JP7041477B2 - 導電性ボール及び電子装置とそれらの製造方法 - Google Patents

導電性ボール及び電子装置とそれらの製造方法 Download PDF

Info

Publication number
JP7041477B2
JP7041477B2 JP2017131925A JP2017131925A JP7041477B2 JP 7041477 B2 JP7041477 B2 JP 7041477B2 JP 2017131925 A JP2017131925 A JP 2017131925A JP 2017131925 A JP2017131925 A JP 2017131925A JP 7041477 B2 JP7041477 B2 JP 7041477B2
Authority
JP
Japan
Prior art keywords
layer
solder
ball
tin
connection pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017131925A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019013944A5 (enExample
JP2019013944A (ja
Inventor
啓 村山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2017131925A priority Critical patent/JP7041477B2/ja
Priority to US16/023,483 priority patent/US10446512B2/en
Publication of JP2019013944A publication Critical patent/JP2019013944A/ja
Publication of JP2019013944A5 publication Critical patent/JP2019013944A5/ja
Application granted granted Critical
Publication of JP7041477B2 publication Critical patent/JP7041477B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H10W70/65—
    • H10W70/66—
    • H10W70/685—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H10W70/635—
    • H10W72/012—
    • H10W72/01204—
    • H10W72/01212—
    • H10W72/01235—
    • H10W72/01935—
    • H10W72/07236—
    • H10W72/07255—
    • H10W72/223—
    • H10W72/251—
    • H10W72/252—
    • H10W72/2528—
    • H10W72/255—
    • H10W72/29—
    • H10W72/90—
    • H10W72/923—
    • H10W72/9415—
    • H10W72/942—
    • H10W72/952—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2017131925A 2017-07-05 2017-07-05 導電性ボール及び電子装置とそれらの製造方法 Active JP7041477B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017131925A JP7041477B2 (ja) 2017-07-05 2017-07-05 導電性ボール及び電子装置とそれらの製造方法
US16/023,483 US10446512B2 (en) 2017-07-05 2018-06-29 Conductive ball and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017131925A JP7041477B2 (ja) 2017-07-05 2017-07-05 導電性ボール及び電子装置とそれらの製造方法

Publications (3)

Publication Number Publication Date
JP2019013944A JP2019013944A (ja) 2019-01-31
JP2019013944A5 JP2019013944A5 (enExample) 2020-04-09
JP7041477B2 true JP7041477B2 (ja) 2022-03-24

Family

ID=64903850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017131925A Active JP7041477B2 (ja) 2017-07-05 2017-07-05 導電性ボール及び電子装置とそれらの製造方法

Country Status (2)

Country Link
US (1) US10446512B2 (enExample)
JP (1) JP7041477B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10388627B1 (en) * 2018-07-23 2019-08-20 Mikro Mesa Technology Co., Ltd. Micro-bonding structure and method of forming the same
US10347602B1 (en) * 2018-07-23 2019-07-09 Mikro Mesa Technology Co., Ltd. Micro-bonding structure
CN113574657B (zh) * 2019-03-25 2025-04-08 三菱电机株式会社 印刷布线板以及电子设备
KR102408109B1 (ko) * 2020-10-07 2022-06-10 성균관대학교산학협력단 전기화학적 마이그레이션 방지를 위해 솔더를 무전해 팔라듐 및 니켈 도금 방법
TWI849757B (zh) * 2023-02-18 2024-07-21 矽品精密工業股份有限公司 電子封裝件及其封裝基板與製法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007075856A (ja) 2005-09-14 2007-03-29 Nippon Steel Materials Co Ltd Ｃｕコアボール
JP2010099736A (ja) 2008-09-25 2010-05-06 Hitachi Metals Ltd 耐落下衝撃特性に優れた接続端子用ボールおよび接続端子ならびに電子部品
JP2014042941A (ja) 2012-08-01 2014-03-13 Mitsubishi Materials Corp ハンダペースト
JP2016106033A (ja) 2007-10-19 2016-06-16 株式会社日本スペリア社 はんだ継手

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001319994A (ja) * 2000-02-29 2001-11-16 Allied Material Corp 半導体パッケージとその製造方法
TWI224837B (en) * 2003-07-10 2004-12-01 Advanced Semiconductor Eng Ball grid array package substrate and method for manufacturing the same
US10322472B2 (en) * 2013-11-05 2019-06-18 Senju Metal Industry Co., Ltd. Cu core ball, solder paste, formed solder, Cu core column, and solder joint
JP7014535B2 (ja) * 2017-07-07 2022-02-01 新光電気工業株式会社 導電性ボール及び電子装置とそれらの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007075856A (ja) 2005-09-14 2007-03-29 Nippon Steel Materials Co Ltd Ｃｕコアボール
JP2016106033A (ja) 2007-10-19 2016-06-16 株式会社日本スペリア社 はんだ継手
JP2010099736A (ja) 2008-09-25 2010-05-06 Hitachi Metals Ltd 耐落下衝撃特性に優れた接続端子用ボールおよび接続端子ならびに電子部品
JP2014042941A (ja) 2012-08-01 2014-03-13 Mitsubishi Materials Corp ハンダペースト

Also Published As

Publication number Publication date
US10446512B2 (en) 2019-10-15
US20190013285A1 (en) 2019-01-10
JP2019013944A (ja) 2019-01-31

Similar Documents

Publication Publication Date Title
JP7041477B2 (ja) 導電性ボール及び電子装置とそれらの製造方法
JP7014535B2 (ja) 導電性ボール及び電子装置とそれらの製造方法
JP6667765B2 (ja) 電極接続方法及び電極接続構造
TWI571191B (zh) 在無核心基體處理中之電解沉積及通孔充填技術
JP5808403B2 (ja) はんだ堆積物を基板上に形成する方法
US9129884B2 (en) Solder bump joining structure with low resistance joining member
JP2010109032A (ja) 半導体装置の製造方法
TW201436150A (zh) 先進裝置組合結構及方法
US20130043573A1 (en) Solder Bump Bonding In Semiconductor Package Using Solder Balls Having High-Temperature Cores
KR20100102033A (ko) 전자 디바이스 및 납땜 방법
JP2008004924A (ja) パッケージ基板製造方法
JP2009239278A (ja) 電子部品搭載用基板、及び、その製造方法
TWI343112B (en) Package substrate having electrical connection structure and method for fabricating the same
US20150334828A1 (en) Wiring substrate and method for manufacturing same
JP2020087967A (ja) プリント配線板およびその製造方法
JPWO2012073417A1 (ja) 電子部品実装体、電子部品、基板
US6306751B1 (en) Apparatus and method for improving ball joints in semiconductor packages
CN101425489A (zh) 微电子封装中焊料凸点连接金属化层及应用
US10117329B2 (en) Carrier plate, device having the carrier plate and method for producing a carrier plate
TW201505492A (zh) 印刷電路板及其製造方法
CN104392941B (zh) 形成倒装芯片半导体封装的方法
TWI407538B (zh) 封裝基板及其製法
TW545098B (en) Fine pad pitch organic circuit board with plating solder and method for fabricating the same
JP2013077726A (ja) 半導体パッケージの製造方法
TWI313911B (en) Conductive structure of package substrate and manufacturing method thereof

Legal Events

Date Code Title Description
RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20180320

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200227

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200227

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210224

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210309

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210427

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210831

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211019

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220301

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220311

R150 Certificate of patent or registration of utility model

Ref document number: 7041477

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150