from the body portion 66 is formed larger than the first plate-side fixing hole 47, and the seat surface of the head portion 67 contacts the unit reflection plate 31 by the travel of the fixing screw stopper 27, and the head portion 67 presses the unit reflection plate 31 and the fixing device 21 toward the mounting surface 19 by the rotation of the fixing screw stopper 27.
On the other hand, the body portion 37 of the first screw stopper 26a to 26d is inserted through the free holes 46a to 46d from the distal end portion 38 provided at the distal end of the body portion 37, and the distal end portion 38 is inserted through the first holding-side fixing hole 60 and the second groove-side fixing holes 58a to 58d of the holding devices 11a to 11d, respectively. Reference numeral 39 denotes a head portion, which is in non-contact with the unit reflection plate 31.
The clearance holes 46a to 46d are formed larger than the body portion 37 of the first screw stoppers 26a to 26d, and are configured so that the edges of the clearance holes 46a to 46d are separated from the outer peripheral side surface of the body portion 37 inserted through the clearance holes 46a to 46d by a predetermined distance at normal temperature (here, the temperature range of 20 ℃ ± 15 ℃ is set to be normal temperature) or room temperature (here, 300K), and are configured so as to be separated even when the reflector device 110 is at a temperature lower than a predetermined upper limit temperature. The upper limit temperature is, for example, 600 ℃.
Threads are formed on the inner peripheral surfaces of the second groove-side fixing holes 58a to 58d and the outer peripheral surface of the tip end portion 38, respectively, and the tip end portion 38 is inserted into the first holding-side fixing hole 60 and the second groove-side fixing holes 58a to 58d, and if the first screw stoppers 26a to 26d are rotated, the tip end portion 38 advances toward the bottom surfaces of the second groove-side fixing holes 58a to 58d while the tip end portion 38 and the second groove-side fixing holes 58a to 58d are screwed together.
Here, the diameter of the body portion 37 is formed larger than the diameter of the first holding-side fixing hole 60 and the diameter of the distal end portion 38, the distal end portion 38 travels toward the bottom surface of the second slot-side fixing holes 58a to 58d, and the end portion of the body portion 37 on the distal end portion 38 side is brought into contact with the slot-side connecting portion 63, and if the distal end portion 38 travels further, the slot-side connecting portion 63 is pressed against the attachment surface 19 of the vacuum slot 17 by the end portion of the body portion 37.
Therefore, the unit reflection plate 31 is fixed to the mounting surface 19 at the portion where the fixing device 21 is provided by the fixing screw stopper 27, and the portions where the holding devices 11a to 11d are provided are fixed to the mounting surface 19 by the first screw stoppers 26a to 26 d. As a result, the relative position between the position where the fixing device 21 is fixed to the mounting surface 19 and the position where the fixing device 21 is fixed to the unit reflection plate 31 is fixed by the fixing device 21.
< heating step >
The inside of the vacuum chamber 17 is evacuated by the evacuation device 78 to be a vacuum atmosphere, and after the substrate 87 is placed on the substrate placement device 85 while evacuating, if the heat source 88 is energized to generate heat and infrared rays are radiated, the radiated infrared rays are irradiated to the substrate 87 and the unit reflecting plate 31 of the reflector device 110, and the substrate 87 and the unit reflecting plate 31 are heated.
The fixing device 21 is located at the center of each unit reflecting plate 31, and the holding devices 11a to 11d fixed to one unit reflecting plate 31 are arranged on the circumference centering on the fixing device 21 fixed to the same unit reflecting plate 31.
The deformable portion 64 of each of the holding devices 11a to 11d has a flat plate shape, and the surface of each deformable portion 64 having a large area faces the fixing device 21.
Since infrared rays are irradiated to the unit reflecting plate 31 and the irradiation of infrared rays is shielded on the mounting surface 19 of the vacuum chamber 17, the temperature rise of the inner wall surface of the vacuum chamber 17 is small even if infrared rays are irradiated, but the temperature of the unit reflecting plate 31 rises more than the temperature of the mounting surface 19 of the vacuum chamber 17.
Therefore, the mounting surface 19 of the vacuum chamber 17 is not thermally stretched (also referred to as expansion), whereas the unit reflection plate 31 is thermally stretched. In this case, since the portion to which the fixing device 21 is attached is fixed to the mounting surface 19, the unit reflection plate 31 is thermally extended in the radial direction around the portion to which the fixing device 21 is fixed.
The groove-side connecting portions 63 of the holding devices 11a to 11d are not moved because they are fixed to the mounting surface 19 by the first screw stoppers 26a to 26d, but the plate-side connecting portions 62 move in accordance with thermal expansion of the unit reflection plates 31. Therefore, a force in the radial direction is applied to the deformable portion 64 from the plate-side connecting portion 62.
The holding devices 11a to 11d (and the holding devices 12, 13a, 13b, 14a to 14c, 15a to 15d, and 16a to 16d described later) are arranged such that the force applied to the deformable portion 64 is in a direction perpendicular to the plane having a large area of the rectangular deformable portion 64, and the plate-side connecting portion 62 moves relative to the groove-side connecting portion 63 in one of the holding devices 11a to 11d (and the holding devices 12, 13a, 13b, 14a to 14c, 15a to 15d, and 16a to 16d described later) in accordance with the deformation of the deformable portion 64.
At this time, since the gaps are formed between the edges of the clearance holes 46a to 46d and the outer peripheral side surface of the body portion 37 of the first screw stoppers 26a to 26d, and the state of non-contact is maintained, the edges of the clearance holes 46a to 46d and the outer peripheral side surface of the body portion 37 do not contact each other as long as the temperature of the unit reflection plate 31 is equal to or lower than the predetermined temperature when the unit reflection plate 31 is heated and thermally elongated in accordance with the deformation of the deformation portion 64.
Therefore, the relative positional relationship between the position where the holding devices 11a to 11d are fixed to the mounting surface 19 and the position where the holding devices 11a to 11d are fixed to the unit reflecting plate 31 is changed by the deformation of the deforming portion 64 due to the thermal expansion of the unit reflecting plate 31, and as a result, the fixing device 21 moves in the radial direction centering on the portion fixed to the unit reflecting plate 31.
As described above, in one of the holding devices 11a to 11d, the plate-side connecting portion 62 fixed to the unit reflection plate 31 moves relative to the groove-side connecting portion 63 fixed to the attachment surface 19 in accordance with the deformation of the deformation portion 64, and the force applied to the plate-side connecting portion 62 and the groove-side connecting portion 63 is relaxed, so that the holding devices 11a to 11d are not broken.
When the temperature of the heated unit reflecting plate 31 decreases, the unit reflecting plate 31 thermally expanded contracts, the deformation portion 64 is deformed to return to the original shape, and in one unit reflecting plate 31 of each of the holding devices 11a to 11d, the plate-side connecting portion 62 moves in the center direction of the unit reflecting plate 31 with respect to the groove-side connecting portion 63, and the relative positional relationship between the plate-side connecting portion 62 and the groove-side connecting portion 63 returns to the state before heating.
The side surface of the adjacent unit reflection plate 31 and the side surface of the unit reflection plate 31 may be separated from each other at normal temperature and may be configured to approach each other by thermal expansion.
When the substrate 87 is heated to a predetermined temperature, the substrate 87 is moved from the vacuum chamber 17 to a processing chamber of another vacuum processing apparatus.
In the reflector device 110 described above, the fixing device 21 is fixed by welding to the center of one unit reflecting plate 31, and the four holding devices 11a to 11d are arranged at positions around the fixing device 21 located at the center of the unit reflecting plate 31, but as shown in fig. 7, the reflector device 410 in which the fixing device 24 is located at the center of the unit reflecting plate 34 of the plurality of unit reflecting devices 411 to 413, 421 to 423, 431 to 433 arranged in a row and the three holding devices 14a to 14c are located around the fixing device 24 is also included in the present invention.
The reflector apparatus 310 is also included in the present invention, in which the fixing means 23 is located at one end in the longitudinal direction of the unit reflecting plate 33 of the plurality of unit reflecting means 311 to 313, 321 to 323, and 331 to 333 arranged in a row as shown in FIG. 6, and the two holding means 13a and 13b are located at the other end.
The reflector device 210 is also included in the present invention in which the fixing device 23 is located at one end in the longitudinal direction of the unit reflecting plate 32 of the plurality of unit reflecting devices 211 to 213, 221 to 223, 231 to 233 arranged in a row as shown in FIG. 5, and one holding device 12 is located at the other end.
The fixing devices 22, 23, and 24 of the reflector devices 210, 310, and 410 of fig. 5 to 7 have the same structure as the fixing device 21 described in fig. 3, and one end thereof is welded and fixed to the unit reflection plates 32, 33, and 34.
The holding devices 12, 13a, 13b, and 14a to 14c of the reflector devices 210, 310, and 410 of fig. 5 to 7 have the same structure as the holding devices 11a to 11d of fig. 4, the plate-side connecting portions 62 are fixed by welding to the unit reflection plates 32, 33, and 34, respectively, and the rectangular deformation portions 64 are arranged so as to face the fixing devices 22, 23, and 24 on the side having a large area. Similarly, the edges of the clearance holes 46a to 46d are spaced apart from the outer peripheral side surfaces of the body portions 37 of the first screw stoppers 26a to 26d disposed in the clearance holes 46a to 46d by a predetermined distance, and the plate-side connecting portions 62 are configured to be movable by thermal expansion by the distance of the distance when the unit reflection plates 32 to 34 are heated and thermally expanded.
In addition, it was confirmed that: when a single unit reflecting plate is fixed to the inner wall surface of the vacuum chamber by only one fixing means without providing a holding means, it is not preferable that the unit reflecting plate is heated, the vicinity of the edge of the unit reflecting plate is sagged, and the edge of the unit reflecting plate is brought into contact with the heating source 88.
In the reflector devices 110, 210, 310, 410 described above, the fixing devices 21 to 24 and the holding devices 11a to 11d, 12, 13a, 13b, 14a to 14c are welded and fixed to the unit reflection plates 31 to 34 side, and the vacuum groove 17 is screwed and fixed to the mounting surface 19 side.
Fig. 8 (a), 8 (b), 9 (a), and 9 (b) show unit reflecting devices 151 and 152 different from the unit reflecting device 122 of fig. 3 (a) and 3 (b), and the unit reflecting devices 151 and 152 are arranged in rows and columns, respectively, and are attached to the vacuum chamber 17 to constitute a reflector device.
Fig. 8 (a) and 9 (a) show a state where the unit reflection devices 151 and 152 are separated from the mounting surface 19 of the vacuum chamber 17, respectively, and fig. 8 (b) and 9 (b) show a state where the unit reflection devices 151 and 152 are mounted on the mounting surface 19, respectively.
In the unit reflection device 151 of fig. 8 (a) and 8 (b), both ends of the fixing device 54 and both ends of the holding devices 15a to 15d (the holding devices 15c and 15d and second plate-side fixing holes 48c and 48d and second groove-side fixing holes 58c and 58d described below are not welded and fixed to the mounting surface 19 and the unit reflection plate 35).
Fig. 10 (a) to 10 (e) show holding devices 15a to 15d used in fig. 8 (a) and 8 (b).
The left holder 15a in fig. 8 (a) and 8 (b) is shown in cross section, and the right holder 15b is shown in an oblique side. The same applies to fig. 9 (a) and 9 (b) described later.
The holding devices 15a to 15d are positioned between the unit reflection plate 35 and the mounting surface 19, and include a plate-side connecting portion 62 on the unit reflection plate 35 side, a groove-side connecting portion 63 on the mounting surface 19 side, and a deformation portion 64 having one end fixed to the plate-side connecting portion 62 and the other end fixed to the groove-side connecting portion 63.
The plate-side connection portion 62 and the unit reflection plate 35 are not fixed by welding, the second holding-side fixing hole 61 is formed in the plate-side connection portion 62, and the second plate-side fixing holes 48a to 48d are formed in the unit reflection plate 35.
The fixing device 54, the holding devices 15a to 15d, and the unit reflection plate 35 are arranged in the vacuum tank 17 such that the first groove-side fixing hole 57, the insertion hole 53, and the first plate-side fixing hole 47 communicate with each other, the second groove-side fixing holes 58a to 58d, the first holding-side fixing hole 60, and the clearance holes 46a to 46d communicate with each other, the second holding-side fixing hole 61, and the second plate-side fixing holes 48a to 48d communicate with each other, the fixing screw stopper 27 is inserted from the first plate-side fixing hole 47 side to the first plate-side fixing hole 47, the insertion hole 53, and the first groove-side fixing hole 57, the tip portions 38 of the first screw stoppers 26a to 26d (devices with reference numerals c and d not shown) are inserted from the clearance holes 46a to 46d side to the first holding-side fixing hole 60, and the second groove-side fixing holes 58a to 58d, and the second screw stoppers 28a to 28d (devices with reference numerals c and d) are inserted from the clearance holes 46a to 46d side, d is not shown), the body portion 77 is inserted through the second plate-side fixing holes 48a to 48d and the second holding-side fixing hole 61 from the second plate-side fixing holes 48a to 48d, the center of the unit reflection plate 35 is screwed and fixed to the attachment surface 19 via the fixing device 54 by the fixing device 54, the groove-side connecting portion 63 is screwed and fixed to the attachment surface 19 by the first screw stoppers 26a to 26d, and the plate-side connecting portion 62 is screwed and fixed to the unit reflection plate 35 by the second screw stoppers 28a to 28 d. The fixing device 54 and the unit reflection plate 35 are sandwiched between the mounting surface 19 and the head portion 67, and the unit reflection plate 35 is sandwiched between the plate-side connecting portion 62 and the head portion 76.
In the unit reflection device 122 of fig. 3 (a) and 3 (b), the board-side connection portions 62 of the holding devices 11a to 11d are welded and fixed to the unit reflection plate 31, and the groove-side connection portions 63 are screw-fixed, but in the unit reflection device 152 of fig. 9 (a) and 9 (b), the board-side connection portions 62 of the holding devices 16a to 16d (devices with reference numerals c and d are not shown) are screw-fixed and fixed to the unit reflection plate 36 by the second screw-fixing devices 28a to 28d (devices with reference numerals 28c and 28d are not shown), and the groove-side connection portions 63 are welded and fixed to the mounting surface 19. The fixing device 55 is fixed to the mounting surface 19 on the side of the mounting surface 19 in a state where the fixing screw stopper 27 is inserted through the first plate-side fixing hole 47, the insertion hole 53, and the first groove-side fixing hole 57. The body portion 66 is screw-fixed to the first groove-side fixing hole 57. The body portions 77 of the second screw-stopper devices 28a to 28d are inserted through the second plate-side fixing holes 48a to 48d and the second holding-side fixing hole 61 from the second plate-side fixing holes 48a to 48d (the devices with reference numerals 48c and 48d are not shown), and the plate-side connecting portion 62 is screw-fixed to the unit reflection plate 36 by the second screw-stopper devices 28a to 28 d.
Fig. 11 (a) to 11 (e) show holding devices 16a to 16 d.
In the unit reflecting device 152, the fixing device 55 and the unit reflecting plate 36 may be welded and fixed, and the fixing device 55 and the mounting surface 19 may be screwed and fixed, in the same manner as the fixing device 21 in fig. 3 (a) and 3 (b). The mounting surface 19 and the unit reflection plate 36 may be fixed by screw-fastening via a fixing device 55.
The deformation portion 64 is a plate spring, but any type of holding device 11a to 11d, 12, 13a, 13b, 14a to 14c, 15a to 15d, and 16a to 16d may be a spring such as a coil spring instead of the plate spring.
Description of the reference numerals
2 … … vacuum heating device
11a to 11d, 12, 13a, 13b, 14a to 14c, 15a to 15d, 16a to 16d … … holding device
17 … … vacuum tank
19 … … mounting surface
21 ~ 24, 54, 55 … … fixing device
26 a-26 d … … first thread stop device
28 a-28 d … … second thread stop device
31-36 … … unit reflection plate
46 a-46 d … … clearance holes
64 … … deformation
87 … … heating object
88 … … heating source
110. 210, 310, 410 … … reflector means.
Claims (16)
1. A vacuum heating apparatus, comprising:
a vacuum tank which is evacuated;
a heating source which is disposed inside the vacuum chamber and radiates infrared rays to heat a heating object; and
a reflector device which is arranged inside the vacuum chamber and has a plurality of unit reflecting plates for shielding infrared rays emitted from the heating source and directed to a mounting surface on an inner wall surface of the vacuum chamber;
the unit reflection plates are arranged along the mounting surface,
it is characterized in that the preparation method is characterized in that,
the reflector device comprises:
a plurality of fixing devices, one end of which is fixed on the installation surface of the vacuum tank, and the other end of which is fixed on the unit reflecting plate; and
a plurality of holding devices, one end of each of which is fixed to the mounting surface of the vacuum chamber and the other end of each of which is fixed to the unit reflecting plate;
the relative position between the place where the fixing device is fixed to the installation surface and the place where the fixing device is fixed to the unit reflection plate is fixed by the fixing device,
the holding device has a deformable portion, and the relative positional relationship between the position where the holding device is fixed to the mounting surface and the position where the holding device is fixed to the unit reflection plate is changed by deformation of the deformable portion.
2. The vacuum heating apparatus according to claim 1,
when the unit reflecting plate is heated and thermally elongated, the deformation portion is deformed, and the relative positional relationship between the position where the holding device is fixed to the mounting surface and the position where the holding device is fixed to the unit reflecting plate is changed.
3. The vacuum heating apparatus according to claim 2,
the deformation portion is a plate spring disposed in a direction in which a force in a direction perpendicular to a surface of the plate spring is applied by thermal expansion of the unit reflection plate.
4. The vacuum heating apparatus according to claim 1,
the unit reflecting plate is provided with a clearance hole, the holding device is screwed and fixed on the mounting surface by a first screw locking device inserted into the clearance hole,
the edge of the clearance hole and the first screw stopper are configured so as to be in non-contact with each other in a temperature range in which the unit reflecting plate is at least room temperature and at a temperature lower than an upper limit temperature, even if the unit reflecting plate is thermally extended along the mounting surface.
5. The vacuum heating apparatus according to claim 4,
the fixing means and the holding means are welded and fixed to the unit reflection plate.
6. The vacuum heating apparatus according to claim 4,
the fixing device is welded and fixed on the unit reflecting plate,
the holding device is screwed and fixed to the unit reflecting plate by a second screw stopper.
7. The vacuum heating apparatus according to claim 1,
the fixing device fixed to one unit reflecting plate is disposed between the holding device fixed to the same unit reflecting plate and the holding device.
8. The vacuum heating apparatus according to claim 1,
the plurality of holding means fixed to the same unit reflecting plate are arranged centering on the fixing means fixed to one unit reflecting plate.
9. A reflector device, characterized in that,
comprising:
a plurality of unit reflecting plates which are arranged along a mounting surface on an inner wall surface of the vacuum chamber in the vacuum chamber and which shield infrared rays emitted from a heating source and directed toward the mounting surface;
a plurality of fixing devices, one end of which is fixed on the installation surface of the vacuum tank, and the other end of which is fixed on the unit reflecting plate; and
a plurality of holding devices, one end of each of which is fixed to the mounting surface of the vacuum chamber and the other end of each of which is fixed to the unit reflecting plate;
the relative position between the place where the fixing device is fixed to the installation surface and the place where the fixing device is fixed to the unit reflection plate is fixed by the fixing device,
the holding device has a deformable portion capable of deforming,
the relative positional relationship between the position where the holding device is fixed to the mounting surface and the position where the holding device is fixed to the unit reflecting plate is changed by the deformation of the deformation portion.
10. The reflector device of claim 9,
when the unit reflecting plate is heated and thermally elongated, the deformation portion is deformed, and the relative positional relationship between the position where the holding device is fixed to the mounting surface and the position where the holding device is fixed to the unit reflecting plate is changed.
11. The reflector apparatus of claim 10,
the deformation portion is a plate spring disposed in a direction in which a force in a direction perpendicular to a surface of the plate spring is applied by thermal expansion of the unit reflection plate.
12. The reflector device of claim 9,
the unit reflecting plate is provided with a clearance hole, the holding device is screwed and fixed on the mounting surface by a first screw locking device inserted into the clearance hole,
the edge of the clearance hole and the first screw stopper are configured so as to be in non-contact with each other in a temperature range in which the unit reflecting plate is at least room temperature and at a temperature lower than an upper limit temperature, even if the unit reflecting plate is thermally extended along the mounting surface.
13. The reflector apparatus of claim 12,
the fixing means and the holding means are welded and fixed to the unit reflection plate.
14. The reflector apparatus of claim 12,
the fixing device is welded and fixed on the unit reflecting plate,
the holding device is screwed and fixed to the unit reflecting plate by a second screw stopper.
15. The reflector device of claim 9,
the fixing device fixed to one unit reflecting plate is disposed between the holding device fixed to the same unit reflecting plate and the holding device.
16. The reflector device of claim 9,
the plurality of holding means fixed to the same unit reflecting plate are arranged centering on the fixing means fixed to one unit reflecting plate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-213953 | 2018-11-14 | ||
| JP2018213953 | 2018-11-14 | ||
| PCT/JP2019/033320 WO2020100376A1 (en) | 2018-11-14 | 2019-08-26 | Vacuum heating device and reflector device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112041627A true CN112041627A (en) | 2020-12-04 |
| CN112041627B CN112041627B (en) | 2022-07-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980029651.4A Active CN112041627B (en) | 2018-11-14 | 2019-08-26 | Vacuum heating device and reflector device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7044900B2 (en) |
| KR (1) | KR102476865B1 (en) |
| CN (1) | CN112041627B (en) |
| TW (1) | TWI749366B (en) |
| WO (1) | WO2020100376A1 (en) |
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| US20050029243A1 (en) * | 2003-08-07 | 2005-02-10 | Canon Kabushiki Kaisha | Method of effecting heating and cooling in reduced pressure atmosphere |
| JP2007093157A (en) * | 2005-09-30 | 2007-04-12 | Matsushita Environment Airconditioning Eng Co Ltd | High temperature treatment device |
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| CN106463344A (en) * | 2014-05-16 | 2017-02-22 | 应用材料公司 | Showerhead design |
| CN108695194A (en) * | 2017-03-29 | 2018-10-23 | 东京应化工业株式会社 | Substrate heating equipment, base plate processing system and substrate heating method |
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| JPS58164222A (en) * | 1982-03-25 | 1983-09-29 | Matsushita Electric Ind Co Ltd | Heat treatment device |
| JP3155844B2 (en) * | 1992-10-20 | 2001-04-16 | 日本真空技術株式会社 | High frequency electrode of vacuum processing equipment |
| JP3682340B2 (en) | 1996-06-28 | 2005-08-10 | リンナイ株式会社 | Heat shield plate |
| KR101895398B1 (en) | 2011-04-28 | 2018-10-25 | 삼성전자 주식회사 | Method of forming an oxide layer and a method of fabricating a semiconductor device comprising the same |
| CN104284776B (en) * | 2012-05-14 | 2016-01-06 | 柯尼卡美能达株式会社 | The manufacture method of gas barrier film, gas barrier film and electronic equipment |
| JP6639985B2 (en) * | 2016-03-28 | 2020-02-05 | 日本碍子株式会社 | Firing furnace |
| JP6789040B2 (en) * | 2016-08-30 | 2020-11-25 | 東京応化工業株式会社 | Substrate heating device and substrate heating method |
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2019
- 2019-08-26 KR KR1020207031982A patent/KR102476865B1/en active IP Right Grant
- 2019-08-26 CN CN201980029651.4A patent/CN112041627B/en active Active
- 2019-08-26 JP JP2020556616A patent/JP7044900B2/en active Active
- 2019-08-26 WO PCT/JP2019/033320 patent/WO2020100376A1/en active Application Filing
- 2019-09-09 TW TW108132424A patent/TWI749366B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050029243A1 (en) * | 2003-08-07 | 2005-02-10 | Canon Kabushiki Kaisha | Method of effecting heating and cooling in reduced pressure atmosphere |
| JP2007093157A (en) * | 2005-09-30 | 2007-04-12 | Matsushita Environment Airconditioning Eng Co Ltd | High temperature treatment device |
| CN104779179A (en) * | 2014-01-13 | 2015-07-15 | 马悦 | Apparatus for carrying out heat treatment on semiconductor device substrates |
| CN106463344A (en) * | 2014-05-16 | 2017-02-22 | 应用材料公司 | Showerhead design |
| CN108695194A (en) * | 2017-03-29 | 2018-10-23 | 东京应化工业株式会社 | Substrate heating equipment, base plate processing system and substrate heating method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020100376A1 (en) | 2020-05-22 |
| TWI749366B (en) | 2021-12-11 |
| TW202018237A (en) | 2020-05-16 |
| JPWO2020100376A1 (en) | 2021-06-10 |
| JP7044900B2 (en) | 2022-03-30 |
| KR20200139792A (en) | 2020-12-14 |
| CN112041627B (en) | 2022-07-05 |
| KR102476865B1 (en) | 2022-12-12 |
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