JP7041674B2 - 安定化された薄く広がった金属導電性フィルム、および安定化化合物の供給のための溶液 - Google Patents

安定化された薄く広がった金属導電性フィルム、および安定化化合物の供給のための溶液 Download PDF

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JP7041674B2
JP7041674B2 JP2019520156A JP2019520156A JP7041674B2 JP 7041674 B2 JP7041674 B2 JP 7041674B2 JP 2019520156 A JP2019520156 A JP 2019520156A JP 2019520156 A JP2019520156 A JP 2019520156A JP 7041674 B2 JP7041674 B2 JP 7041674B2
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vanadium
metal
weight
thinly spread
conductive layer
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JP2019537820A5 (https=
JP2019537820A (ja
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ヤン・シーチアン
ホゥ・ヨンシン
アジャイ・ビーカー
アーサー・ユン－チー・チェン
ファラズ・アザディ・マンズール
イン－シイ・リ
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C3Nano Inc
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/002—Priming paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Chemically Coating (AREA)
  • Conductive Materials (AREA)
JP2019520156A 2016-10-14 2017-10-11 安定化された薄く広がった金属導電性フィルム、および安定化化合物の供給のための溶液 Active JP7041674B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022007355A JP7330310B2 (ja) 2016-10-14 2022-01-20 安定化された薄く広がった金属導電性フィルム、および安定化化合物の供給のための溶液

Applications Claiming Priority (5)

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US201662408371P 2016-10-14 2016-10-14
US62/408,371 2016-10-14
US201662427348P 2016-11-29 2016-11-29
US62/427,348 2016-11-29
PCT/US2017/056134 WO2018071538A1 (en) 2016-10-14 2017-10-11 Stabilized sparse metal conductive films and solutions for delivery of stabilizing compounds

Related Child Applications (1)

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JP2022007355A Division JP7330310B2 (ja) 2016-10-14 2022-01-20 安定化された薄く広がった金属導電性フィルム、および安定化化合物の供給のための溶液

Publications (3)

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JP2019537820A JP2019537820A (ja) 2019-12-26
JP2019537820A5 JP2019537820A5 (https=) 2020-11-19
JP7041674B2 true JP7041674B2 (ja) 2022-03-24

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JP2022007355A Active JP7330310B2 (ja) 2016-10-14 2022-01-20 安定化された薄く広がった金属導電性フィルム、および安定化化合物の供給のための溶液

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US (2) US11773275B2 (https=)
EP (1) EP3526801B1 (https=)
JP (2) JP7041674B2 (https=)
KR (1) KR102502830B1 (https=)
CN (2) CN109804439B (https=)
TW (1) TWI755431B (https=)
WO (1) WO2018071538A1 (https=)

Families Citing this family (12)

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US10714230B2 (en) 2017-12-06 2020-07-14 C3Nano Inc. Thin and uniform silver nanowires, method of synthesis and transparent conductive films formed from the nanowires
US11910525B2 (en) * 2019-01-28 2024-02-20 C3 Nano, Inc. Thin flexible structures with surfaces with transparent conductive films and processes for forming the structures
WO2020179354A1 (ja) * 2019-03-01 2020-09-10 星光Pmc株式会社 銀ナノワイヤの製造方法
US11842828B2 (en) * 2019-11-18 2023-12-12 C3 Nano, Inc. Coatings and processing of transparent conductive films for stabilization of sparse metal conductive layers
CN113778251A (zh) * 2020-06-10 2021-12-10 天材创新材料科技(厦门)有限公司 透明导电层迭结构及触控面板
WO2021256048A1 (ja) * 2020-06-17 2021-12-23 星光Pmc株式会社 銀ナノワイヤ分散液、銀ナノワイヤ含有導電体および銀ナノワイヤ含有導電性積層体
CN114250013A (zh) * 2020-09-22 2022-03-29 宸鸿科技(厦门)有限公司 可喷涂导电油墨与导电元件
FR3119172A1 (fr) * 2021-01-28 2022-07-29 Swissto12 Sa Composition stable pour dépôt catalytique d’argent
WO2023249997A1 (en) * 2022-06-22 2023-12-28 C3 Nano, Inc. Formation of electrically conductive layers at room temperature using silver nanoparticulate processing and inks for forming the layers
CN116179075B (zh) * 2023-03-08 2023-10-13 中国地质大学（北京） 一种poss改性聚酰亚胺绝缘漆、制备方法及应用
TWI894849B (zh) * 2024-03-07 2025-08-21 國立雲林科技大學 用於亞硝酸鹽檢測的感測器
CN118919128B (zh) * 2024-07-30 2025-09-09 四川大学 一种具有高稳定性的金属纳米线透明导电膜及电子装置

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